1、BRITISH STANDARDBS EN 62137-1-1:2007Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-1: Pull strength testThe European Standard EN 62137-1-1:2007 has the status of a British StandardICS 31.190g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g
2、55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 62137-1-1:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October 2007 BSI 2007
3、ISBN 978 0 580 55335 6National forewordThis British Standard is the UK implementation of EN 62137-1-1:2007. It is identical to IEC 62137-1-1:2007.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented o
4、n this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.Amendments issued s
5、ince publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 62137-1-1 NORME EUROPENNE EUROPISCHE NORM August 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue d
6、e Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62137-1-1:2007 E ICS 31.190 English version Surface mounting technology - Environmental and endurance test methods for surface mount solder join
7、t - Part 1-1: Pull strength test (IEC 62137-1-1:2007) Technique du montage en surface - Mthodes dessai denvironnement et dendurance des joints de soudure pour montage en surface - Partie 1-1: Essai de force darrachement (CEI 62137-1-1:2007) Oberflchenmontage-Technik - Verfahren zur Prfung auf Umgebu
8、ngseinflsse und zur Prfung der Haltbarkeit von Oberflchen-Ltverbindungen - Teil 1-1: Zugfestigkeitsprfung (IEC 62137-1-1:2007) This European Standard was approved by CENELEC on 2007-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions fo
9、r giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three offi
10、cial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical comm
11、ittees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the Uni
12、ted Kingdom. Foreword The text of document 91/681/FDIS, future edition 1 of IEC 62137-1-1, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-1 on 2007-08-01. The following dates were fixed: latest date by
13、which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-05-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-08-01 Annex ZA has been added by CENELEC. _ Endorsement notice
14、The text of the International Standard IEC 62137-1-1:2007 was approved by CENELEC as a European Standard without any modification. _ 2 EN 62137-1-1:2007CONTENTS 1 Scope.4 2 Normative references .4 3 Terms and definitions .5 4 General remarks.5 5 Test equipment and materials.6 5.1 Flow soldering equi
15、pment6 5.2 Reflow soldering equipment 6 5.3 Pull strength test equipment 6 5.4 Optical microscope6 5.5 Test substrate .6 5.6 Solder alloy .7 5.7 Flux for flow soldering .7 5.8 Solder paste7 6 Mounting method7 6.1 Flow soldering.7 6.2 Reflow soldering8 7 Test conditions .9 7.1 Test: Rapid change of t
16、emperature9 7.2 Pull strength test .9 8 Test procedure .9 8.1 Test sequence.9 8.2 Pre-conditioning 10 8.3 Initial pull strength measurement.10 8.4 Rapid change of temperature 10 8.5 Recovery.10 8.6 Intermediate/final pull strength measurement 10 9 Items to be included in the test report.10 10 Items
17、to be given in the product specification .11 Annex A (normative) Pull strength test Details 12 Bibliography14 Figure 1 Gull-wing leaded component 5 Figure 2 Area under evaluation in the pull strength test6 Figure 3 Example of a flow soldering profile (actual measurement for double-wave soldering) .8
18、 Figure 4 Typical reflow profile 9 Figure 5 Test procedure.10 Figure A.1 Pull strength test.13 Figure A.2 An example of the shape of the tip of the pulling jig 13 Figure A.3 Failure modes in pull strength test 13 3 EN 62137-1-1:2007Annex ZA (normative) Normative references to international publicati
19、ons with their corresponding European publications 15 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-1: Pull strength test 1 Scope The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting componen
20、ts. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between c
21、omponent terminals and lands on a substrate. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any am
22、endments) applies. IEC 60068-1: Environmental testing Part 1: General and guidance IEC 60068-2-14: Environmental testing Part 2-14: Test N: Change of temperature IEC 60194: Printed board design, manufacture and assembly Terms and definitions IEC 61188-5-5, Printed boards and printed board assemblies
23、 Design and use Part 5-5: Sectional requirements - Attachment (land/joint) considerations Components with gull-wing leads on four sides1IEC 61190-1-1, Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly IE
24、C 61190-1-2: Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly IEC 61190-1-3 Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed
25、solid solders for electronic soldering applications IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad 1In preparation.
26、 4 EN 62137-1-1:20073 Terms and definitions For the purposes of this document, the following terms and definitions apply. NOTE Key terms used in this standard are taken mostly from IEC 60194 and IEC 60068-1. 3.1 gull-wing lead lead stretching out from a surface mount component as illustrated in Figu
27、re 1 Gull-wing leadIEC 1173/07 Figure 1 Gull-wing leaded component 3.2 pull strength maximum force to break the joint of a lead to board when a gull-wing lead of a surface mount component is pulled using a pulling tool at an angle of 45 to the board surface 3.3 pull speed moving speed of the pulling
28、 tool holding a gull-wing lead of a component mounted on board in pull strength test 4 General remarks The mechanical properties of the joint between leads to lands on a printed wiring board using lead-free solder are not the same for the joint using tin-lead solder due to the difference in composin
29、g elements of the solders. Thus it becomes important to test the mechanical properties of solder joints, using different solder alloys, and after temperature cycling stress have been applied. In this test method, the test specimens are mounted on a substrate either by flow soldering or by reflow sol
30、dering. The durability of the solder joints is evaluated first by exposing the electronic components to rapid changes of temperature and after that applying pull strength to the soldered joint. Users of gull-wing components subjected to these tests should check that the results ensure an adequate ma
31、rgin of attachment strength bearing in mind the mass of the component, the number of leads and the specified mechanical environment of the electronic assembly for which the component is intended. NOTE 1 The exposure temperatures in this test may exceed the rated temperature range of the specific ele
32、ctronic component. NOTE 2 This test is not a test to measure the strength of the electronic components. The test method to evaluate the robustness of the joint to a board is described in IEC 60068-2-21. NOTE Where the tests on a single component have been performed on more than one lead, the lowest
33、strength figure should be assumed for all leads when calculating the overall attachment strength 5 EN 62137-1-1:2007The area of a joint to be evaluated is illustrated in Figure 2. Component lead Substrate Enlarge Evaluation area Plated layers Substrate land Intermetallic compound layers Solder Subst
34、rate Component lead IEC 1174/07 Figure 2 Area under evaluation in the pull strength test 5 Test equipment and materials 5.1 Flow soldering equipment The equipment used for the flow soldering is a solder bath that can realize the temperature profile as specified in 6.1. An example of the temperature
35、profile is given in Figure 3. 5.2 Reflow soldering equipment The reflow soldering oven shall be able to realize the temperature profile as specified in 6.2. An example of the temperature profile is given in Figure 4. 5.3 Pull strength test equipment Unless otherwise specified, equipment with the fol
36、lowing features shall be used for the pull test. The pull strength test equipment is composed of tension testing machine, a pulling tool, a jig to fasten a substrate, and an electronic recorder. The tension testing machine shall realize the pull speed specified in Annex A. The jig to fasten a substr
37、ate shall be designed so that a pull force can be applied to a specimen lead at an angle of 45 to the substrate. The recorder shall be able to record the maximum force applied to a lead to break the soldered joint. The accuracy of the recorded data shall be better than 1 % of measured values. 5.4 Op
38、tical microscope The microscope shall be able to observe an object with a magnification approximately of 50X to 250X. It shall also be equipped with a lamp that can give an illumination level of approximately 2 000 lx to the object. 5.5 Test substrate Unless otherwise prescribed by the relevant spec
39、ification, the test shall be conducted on a specimen (device) mounted by its normal means on the following substrate. a) Material: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade (IEC 61249-2-7), with foil bonded to one side and a nominal thickness of the sheet, includi
40、ng the metal foil, of 1,6 mm with a tolerance of 0,20 mm. The copper foil shall have a thickness of 0,035 mm 0,010 mm. 6 EN 62137-1-1:2007b) Size: The size of the substrate depends on the size and shape of a surface mount device soldered on the substrate. The substrate shall be able to be fastened t
41、o the pull test equipment. c) Land geometry: The shape and size of a land shall comply with IEC 61188-5-5 or the land geometry recommended by the respective component supplier. Since IEC 61188-5-5 provides for three different land pattern geometries, and different suppliers provide different recomme
42、ndations, the relationship between the component gull-wing foot print and the land pattern used in the testing shall be recorded in accordance with the following: land protrusion at the lead toe: minimum; land protrusion at the lead heel: minimum; land protrusion at the lead side: minimum. d) Surfac
43、e protection: The solderable areas of the substrate (lands) shall be protected against oxidization by suitable means, e.g. by an organic surface protection layer (OSP). This protective layer shall not adversely have an effect on the solderability of the lands under the soldering conditions of the re
44、flow soldering equipment described in 6.2. 5.6 Solder alloy Unless otherwise specified, the solder alloy shall consist of a ternary composition of Sn, Ag and Cu with the Ag content ranking from 3,0 % to 4,0 % by weight and the Cu content ranking from 0,5 % to 1,0 % by weight with Sn for balance, e.g
45、. SnAg3.0Cu0.5. The solder alloy shall be in accordance with IEC 61190-1-3. 5.7 Flux for flow soldering Unless otherwise specified, the flux used in this test shall comply with IEC 61190-1-1. 5.8 Solder paste Unless otherwise specified, the solder paste used in this test shall comply with IEC 61190-
46、1-2. The solder specified in 5.6 shall be used for the solder paste. 6 Mounting method The test specimen shall be mounted to the substrate by one of the methods given in 6.1 and 6.2. 6.1 Flow soldering The following steps shall be taken: a) The test specimen shall be fixed to the substrate specified
47、 in 5.5 by an adhesive. b) A flux as specified in 5.7 shall be supplied by means of foam or by spraying. c) Unless otherwise specified, a flow-soldering equipment specified in 5.1 shall be used to solder the leads under the conditions given below. The temperature is measured at the land immersed to
48、molten solder. d) Preheating temperature is 100 C to 120 C. The soldering temperature (temperature of the solder bath) is (250 5) C for 3 s to 5 s. A typical soldering profile is given in Figure 3. 7 EN 62137-1-1:20070 50 100 150 200 250 300 0 20 40 60 80 100 120 140 160Time s Temperature CPreheatin
49、g temperature: 100 C to 120 C Solder contact time A + B =3 s to 5 s Preheating time 30 s to 90 s Solder bath temperature: 250 C 5 C Temperature measured at a land immersed into solder IEC 1175/07 Figure 3 Example of a flow soldering profile (actual measurement for double-wave soldering) 6.2 Reflow soldering The following steps shall be taken: a) Apply the solder paste specified in 5.8 to the lands of a test substrate as specified in 5.5, u
