1、BSI Standards PublicationIntegrated circuits Measurement of electromagnetic immunityPart 1: General conditions and definitionsBS EN 62132-1:2016National forewordThis British Standard is the UK implementation of EN 62132-1:2016. It isidentical to IEC 62132-1:2015. It supersedes BS EN 62132-1:2006 whi
2、ch iswithdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. U
3、sers are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 80031 3ICS 31.200Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of t
4、heStandards Policy and Strategy Committee on 31 March 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62132-1:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62132-1 February 2016 ICS 31.200 Supersedes EN 62132-1:2006 English Version Integrated cir
5、cuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions (IEC 62132-1:2015) Circuits intgrs - Mesure de limmunit lectromagntique - Partie 1: Conditions gnrales et dfinitions (IEC 62132-1:2015) Integrierte Schaltungen - Messung der elektromagnetischen Strfestigkeit
6、 - Teil 1: Allgemeine Bedingungen und Begriffe (IEC 62132-1:2015) This European Standard was approved by CENELEC on 2015-12-03. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national stan
7、dard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version
8、in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cro
9、atia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Tur
10、key and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form an
11、d by any means reserved worldwide for CENELEC Members. Ref. No. EN 62132-1:2016 E BS EN 62132-1:2016EN 62132-1:2016 2 European foreword The text of document 47A/974/FDIS, future edition 2 of IEC 62132-1, prepared by SC 47A “Integrated circuits” of IEC/TC 47 “Semiconductor devices” was submitted to t
12、he IEC-CENELEC parallel vote and approved by CENELEC as EN 62132-1:2016. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-09-03 latest date by which the national stan
13、dards conflicting with the document have to be withdrawn (dow) 2018-12-03 This document supersedes EN 62132-1:2006. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying a
14、ny or all such patent rights. Endorsement notice The text of the International Standard IEC 62132-1:2015 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61400-4-3
15、 NOTE Harmonized as EN 61400-4-3. IEC 61400-4-6 NOTE Harmonized as EN 61400-4-6. IEC 61967-1:2002 NOTE Harmonized as EN 61967-1:2002. CISPR 20 NOTE Harmonized as EN 55020. BS EN 62132-1:2016EN 62132-1:2016 3 Annex ZA (normative) Normative references to international publications with their correspon
16、ding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any a
17、mendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Y
18、ear Title EN/HD Year IEC 62132-2 - Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method EN 62132-2 - IEC 62132-3 - Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bul
19、k current injection (BCI) method EN 62132-3 - IEC 62132-4 - Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 4: Direct RF power injection method EN 62132-4 - IEC 62132-5 - Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5:
20、Workbench Faraday cage method EN 62132-5 - IEC 62132-8 - Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method EN 62132-8 - IEC/TS 62132-9 - Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of
21、 radiated immunity - Surface scan method - - BS EN 62132-1:2016 2 IEC 62132-1:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references. 7 3 Terms and definitions 7 4 Test conditions 11 4.1 General . 11 4.2 Ambient conditions 11 4.2.1 Ambient temperature 11 4.2.2 RF ambie
22、nt 11 4.2.3 RF-immunity of the test setup . 11 4.2.4 Other ambient conditions 11 4.3 Test generator 11 4.4 Frequency range . 11 5 Test equipment 12 5.1 General . 12 5.2 Shielding . 12 5.3 Test generator and power amplifier 12 5.4 Other components . 12 6 Test setup . 12 6.1 General . 12 6.2 Test circ
23、uit board 12 6.3 Pin selection scheme 12 6.4 IC pin loading/termination 13 6.5 Power supply requirements . 13 6.6 IC specific considerations 13 6.6.1 IC supply voltage . 13 6.6.2 IC decoupling . 14 6.6.3 Operation of IC 14 6.6.4 Guidelines for IC stimulation . 14 6.6.5 IC monitoring . 14 6.7 IC stab
24、ility over time 14 7 Test procedure 14 7.1 Monitoring check . 14 7.2 Human exposure . 14 7.3 System verification 14 7.4 Specific procedures . 15 7.4.1 Frequency steps 15 7.4.2 Amplitude modulation . 15 7.4.3 Power levelling for modulation 15 7.4.4 Dwell time 16 7.4.5 Monitoring of the IC 16 8 Test r
25、eport. 16 8.1 General . 16 BS EN 62132-1:2016IEC 62132-1:2015 IEC 2015 3 8.2 Immunity limits or levels 17 8.3 IC performance classes . 17 8.4 Interpretation of results . 17 8.4.1 Comparison between IC(s) using the same test method 17 8.4.2 Comparison between different test methods 17 8.4.3 Correlati
26、on to module test methods 17 Annex A (informative) Test method comparison table 18 Annex B (informative) General test board description . 20 B.1 Overview. 20 B.2 Board description Mechanical . 20 B.3 Board description Electrical 20 B.3.1 General . 20 B.3.2 Ground planes . 20 B.3.3 Package pins . 21
27、B.3.4 Via diameters . 21 B.3.5 Via distance . 21 B.3.6 Additional components . 21 B.3.7 Supply decoupling 21 B.3.8 I/O load . 22 Bibliography . 24 Figure 1 RF signal when RF peak power level is maintained . 16 Figure B.1 Example of an immunity test board 23 Table 1 IC pin loading default values 13 T
28、able 2 Frequency step size versus frequency range 15 Table A.1 Conducted immunity . 18 Table A.2 Radiated immunity 19 Table B.1 Position of vias over the board 20 BS EN 62132-1:2016 4 IEC 62132-1:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGN
29、ETIC IMMUNITY Part 1: General conditions and definitions FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-ope
30、ration on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to a
31、s “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this pre
32、paration. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international con
33、sensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts
34、 are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
35、 transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Indepen
36、dent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No lia
37、bility shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (inc
38、luding legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application o
39、f this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62132-1 has been prepared by subcommittee 47
40、A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2006 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a)
41、frequency range of 150 kHz to 1 GHz has been deleted from the title; b) frequency step above 1 GHz has been added in Table 2 in 7.4.1; c) IC performance classes in 8.3 have been modified; d) Table A.1 was divided into two tables, and references to IEC 62132-8 and IEC 62132-9 have been added in the n
42、ew Table A.2 in Annex A. BS EN 62132-1:2016IEC 62132-1:2015 IEC 2015 5 The text of this standard is based on the following documents: FDIS Report on voting 47A/974/FDIS 47A/977/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the
43、above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 62132 series, published under the general title Integrated circuits Measurement of electromagnetic immunity, can be found on the IEC website. Future standards in this seri
44、es will carry the new general title as cited above. Titles of existing standards in this series will be updated at the time of the next edition. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/we
45、bstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 62132-1:2016 6 IEC 62132-1:2015 IEC 2015 INTRODUCTION The IEC 62132 series is published in several parts, under the general t
46、itle Integrated circuits Measurement of electromagnetic immunity: Part 1: General conditions and definitions Part 2: Measurement of radiated immunity TEM cell and wideband TEM cell method Part 3: Bulk current injection (BCI) method Part 4: Direct RF power injection method Part 5: Workbench Faraday c
47、age method Part 8: Measurement of radiated immunity IC stripline method Part 9: Measurement of radiated immunity Surface scan method BS EN 62132-1:2016IEC 62132-1:2015 IEC 2015 7 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC IMMUNITY Part 1: General conditions and definitions 1 Scope This part
48、of IEC 62132 provides general information and definitions about measurement of electromagnetic immunity of integrated circuits (ICs) to conducted and radiated disturbances. It also defines general test conditions, test equipment and setup, as well as the test procedures and content of the test repor
49、ts for all parts of the IEC 62132 series. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (i
