1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EMC IC modellingPart 3: Models of integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) (IEC 62433-3:2017)BS EN 62433-3:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 6243
2、3-3 June 2017 ICS 33.100.10; 31.200 English Version EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) (IEC 62433-3:2017) Modles de circuits intgrs pour la CEM - Partie 3: Modles de circuits intgrs pour la simulation du co
3、mportement lors de perturbations lectromagntiques - Modlisation des missions rayonnes (ICEM-RE) (IEC 62433-3:2017) EMV-IC-Modellierung - Teil 3: Modelle integrierter Schaltungen fr die Simulation des Verhaltens bei elektromagnetischer Beeinflussung - Modellierung von abgestrahlten Aussendungen (ICEM
4、-RE) (IEC 62433-3:2017) This European Standard was approved by CENELEC on 2017-03-03. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date li
5、sts and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
6、under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark,
7、 Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. Europe
8、an Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide
9、for CENELEC Members. Ref. No. EN 62433-3:2017 E National forewordThis British Standard is the UK implementation of EN 62433-3:2017. It is identical to IEC 62433-3:2017.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represen
10、ted on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 8
11、7528 1ICS 33.100.10; 31.200Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 December 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITI
12、SH STANDARDBS EN 62433-3:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62433-3 June 2017 ICS 33.100.10; 31.200 English Version EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) (IEC 62433-3:2017) Modles de circ
13、uits intgrs pour la CEM - Partie 3: Modles de circuits intgrs pour la simulation du comportement lors de perturbations lectromagntiques - Modlisation des missions rayonnes (ICEM-RE) (IEC 62433-3:2017) EMV-IC-Modellierung - Teil 3: Modelle integrierter Schaltungen fr die Simulation des Verhaltens bei
14、 elektromagnetischer Beeinflussung - Modellierung von abgestrahlten Aussendungen (ICEM-RE) (IEC 62433-3:2017) This European Standard was approved by CENELEC on 2017-03-03. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this Eur
15、opean Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official ve
16、rsions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical c
17、ommittees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia,
18、 Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 20
19、17 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62433-3:2017 E BS EN 62433-3:2017EN 62433-3:2017 2 European foreword The text of document 47A/1000/FDIS, future edition 1 of IEC 62433-3, prepared by SC 47A “Integrated circuits“ of
20、 IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62433-3:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (d
21、op) 2017-12-03 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-03-03 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying a
22、ny or all such patent rights. Endorsement notice The text of the International Standard IEC 62433-3:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: ISO 8879:1986 NO
23、TE Harmonized as EN 28879:19901)1) Withdrawn publication BS EN 62433-3:2017EN 62433-3:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this documen
24、t and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated b
25、y (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 61967-1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz
26、 - Part 1: General conditions and definitions EN 61967-1 - IEC 62433-2 - EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) FprEN 62433-2 - IEC/TS 61967-3 - Integrated circuits - Measurement of electromagnetic emissions -
27、 Part 3: Measurement of radiated emissions - Surface scan method - - IEC/TS 62433-1:2011 - EMC IC modelling - Part 1: General modelling framework - - ANSI INCITS 4 - Information Systems - Coded Character Sets - 7-Bit American National Standard Code for Information Interchange (7-Bit ASCII) - - BS EN
28、 62433-3:2017This page deliberately left blank 2 IEC 62433-3:2017 IEC 2017 CONTENTS FOREWORD . 6 1 Scope 8 2 Normative references 8 3 Terms, definitions, abbreviations and conventions . 9 3.1 Terms and definitions 9 3.2 Abbreviations 10 3.3 Conventions 10 4 Philosophy . 10 5 ICEM-RE macro-model desc
29、ription 11 5.1 General . 11 5.2 PDN description 12 5.3 IA description 16 5.4 Electromagnetic field calculation and simulation . 16 6 REML format . 17 6.1 General . 17 6.2 REML structure . 18 6.3 Global keywords . 19 6.4 Header section 19 6.5 Frequency definitions 20 6.6 Coordinate system definition
30、. 20 6.7 Reference definition 21 6.8 Validity section . 21 6.8.1 General . 21 6.8.2 Attribute definitions 22 6.9 PDN 24 6.9.1 General . 24 6.9.2 Attribute definitions 25 6.9.3 PDN of a single-frequency ICEM-RE 26 6.9.4 PDN for multi-frequency ICEM-RE . 29 6.10 IA 32 6.10.1 General . 32 6.10.2 Attrib
31、ute definitions 33 6.10.3 IA of a single-frequency ICEM-RE . 34 6.10.4 IA for multi-frequency ICEM-RE . 37 7 Extraction 38 7.1 General . 38 7.2 Environmental extraction constraints . 39 7.3 Obtaining model parameters from near-field data 39 7.3.1 General . 39 7.3.2 PDN 40 7.3.3 IA 42 7.4 Extraction
32、based on ICEM-CE simulation 45 7.4.1 General . 45 7.4.2 PDN 45 7.4.3 IA 46 8 Validation 46 2 IEC 62433-3:2017 IEC 2017 CONTENTS FOREWORD . 6 1 Scope 8 2 Normative references 8 3 Terms, definitions, abbreviations and conventions . 9 3.1 Terms and definitions 9 3.2 Abbreviations 10 3.3 Conventions 10
33、4 Philosophy . 10 5 ICEM-RE macro-model description 11 5.1 General . 11 5.2 PDN description 12 5.3 IA description 16 5.4 Electromagnetic field calculation and simulation . 16 6 REML format . 17 6.1 General . 17 6.2 REML structure . 18 6.3 Global keywords . 19 6.4 Header section 19 6.5 Frequency defi
34、nitions 20 6.6 Coordinate system definition . 20 6.7 Reference definition 21 6.8 Validity section . 21 6.8.1 General . 21 6.8.2 Attribute definitions 22 6.9 PDN 24 6.9.1 General . 24 6.9.2 Attribute definitions 25 6.9.3 PDN of a single-frequency ICEM-RE 26 6.9.4 PDN for multi-frequency ICEM-RE . 29
35、6.10 IA 32 6.10.1 General . 32 6.10.2 Attribute definitions 33 6.10.3 IA of a single-frequency ICEM-RE . 34 6.10.4 IA for multi-frequency ICEM-RE . 37 7 Extraction 38 7.1 General . 38 7.2 Environmental extraction constraints . 39 7.3 Obtaining model parameters from near-field data 39 7.3.1 General .
36、 39 7.3.2 PDN 40 7.3.3 IA 42 7.4 Extraction based on ICEM-CE simulation 45 7.4.1 General . 45 7.4.2 PDN 45 7.4.3 IA 46 8 Validation 46 BS EN 62433-3:2017IEC 62433-3:2017 IEC 2017 3 Annex A (normative) Preliminary definitions for XML representation 48 A.1 XML basics . 48 A.1.1 XML declaration . 48 A.
37、1.2 Basic elements 48 A.1.3 Root element . 48 A.1.4 Comments . 48 A.1.5 Line terminations . 49 A.1.6 Element hierarchy 49 A.1.7 Element attributes . 49 A.2 Keyword requirements 49 A.2.1 General . 49 A.2.2 Keyword characters . 49 A.2.3 Keyword syntax . 50 A.2.4 File structure . 50 A.2.5 Values . 52 A
38、nnex B (informative) Electromagnetic fields radiated by an elementary electric and magnetic dipole 55 B.1 Electric dipole . 55 B.2 Magnetic dipole. 57 Annex C (informative) Example files 60 C.1 Minimum default ICEM-RE file 60 C.2 Microcontroller example in REML format . 61 Annex D (normative) REML v
39、alid keywords and usage . 63 D.1 Root element keywords . 63 D.2 File header keywords 64 D.3 Validity section keywords 65 D.4 Global keywords . 65 D.5 Pdn section keywords . 66 D.6 Ia section keywords 67 Annex E (informative) ICEM-RE extraction methods 69 E.1 General . 69 E.2 ICEM-RE Modelling method
40、s 69 E.2.1 ModelHman. 69 E.2.2 ModelH69 E.2.3 ModelEM_Inv. 71 E.2.4 ModelEM_Iter72 E.2.5 ModelEM_TD. 72 E.2.6 Model selection guide 73 E.3 ICEM-RE modelling environment from near-field data . 73 E.3.1 General . 73 E.3.2 Modelling design-flow 74 E.3.3 ICEM-RE importation into 3D electromagnetic tools
41、 . 75 E.4 ICEM-RE modelling from ICEM-CE . 76 Annex F (informative) ICEM-RE model validation examples . 78 F.1 General . 78 F.2 Validation on a microcontroller 78 F.2.1 General . 78 F.2.2 Details of the microcontroller . 78 BS EN 62433-3:2017 4 IEC 62433-3:2017 IEC 2017 F.2.3 Case 1: Choosing manual
42、 model ModelHman78 F.2.4 Case 2: Choosing one of the automatic magnetic field models . 79 F.3 Validation on an oscillator circuit . 81 F.4 Example of validation on passive devices . 84 F.5 Examples of validation on active devices 85 F.5.1 Extraction from near-field measurements . 85 F.5.2 Extraction
43、 from ICEM-CE model 85 Annex G (informative) ICEM-RE macro-model usage examples . 86 G.1 General . 86 G.2 Methodology for exploiting ICEM-RE macro-model 86 Bibliography 88 Figure 1 General ICEM-RE model structure 12 Figure 2 Geometrical representation of the ICEM-RE PDN . 13 Figure 3 Representation
44、of an elementary dipole in the ICEM-RE PDN 13 Figure 4 An elementary current loop of radius “a” in 3D space . 14 Figure 5 Duality theorem between a current loop and a magnetic dipole 14 Figure 6 Example of referential points to describe the geometry 15 Figure 7 PDN definition at three different freq
45、uencies 16 Figure 8 REML inheritance hierarchy . 18 Figure 9 Format for defining PDN vector data in an external file . 28 Figure 10 Format for defining IA vector data in an external file . 36 Figure 11 Electromagnetic field measurement 39 Figure 12 Bzfield in nT measured at 3 mm above the microproce
46、ssor at 80 MHz. 40 Figure 13 Example of electromagnetic field emitted by an elementary current line . 41 Figure 14 Manual current mapping . 41 Figure 15 Model representation with N automatically detected dipoles . 42 Figure 16 Comparison between the modelled and measured EM fields at 2 mm above an o
47、scillator 44 Figure 17 A simple ICEM-CE PDN representing the package and the internal network impedance between the power rails . 45 Figure 18 Reconstructing the geometry of the package model (ICEM-RE PDN) from IBIS and its link with the electrical model (ICEM-CE PDN) 46 Figure 19 Graphical represen
48、tation of the example validation procedure 47 Figure A.1 Multiple XML files . 51 Figure A.2 XML files with data files (*.dat) . 51 Figure A.3 XML files with additional files 52 Figure B.1 An elementary current line in space 55 Figure B.2 Elementary magnetic dipole in space 57 Figure C.1 Microcontrol
49、ler used for illustration . 61 Figure C.2 Data file representing the PDN information of the microcontroller . 62 Figure C.3 Data file representing the IA information of the microcontroller . 62 Figure E.1 Manually defined electric dipole array in ModelHman69 Figure E.2 Electric and magnetic dipole array in ModelEM_Inv71 Figure E.3 Example of an ICEM-RE modelling environment . 74 BS EN 62433-3:2017IEC 62433-3:2017 IEC 2017 5 Figure E.4 ICEM-RE m
