1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationIntegrated circuits Measurement of electromagnetic emissionsPart 8: Measurement of radiated emissions IC stripline methodBS EN 61967-8:2011National forewordThis British Standard
2、is the UK implementation of EN 61967-8:2011. It isidentical to IEC 61967-8:2011.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does no
3、t purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580 64867 0ICS 31.200Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the St
4、andardsPolicy and Strategy Committee on 30 November 2011.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 61967-8:2011EUROPEAN STANDARD EN 61967-8 NORME EUROPENNE EUROPISCHE NORM October 2011 CENELEC European Committee for Electrotechnical Standardization Comit Eur
5、open de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61967-8:2011 E ICS 31.200 English
6、version Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2011) Circuits intgrs - Mesure des missions lectromagntiques - Partie 8: Mesure des missions rayonnes - Mthode de la ligne TEM plaques (stripline) pou
7、r CI (CEI 61967-8:2011) Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-8:2011) This European Standard was approved by CENELEC on 2011-09-15. CENELEC members are bound to comply with the C
8、EN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management C
9、entre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same st
10、atus as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands,
11、 Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 61967-8:2011EN 61967-8:2011 - 2 - Foreword The text of document 47A/868/FDIS, future edition 1 of IEC 61967-8, prepared by SC 47A, “Integrated circuits“, of IEC TC 47, “Semiconductor devi
12、ces“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61967-8:2011. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-06-15 latest date by
13、which the national standards conflicting with the document have to be withdrawn (dow) 2014-09-15 This standard is to be used in conjunction with EN 61967-1. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall
14、not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61967-8:2011 was approved by CENELEC as a European Standard without any modification. BS EN 61967-8:2011- 3 - EN 61967-8:2011 Annex ZA (normative) Normative references
15、 to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (includ
16、ing any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60050-131 - International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory - - IEC 60050-16
17、1 - International Electrotechnical Vocabulary (IEV) - Chapter 161: Electromagnetic compatibility - - IEC 61000-4-20 - Electromagnetic compatibility (EMC) - Part 4-20: Testing and measurement techniques - Emission and immunity testing in transverse electromagnetic (TEM) waveguides EN 61000-4-20 - IEC
18、 61967-1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions EN 61967-1 - IEC 61967-2 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell
19、and wideband TEM cell method EN 61967-2 - BS EN 61967-8:2011 2 61967-8 IEC:2011 CONTENTS 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 General 6 5 Test conditions . 6 5.1 General . 6 5.2 Supply voltage. 6 5.3 Frequency range . 6 6 Test equipment . 7 6.1 General . 7 6.2 RF meas
20、uring instrument 7 6.3 Preamplifier . 7 6.4 IC stripline . 7 6.5 50 termination 7 6.6 System gain 7 7 Test set-up . 8 7.1 General . 8 7.2 Test configuration 8 7.3 EMC test board (PCB) . 8 8 Test procedure . 9 8.1 General . 9 8.2 Ambient conditions 9 8.3 Operational check . 9 8.4 Verification of IC s
21、tripline RF characteristic . 9 8.5 Test technique. 9 9 Test report 10 9.1 General . 10 9.2 Measurement conditions 10 10 IC Emissions reference levels. 10 Annex A (normative) IC stripline description. 11 Annex B (informative) Specification of emission levels . 15 Bibliography 17 Figure 1 IC stripline
22、 test set-up 8 Figure A.1 Cross section view of an example of an unshielded IC stripline . 11 Figure A.2 Cross section view of an example of an IC stripline with housing 12 Figure A.3 Example of IC stripline with housing . 14 Figure B.1 Emission characterization levels . 16 Table A.1 Maximum DUT dim
23、ensions for 6,7 mm IC stripline open version 12 Table A.2 Maximum DUT dimensions for 6,7 mm IC stripline closed version 12 BS EN 61967-8:201161967-8 IEC:2011 5 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS Part 8: Measurement of radiated emissions IC stripline method 1 Scope The measu
24、rement procedure of this part of IEC 61967 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the frequency range of 150 kHz up to 3 GHz. The IC being evaluated is mounted on an EMC test board (PCB) between the active conduct
25、or and the ground plane of the IC stripline arrangement. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (incl
26、uding any amendments) applies. IEC 60050-131: International Electrotechnical Vocabulary (IEV) Part 131: Circuit theory IEC 60050-161: International Electrotechnical Vocabulary (IEV) Chapter 161: Electro-magnetic compatibility IEC 61967-1: Integrated circuits Measurement of electromagnetic emissions,
27、 150 kHz to 1 GHz Part 1: General conditions and definitions IEC 61967-2: Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method IEC 61000-4-20: Electromagnetic compatibility (EMC) Part 4-20: Test
28、ing and measurement techniques Emission and immunity testing in transverse electromagnetic (TEM) waveguides 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 61967-1, IEC 60050-131 and IEC 60050-161 as well as the following apply. 3.1 transverse electr
29、omagnetic (TEM) mode waveguide mode in which the components of the electric and magnetic fields in the propagation direction are much less than the primary field components across any transverse cross-section 3.2 TEM waveguide open or closed transmission line system, in which a wave is propagating i
30、n the transverse electromagnetic mode to produce a specified field for testing purposes BS EN 61967-8:2011 6 61967-8 IEC:2011 3.3 IC stripline TEM waveguide, consisting of an active conductor placed on a defined spacing over an enlarged ground plane, connected to a port structure on each end and an
31、optional shielded enclosure NOTE This arrangement guides a wave propagation in the transverse electromagnetic mode to produce a specific field for testing purposes between the active conductor and the enlarged ground plane. As enlarged ground plane the ground plane of the standard EMC test board acc
32、ording to IEC 61967-1 should be used. An optional shielding enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed version of the IC stripline in opposite to the open version without shielding enclosure. For further information see Annex A.
33、 3.4 two-port TEM waveguide TEM waveguide with input/output measurement ports at both ends 3.5 characteristic impedance magnitude of the ratio of the voltage between the active conductor and the corresponding ground plane to the current on either conductor for any constant phase wave-front NOTE The
34、characteristic impedance is independent of the voltage/current magnitudes and depends only on the cross sectional geometry of the transmission line. TEM waveguides are typically designed to have 50 characteristic impedance. For further information and equation to stripline arrangements, see Annex A.
35、 3.6 primary (field) component electric field component aligned with the intended test polarization NOTE For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary mode electric field vector is vertical at the transverse centre of the IC stripline. 4 Gene
36、ral This test method is based on the TEM wave guide measurement principle according to IEC 61000-4-20. A stripline set-up is used to measure the RF emission of ICs. The RF voltage at the stripline port is related to the electromagnetic radiation potential of the IC and will be measured using a spect
37、rum analyzer or measuring receiver. The intent of this test method is to provide a quantitative measure of the RF emissions from ICs for comparison or other evaluation. 5 Test conditions 5.1 General The test conditions shall meet the requirements as described in IEC 61967-1. In addition, the followi
38、ng test conditions shall apply. 5.2 Supply voltage The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure agree to other values, they shall be documented in the test report. 5.3 Frequency range The effective frequency range for the IC stripline is 150 kHz to
39、3 GHz. The range is limited by its Voltage Standing Wave Ratio (VSWR) characteristics ( 1,25). BS EN 61967-8:201161967-8 IEC:2011 7 6 Test equipment 6.1 General The test equipment shall meet the requirements as described in IEC 61967-1. In addition, the following test equipment requirements shall ap
40、ply. 6.2 RF measuring instrument A spectrum analyzer or EMI receiver shall be used. The resolution bandwidth shall be 9 kHz for EMI receivers or 10 kHz for spectrum analyzers in the frequency range from 150 kHz to 30 MHz and respectively 120 kHz or 100 kHz above 30 MHz according to IEC 61967-1. Meas
41、urements shall be made with a peak detector and presented in units of dBV for 50 system: (dBm readings) + 107 = dBV. For spectrum analyzers, the frequency band of interest shall be swept in calibrated or coupled mode (auto sweep). 6.3 Preamplifier Optionally, a 20 dB to 30 dB gain, low noise preampl
42、ifier might be used. If used, the preamplifier shall be connected directly to the measurement port of the IC stripline using the appropriate 50 coaxial adapter. 6.4 IC stripline TEM waveguide, consisting of an active conductor placed on a defined spacing over an enlarged ground plane, connected to a
43、 port structure on each end and an optional shielded enclosure. The spacing between active conductor and ground plane of the IC stripline has a default value of 6,7 mm. Other spacing can be used but has to be noted in the test report. NOTE A conversion factor allows comparisons between IC stripline
44、arrangements with different spacing between active conductor and ground plane (see Annex A). This IC stripline arrangement guides wave propagation in the transverse electromagnetic mode to produce a specific field for testing purposes between the active conductor and the enlarged ground plane which
45、is preferably the ground plane of a standard EMC test board according to IEC 61967-1. The EMC test board controls the geometry and orientation of the operating IC relative to the IC stripline and eliminates any connecting leads within the IC stripline (these are on the backside of the board, which i
46、s opposite to the IC stripline). An optional shielding enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed version of the IC stripline as opposed to the open version without shielding enclosure. For further information, see Annex A. 6.5
47、50 termination A 50 termination with a VSWR less than 1,1 over the frequency range of measurement is recommended for the IC stripline 50 port not connected to the RF measuring instrument. 6.6 System gain The gain (or attenuation) of the measuring equipment, without the IC stripline, shall be known w
48、ith an accuracy 0,5 dB. The gain of the RF measurement system shall remain within a 6 dB envelope for the frequency range of interest. BS EN 61967-8:2011 8 61967-8 IEC:2011 7 Test set-up 7.1 General The test set-up shall meet the requirements as described in IEC 61967-1. In addition, the following t
49、est set-up requirements shall apply. 7.2 Test configuration See Figure 1 for IC stripline test configuration. One of the 50 ports is terminated with a 50 load. The remaining 50 port is connected to the spectrum analyzer through the optional preamplifier. For further information and cross section view of the IC stripline arrangement, see Annex A. IC stripline EMC test board 50 termination Port 1 (RF connector) Port 2 (RF connector) Preamplifier (if necess
