ESD SP9 2-2003 Footwear Foot Grounders Resistive Characterization (not to include static control shoes).pdf

相关资源

IRS 70778-2-2018 Recommendations for determining the carrying capacity and fatigue risks of existing metallic railway bridges.pdf

IRS 70712-2018 Rail defects.pdf

IRS 50596-6-2018 Conditions for coding intermodal loading units in combined transport combined transport lines and wagons.pdf

IRS 50596-5-2018 Transport of road vehicles on wagons-Technical Organisation-Conveyance of semi-trailers with P coding or N coding on recess wagons.pdf

IESNA TM-23-2017 Lighting Control Protocols.pdf

IESNA RP-2-2017 Recommended Practice for Retail Lighting.pdf

ITU-R RAPPORT M 766-2 FRENCH-1990 Feasibility of frequency sharing between the GPS and other services《全球定位系统和其他服务之间的频率共享的可行性》.pdf

ITU-R RAPPORT M 763-3 FRENCH-1990 Signal level variation due to multipath effects and blockage by ship-s superstructure in maritime mobile-satellite service lin.pdf

ITU-R RAPPORT M 739-1 FRENCH-1986 Interference due to intermodulation products in the land mobile service between 25 and 100 MHz《由于互调产物在陆地移动服务25和100 MHz之间产生的干扰》.pdf

ITU-R RAPPORT M 319-7 FRENCH-1990 Characteristics of equipment and principles governing the assignment of frequency channels between 25 and 100 MHz for land mob.pdf

猜你喜欢

DIN EN 61188-5-3-2008 Printed boards and printed board assemblies - Design and use - Part 5-3 Attachment (land joint) considerations - Components with gull-wing leads on two sides .pdf

DIN EN 61188-5-4-2008 Printed boards and printed board assemblies - Design and use - Part 5-4 Attachment (land joint) considerations - Components with J leads on two sides (IEC 611.pdf

DIN EN 61188-5-5-2008 Printed boards and printed board assemblies - Design and use - Part 5-5 Attachment (land joint) considerations - Components with gull-wing leads on four sides.pdf

DIN EN 61188-5-6-2003 Printed boards and printed board assemblies - Design and use - Part 5-6 Attachment (land joint) considerations Chip carriers with J-leads on four sides (IEC 6.pdf

DIN EN 61188-5-8-2008 Printed boards and printed board assemblies - Design and use - Part 5-8 Attachment (land joint) considerations - Area array components (BGA FBGA CGA LGA) (IEC.pdf

DIN EN 61189-1-2002 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 1 General test methods and methodology (IEC 6118.pdf

DIN EN 61189-11-2014 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 11 Measurement of melting temperature or meltin.pdf

DIN EN 61189-2-2007 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 2 Test methods for materials for interconnection.pdf

DIN EN 61189-2-719-2017 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 2-719 Test methods for materials for interco.pdf