1、BRITISH STANDARDBS EN 61967-4:2002Incorporating amendment no. 1Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emissions 1 ohm/150 ohm direct coupling methodICS 31.200g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g
2、40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61967-4:2002This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the a
3、uthority of the Standards Policy and Strategy Committee on 19 August 2002 BSI 2008ISBN 978 0 580 60803 2National forewordThis British Standard is the UK implementation of EN 61967-4:2002, incorporating amendment A1:2006 and corrigendum December 2006. It is identical with IEC 61967-4:2002, incorporat
4、ing amendment 1:2006. The start and finish of text introduced or altered by amendment is indicated in the text by tags. Tags indicating changes to IEC text carry the number of the IEC amendment. For example, text altered by IEC amendment 1 is indicated by !“.The UK participation in its preparation w
5、as entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Com
6、pliance with a British Standard cannot confer immunity from legal obligations.Amendments issued since publicationAmd. No. Date Comments16328 31 May 2006 See national foreword31 January 2008 Implementation of CENELEC corrigendum December 2006 (addition of references to Annex ZA)EUROPEAN STANDARD EN 6
7、1967-4NORME EUROPENNEEUROPISCHE NORMJune 2002CENELECEuropean Committee for Electrotechnical StandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische NormungCentral Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC - All rights of exploitati
8、on in any form and by any means reserved worldwide for CENELEC members.ICS 31.200 Incorporating corrigendum December 2006English versionIntegrated circuits -Measurement of electromagnetic emissions, 150 kHz to 1 GHzPart 4: Measurement of conducted emissions -1 ohm/150 ohm direct coupling method(IEC
9、61967-4:2002)Circuits intgrs -Mesure des missions lectromagntiques,150 kHz 1 GHzPartie 4: Mesure des missions conduites -Mthode par couplage direct1 ohm/150 ohm(CEI 61967-4:2002 + A1:2006)Integrierte Schaltungen -Messung von elektromagnetischenAussendungen im Frequenzbereichvon 150 kHz bis 1 GHzTeil
10、 4: Messung der leitungsgefhrtenAussendungen -Messung mit direkter1 Ohm/150 Ohm-Kopplung(IEC 61967-4:2002 + A1:2006)Up-to-date lists and bibliographical references concerning such national standards may be obtained onapplication to the Central Secretariat or to any CENELEC member.This European Stand
11、ard exists in three official versions (English, French, German). A version in any otherlanguage made by translation under the responsibility of a CENELEC member into its own language andnotified to the Central Secretariat has the same status as the official versions.+A1February 2006This European Sta
12、ndard was approved by CENELEC on 2002-06-01. comply with the CEN/CENELEC Internal Standard the status of a national standard without any alteration.CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany
13、, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Ref. No. EN 61967-4:2002 ECENELEC members are bound to Regulations which stipulate the conditio
14、ns for giving this European ForewordThe text of document 47A/636/FDIS, future edition 1 of IEC 61967-4, prepared by SC 47A, Integratedcircuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote andwas approved by CENELEC as EN 61967-4 on 2002-06-01.The following dat
15、es were fixed: latest date by which the EN has to be implementedat national level by publication of an identicalnational standard or by endorsement (dop) 2003-03-01 latest date by which the national standards conflictingwith the EN have to be withdrawn (dow) 2005-06-01Annexes designated “normative“
16、are part of the body of the standard.Annexes designated “informative“ are given for information only.In this standard, annexes A and ZA are normative and annexes B, C, D and E are informative.Annex ZA has been added by CENELEC._Endorsement noticeThe text of the International Standard IEC 61967-4:200
17、2 was approved by CENELEC as a EuropeanStandard without any modification._Page 2EN 619674:2002Foreword to amendment A1The text of document 47A/735/FDIS, future amendment 1 to IEC 61967-4:2002, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENE
18、LEC parallel vote and was approved by CENELEC as amendment A1 to EN 61967-4:2002 on 2006-02-01. The following dates were fixed: latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2006-11-01 latest date b
19、y which the national standards conflicting with the amendment have to be withdrawn (dow) 2009-02-01 This European Standard makes reference to International Standards. Where the International Standard referred to has been endorsed as a European Standard or a home-grown European Standard exists, this
20、European Standard shall be applied instead. Pertinent information can be found on the CENELEC web site. _ Endorsement notice The text of amendment 1:2006 to the International Standard IEC 61967-4:2002 was approved by CENELEC as an amendment to the European Standard without any modification. _ CONTEN
21、TSPage 3EN 619674:20021 Scope 6 2 Normative references .6 3 Definitions6 4 General7 4.1 Measurement basics7 4.2 RF current measurement .9 4.3 RF voltage measurement at IC pins .9 4.4 Assessment of the measurement technique .9 5 Test conditions.10 6 Test equipment 10 6.1 Test receiver specification .
22、10 6.2 RF current probe specification .10 6.3 Test of the RF current probe capability 11 6.4 Matching network specification 11 7 Test set-up.11 7.1 General test configuration11 7.2 Printed circuit test board layout .12 8 Test procedure.13 9 Test report .13 Annex A (normative) Probe calibration proce
23、dure.14 Annex B (informative) Classification of conducted emission levels17 B.1 Introductory remark .17 B.2 General.17 B.3 Definition of emission levels 17 B.4 Presentation of results.18 Annex C (informative) Example of reference levels for automotive applications.21 C.1 Introductory remark .21 C.2
24、General.21 C.3 Reference levels .21 Annex D (informative) EMC requirements and how to use EMC IC measurement techniques.23 D.1 Introduction .23 D.2 Using EMC measurement procedures 23 D.3 Assessment of the IC influence to the EMC behaviour of the modules 24 Annex E (informative) Example of a test se
25、t-up consisting of an EMC main test board and an EME IC test board.25 E.1 The EMC main test board 25 E.2 EME IC test board .27 Annex F (informative) 150 direct coupling networks for common mode emission measurements of differential mode data transfer ICs and similar circuits 29 Annex ZA (normative)
26、Normative references to international publications with their corresponding European publications33 Page 4EN 619674:2002Figure 1 Example of two emitting loops returning to the IC via common ground 8 Figure 2 Example of IC with two ground pins, a small I/O loop and two emitting loops.8 Figure 3 Const
27、ruction of the RF current probe10 Figure 4 Impedance matching network corresponding with IEC 61000-4-6 .19 Figure 5 General test configuration 12 Figure A.1 Test circuit14 Figure A.2 Insertion loss of the 1 probe .14 Figure A.3 Layout of the calibration test circuit .15 Figure A.4 Connection of the
28、calibration test circuit16 Figure A-5 Minimum decoupling limit versus frequency.16 Figure B.1 Emission level scheme18 Figure B.2 Example of the maximum emission level G8f .19 Figure C.1 1 method Reference levels for conducted disturbances from semiconductors (peak detector) 22 Figure C.2 150 method
29、Reference levels for conducted disturbances from semiconductors (peak detector) 22 Figure E.1 EMC main test board 26 Figure E.2 Jumper field51 Figure E.3 EME IC test board (contact areas for the spring connector pins of the main test board)27 Figure E.4 Example of an EME IC test system29 Figure E.5
30、Component side of the EME IC test board .29 Figure E.6 Bottom side of the EME IC test board30 Figure F.1 Basic direct coupling for common mode EMC measurements.29 Figure F.2 Measurement set-up for the S21 measurement of the common-mode coupling .30 Figure F.3 Using split load termination as coupling
31、 for measuring equipment30 Figure F.4 Using split load termination as coupling for measuring equipment31 Figure F.5 Example of an acceptable adaptation for special network requirements .31 Table 1 Specification of the RF current probe.10 Table 2 Characteristics of the impedance matching network.11 T
32、able B.1 Emission levels 20 Table D.1 Examples in which the measurement procedure can be reduced.23 Table D.2 System- and module-related ambient parameters .24 Table D.3 Changes at the IC which influence the EMC .24 61967-4 g211 IEC:2002 5 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS
33、,150 kHz TO 1 GHz Part 4: Measurement of conducted emissions 1 g87/150 g87 direct coupling methodPage 5EN 619674:20021 Scope This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement wit
34、h a 1 resistive probe and RF voltage measurement using a 150 coupling network. These methods guarantee a high degree of repeatability and correlation of EME measurements. IEC 61967-1 specifies general conditions and definitions of the test methods. 2 Normative references The following referenced doc
35、uments are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61000-4-6, Electromagnetic compatibility (EMC) Part 4-6: Testing and meas
36、urement techniques Immunity to conducted disturbances, induced by radio-frequency fields IEC 61967-1, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1: General conditions and definitions !CISPR 16-1-1, Specification for radio disturbance and immunity measuring ap
37、paratus and methods Part 1-1: Radio disturbance and immunity measuring apparatus Measuring apparatus CISPR 16-1-2, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-2: Radio disturbance and immunity measuring apparatus Ancillary equipment Conducted disturbances
38、CISPR 16-1-3, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-3: Radio disturbance and immunity measuring apparatus Ancillary equipment Disturbance power CISPR 16-1-4, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-4: R
39、adio disturbance and immunity measuring apparatus Ancillary equipment Radiated disturbances CISPR 16-1-5, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-5: Radio disturbance and immunity measuring apparatus Antenna calibration test sites for 30 MHz to 1 000 M
40、Hz “ 61967-4 g211 IEC:2002 6 ICGndLoop 2 Loop 1SupplyGroundExternali2VsupplyRF currentprobeI/Oi1i1+ i2IEC 894/02Figure 1 Example of two emitting loops returning to the IC via common groundThe emission of an IC is generated by sufficiently fast changes of voltages and currents insidethe IC. These cha
41、nges drive RF currents inside and outside the IC. The RF currents causeconducted EME, which is mainly distributed via the IC pins conductor loops in the printed circuitboard (PCB) and the cabling. These loops are regarded as the emitting loop antennas. Incomparison to the dimension of these loops, t
42、he loops in the internal IC structure areconsidered to be small.The RF currents that accompany ICs action are different in amplitude, phase and spectralcontent. Any RF current has its own loop that returns to the IC. All loops return mostly via theground or supply connection back to the IC. In figur
43、e 1, this is shown for two loops returningvia ground. Loop 1 represents the supply wiring harness for the IC while loop 2 represents therouting of an output signal. The common return path via ground is a suitable location tomeasure the conducted EME as the measurement of the common RF sum current of
44、 theground pin. This test is named the “RF current measurement”.If the IC under test has only one ground pin and all other pins are suspected to contributeessentially to the EME, then the RF sum current is measured between the ground pin of the ICunder test and the ground (see i1 + i2in figure 1).IC
45、Gnd Loop 3Loop 2 Loop 1IC groundSupplyRF-shield and peripheral groundRF currentprobeExternalVsupplyI/OI/Oi2i1i1+ i2IEC 895/02Figure 2 Example of IC with two ground pins, a small I/O loop and two emitting loopsIf the IC under test has more than one ground pin or some of the pins are not suspected toc
46、ontribute much to the whole EME, then the IC under test gets its own ground plane as shownin figure 2. This ground plane is named “IC ground”. It is kept separately from the other ground,that is named “RF-shield and peripheral ground”. The RF current is measured between the ICground and the peripher
47、al ground.Page 6EN 619674:200261967-4 g211 IEC:2002 7 ICs are often used in different configurations based on the application. For instance, amicrocontroller could be used as a single chip controller, with the I/O ports directly connectedto the external cabling system. In order to understand the inf
48、luence of a single I/O pin on theemission level of the IC, an additional measurement procedure, using the same equipment, isprovided. This measurement is named “single pin RF voltage measurement at IC pins”(see also 4.3). In addition to the RF sum current measurement, the RF current measurement ofa
49、single supply pin may be of interest in the analysis of an IC. This can also be attained withapplication of the RF current measurement probe. For example, the RF current probe can beapplied to any of the multiple ground or supply pins in order to quantify the contribution of themeasured pin to the whole emission.4.2 RF current measurementIn the test procedure this measurement shall be made by
