1、BRITISH STANDARDBS EN 61760-1:2006Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs)The European Standard EN 61760-1:2006 has the status of a British StandardICS 31.240g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40
2、g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61760-1:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee on 29 September 2006 BSI 2006ISBN 0 580 49213 3Nat
3、ional forewordThis British Standard was published by BSI. It is the UK implementation of EN 61760-1:2006. It is identical with IEC 61760-1:2006. It supersedes BS EN 61760-1:1999 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assemb
4、ly technology. A list of organizations represented on EPL/501 can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immuni
5、ty from legal obligations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61760-1 NORME EUROPENNE EUROPISCHE NORM July 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotech
6、nische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61760-1:2006 E ICS 31.240 Supersedes EN 61760-1:1998English version Surface mounting technology Part 1:
7、 Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006) Technique du montage en surface Partie 1: Mthode de normalisation pour la spcification des composants monts en surface (CMS) (CEI 61760-1:2006) Oberflchenmontagetechnik Teil 1: Genormtes Verfahren zur Spe
8、zifizierung oberflchenmontierbarer Bauelemente (SMDs) (IEC 61760-1:2006) This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a nation
9、al standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in
10、any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic
11、, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/577/FDIS, future e
12、dition 2 of IEC 61760-1, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61760-1 on 2006-06-01. This European Standard supersedes EN 61760-1:1998. The main changes with regard to EN 61760-1:1998 concern: - requi
13、rements related to leadfree soldering; - extension of the scope to include also components mounted by gluing; - direct reference to EN 60068-2-58 for requirements on solderability and resistance to soldering heat; - classification into categories based on the components ability to withstand resistan
14、ce to soldering heat has been deleted. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-03-01 latest date by which the national standards conflicting with the EN have to b
15、e withdrawn (dow) 2009-06-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61760-1:2006 was approved by CENELEC as a European Standard without any modification. _ EN 61760-1:2006 2 CONTENTS 1 1.1 1.2 2 3 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 5.
16、1 5.2 5.3 5.4 5.5 6 6.1 6.2 7 Requirements for components and component specifications related to suitability 7.1 7.2 7.3 7.4 7.5 7.6 7.7 Figure 2 Vacuum pipette, pick-up area and component compartment: EN 61760-1:2006Annex ZA (normative) Normative references to international publications with their
17、 corresponding European publications.30INTRODUCTION.5 Scope and object6 Scope6 Object .6 Normative references6 Terms and definitions .7 Component marking 10 Requirements for component design and component specifications.9 General requirement9 Packaging .9 Labelling of product packaging.9 Storage and
18、 transportation.11 Component outline and design.11 Mechanical stress15 Component reliability assurance 15 Additional requirements for compatibility with lead-free soldering .15 Specification of assembly process conditions 15 General .15 Securing the component on the substrate prior to soldering17 Mo
19、unting methods .18 Cleaning (where applicable).19 Removal and/or replacement of SMDs .20 Typical process conditions 21 Soldering processes, temperature/time profiles21 Typical cleaning conditions for assemblies.25 with various mounting processes.26 General .26 Wettability .26 Resistance to dissoluti
20、on of metallization .26 Resistance to soldering heat26 Resistance to cleaning solvent.27 Soldering profiles.27 Bonding strength test for the component glue interface test27 Bibliography29 Figure 1 Example of a component with marked specific orientation put in tape and tray10Example for a component w
21、ith a flat surface12 Figure 3 Coplanarity of terminals .12 3 Figure 11 SnPb Vapour phase soldering Temperature/time profile Figure 12 Lead-free SnAgCu Vapour phase soldering Temperature/time profile Figure 13 Infrared soldering, forced gas convection reflow soldering Figure 14 Infrared soldering, fo
22、rced gas convection reflow soldering Figure 15 Double wave soldering for SnPb and lead-free SnAgCu solder EN 61760-1:2006Figure 4 Stable seating of component.13 Figure 5 Unstable seating of component.13 Figure 6 Terminals arranged peripherally in two rows13 Figure 7 Good contrast to component body a
23、nd surroundings .13 Figure 8 Component weight/pipette suction strength .14 Figure 9 Process steps for soldering.16 Figure 10 Process steps for gluing17 (terminal temperature).21 (terminal temperature).22 Temperature/time profile for SnPb solders.23 Temperature/time profile for lead-free SnAgCu solde
24、rs24 Temperature/time profile (terminal temperature)25 Table 1 Basic cleaning processes.25 4 INTRODUCTION Specifications for electronic components have in the past been formulated for each component family. The regulations for environmental tests have been selected from IEC 60068 and other IEC and I
25、SO publications. The overriding condition for this procedure was that all components, once installed in a piece of equipment, had to satisfy certain criteria. The introduction and increasing use of surface mounting components make it necessary to extend the existing requirements to include those ari
26、sing from processing during assembly. Irrespective of the component family involved, all components on one and the same side of a printed circuit board are exposed to the same mounting process (see flow charts in Clause 5). Nevertheless there exists no harmonized standard that prescribes the content
27、 of a component specification. It is the purpose of this standard to define the general requirements for component specifications derived from the assembly processes. This is done in three steps. In the first step general requirements for component specifications and component design related to the
28、handling and placement of the component on the substrate are given (Clause 4). In the second step the definition of reference process conditions as representative of a group of assembly conditions are given (Clauses 5 and 6). In the third step the additional requirements resulting from these referen
29、ce process conditions are given (Clause 7). Mixed technology boards, i.e. boards containing through-hole components and SMDs, require additional consideration with respect to the through-hole components. These may be subject to the same requirements as the SMDs. Persons responsible for drafting spec
30、ifications for “non-surface mounting components” wishing to include a statement on their ability to withstand surface mounting conditions should use the classifications and tests set out in the present standard. EN 61760-1:2006 5 SURFACE MOUNTING TECHNOLOGY Part 1: Standard method for the specificat
31、ion of surface mounting components (SMDs) 1 Scope and object 1.1 Scope This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technolo
32、gy. 1.2 Object The object of this standard is to ensure that a wide variety of SMDs (passive and active) can be subjected to the same placement and mounting processes during assembly. This standard defines tests and requirements that need to be part of any SMD component general, sectional or detail
33、specification. In addition, this standard provides component users and manufacturers with a reference set of typical process conditions used in surface mount technology. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated refere
34、nces, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60062, Marking codes for resistors and capacitors IEC 60068 (all parts), Environmental testing IEC 60068-2-21, Environmental testing Part 2: Tests Test
35、U: Robustness of terminations and integral mounting devices IEC 60068-2-45:1980, Environmental testing Part 2: Tests Test XA and guidance: Immersion in cleaning solvents Amendment 1 (1993) IEC 60068-2-58, Environmental testing Part 2: Tests Test Td: Test methods for solderability, resistance to diss
36、olution of metallization and to soldering heat of surface mounting devices (SMDs) IEC 60068-2-77, Environmental testing Part 2: Tests Test 77: Body strength and impact shock IEC 60191-6:2004, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline dra
37、wings of surface mounted semiconductor device packages IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 60286-3, Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes EN 61760-1:2006 6 IEC 60286-4, Packagin
38、g of components for automatic handling Part 4: Stick magazines for electronic components encapsulated in packages of form E and G IEC 60286-5, Packaging of components for automatic handling Part 5: Matrix trays IEC 60286-6, Packaging of components for automatic handling Part 6: Bulk case packaging f
39、or surface mounting components IEC 60749 (all parts), Semiconductor devices Mechanical and climatic test methods IEC 61340-5-1, Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IEC 61340-5-3, Electrostatics Protection of electronic devices f
40、rom electrostatic phenomena Test methods for packagings intended for electrostatic discharge sensitive devices IEC 61760-2, Surface mount technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) Application guide IEC 62090, Product package labels for electronic comp
41、onents using bar code and two dimensional symbologies ISO 8601, Data elements and interchange formats Information interchange Representation of dates and times 3 Terms and definitions For the purposes of this document, the following definitions apply, as do those of IEC 60194. NOTE Use of the term “
42、chip” as for a surface mounting component is deprecated. Only the terms “SMD“ or “surface mounting component“ should be used within IEC. 3.1 adhesive substance such as glue or cement used to bond objects together NOTE In surface mounting technology different gluing systems are used. Non conductive a
43、dhesive (only for mechanical connection) Electrical conductive adhesive (for electrical and mechanical connection) Thermal conductive adhesive (for thermal and mechanical connection) Combination of electrical and thermal conductive adhesive. Most used adhesives are thermal curing systems but there a
44、re also UV-curing systems in use. 3.2 centring force force required by the pick-up tooling to centre a surface mounting device in its proper location on a substrate 3.3 coplanarity distance in height between the lowest and highest leads when the component is in its seating plane EN 61760-1:2006 7 3.
45、4 dewetting condition that results when molten solder coats a surface and then recedes to leave irregularly-shaped mounds of solder that are separated by areas that are covered with a thin film of solder and with the basis metal not exposed 3.5 dissolution of metallization process of dissolving meta
46、l or a plated metal alloy, usually by introduction of chemicals. For the purpose of this document the dissolution of metallization also includes dissolution by exposure to molten solder 3.6 immersion attitude positioning of an object when immersed in a solder bath 3.7 lead-free component component w
47、here lead content in the materials is equal or less than 0,1 % by weight per material used 3.8 Montreal protocol agreement by industrialized nations, at a meeting held in Montreal, Canada, to eliminate chlorofluorocarbons from all processes by 1995 3.9 pick-up force dynamic force exerted on the body
48、 of a component generally from above and its seating plane during the pick-up of the component (e.g. from a tape or tray); the maximum level is normally taken into account 3.10 placement force dynamic force exerted on the component body generally from above and its seating plane NOTE This occurs dur
49、ing the period between the components first contact with the substrate (or the soldering paste or adhesive etc.) and its coming to rest. The maximum level is normally taken into account. 3.11 resistance to soldering heat ability of a component to withstand the effects of the heat generated by the soldering process 3.12 seating plane surface on which a component rests 3.13 solderability ability of a metal to be wetted by molten solder
