1、 ETSI EN 300 253 V2.2.1 (2015-06) Environmental Engineering (EE); Earthing and bonding of ICT equipment powered by -48 VDC in telecom and data centres EUROPEAN STANDARD ETSI ETSI EN 300 253 V2.2.1 (2015-06) 2 Reference REN/EE-0250 Keywords bonding, earthing, equipment practice ETSI 650 Route des Luc
2、ioles F-06921 Sophia Antipolis Cedex - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Siret N 348 623 562 00017 - NAF 742 C Association but non lucratif enregistre la Sous-Prfecture de Grasse (06) N 7803/88 Important notice The present document can be downloaded from: http:/www.etsi.org/stand
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6、cation No part may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm except as authorized by written permission of ETSI. The content of the PDF version shall not be modified without the written authorization of ETSI. The copyright a
7、nd the foregoing restriction extend to reproduction in all media. European Telecommunications Standards Institute 2015. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTMand the ETSI logo are Trade Marks of ETSI registered for the benefit of its Members. 3GPPTM and LTE are Trade Marks of ETSI register
8、ed for the benefit of its Members and of the 3GPP Organizational Partners. GSM and the GSM logo are Trade Marks registered and owned by the GSM Association. ETSI ETSI EN 300 253 V2.2.1 (2015-06) 3 Contents Intellectual Property Rights 4g3Foreword . 4g3Modal verbs terminology 5g3Introduction 5g31 Sco
9、pe 6g32 References 6g32.1 Normative references . 6g32.2 Informative references 6g33 Definitions and abbreviations . 7g33.1 Definitions 7g33.1.1 IEC definitions (by IEC 60050 numbers) . 7g33.1.2 Telecommunication definitions 8g33.2 Abbreviations . 9g34 General requirements . 9g34.1 Safety from electr
10、ical hazards 9g34.2 Signal reference 10g34.3 EMC performance 10g35 Requirements on bonding networks . 10g35.1 Bonding configurations 10g35.2 CBN within a telecommunication building or data centre . 10g35.3 BN within a telecommunication or ICT system . 10g35.4 Merging of CBN and MESH-BNs . 13g35.5 Ca
11、bling within and between BNs . 13g36 Requirements for power distribution 13g36.1 DC power distribution of secondary supply . 13g36.2 DC power distribution of tertiary supplies . 13g36.3 AC mains distribution and bonding of the protective conductor 14g36.4 AC power distribution from tertiary power su
12、pply 14g3Annex A (normative): Rationale about CBN co-ordination . 15g3Annex B (informative): Rationale about the integration of the DC return conductor into the merged CBN/MESH-BN . 16g3Annex C (normative): AC mains distribution and bonding of the protective conductor 18g3Annex D (informative): Bibl
13、iography . 22g3History 23g3ETSI ETSI EN 300 253 V2.2.1 (2015-06) 4 Intellectual Property Rights IPRs essential or potentially essential to the present document may have been declared to ETSI. The information pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-m
14、embers, and can be found in ETSI SR 000 314: “Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in respect of ETSI standards“, which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web server (http:/ipr.etsi.org). Pursuan
15、t to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web server) which are, or may be, or may become, essential to the present docume
16、nt. Foreword This European Standard (EN) has been produced by ETSI Technical Committee Environmental Engineering (EE). The present document has been produced within the framework of the following considerations: a) ICT equipment is generally installed in telecommunication or data centres and held in
17、 racks, cabinets or other mechanical structures; b) the existing Recommendation ITU-Ts and CENELEC standards in such matters do not ensure the required standardization at the equipment level; c) network operators and equipment providers agreed to standardize on a bonding configuration that facilitat
18、es: - compliance with functional requirements including Electromagnetic Compatibility (EMC) aspects of emission and immunity; - compatible building and equipment provisions; - installation of new telecommunication or data centres as well as expansion or replacement of installations in existing telec
19、ommunication or data centres with equipment coming from different suppliers; - a structured installation practice; - simple maintenance rules; - contracting on a common basis; - cost effectiveness in development, manufacturing, installation and operation. National transposition dates Date of adoptio
20、n of this EN: 26 May 2015 Date of latest announcement of this EN (doa): 31 August 2015 Date of latest publication of new National Standard or endorsement of this EN (dop/e): 29 February 2016 Date of withdrawal of any conflicting National Standard (dow): 29 February 2016 ETSI ETSI EN 300 253 V2.2.1 (
21、2015-06) 5 Modal verbs terminology In the present document “shall“, “shall not“, “should“, “should not“, “may“, “need not“, “will“, “will not“, “can“ and “cannot“ are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of provisions). “must“ and “
22、must not“ are NOT allowed in ETSI deliverables except when used in direct citation. Introduction The present document addresses earthing and bonding of ICT equipment in telecommunication or data centres in relation to safety, functional performance and EMC. Information regarding the general principl
23、es on earthing for telecommunication or data centres has been published by the ITU-T in the handbook on “Earthing of telecommunication installations“ i.1. Recommendation ITU-T K.27 i.2 deals with bonding configurations and earthing inside a telecommunication building or data centre. One bonding conf
24、iguration only is selected from Recommendation ITU-T K.27 i.2 (CBN/MESH-BN) and tailored to the present document. The author thanks the International Electrotechnical Commission (IEC) for permission to reproduce Information from its International Standard IEC 60364-1 (CENELEC HD 60364-1 i.11) ed. 5.
25、0 (2005). All such extracts are copyright of IEC, Geneva, Switzerland. All rights reserved. Further information on the IEC is available from www.iec.ch. IEC has no responsibility for theplacement and context in which the extracts and contents are reproduced by the author, nor is IEC in any wayrespon
26、sible for the other content or accuracy therein. ETSI ETSI EN 300 253 V2.2.1 (2015-06) 6 1 Scope The present document applies to earthing and bonding of ICT equipment operating with DC voltage defined in ETSI EN 300 132-2 i.9, in order to facilitate the installation, operation and maintenance of equ
27、ipment. It also co-ordinates with the pre-conditions of the installation to achieve the following targets: - safety from electrical hazards; - reliable signal reference; - satisfactory Electromagnetic Compatibility (EMC) performance. The specification of ICT equipment and of the pre-conditions of in
28、stallation are subject to agreement of the parties (e.g. the supplier and the purchaser) and the procedure to achieve agreement is covered by annex A of the present document. The present document does not cover safety and EMC aspects of the equipment. Those aspects are covered by other relevant stan
29、dards. The present document does not apply to the installation of ICT equipment in locations other than telecommunication and data centres, e.g. ICT equipment within a customers building, including subscriber line termination. NOTE: Earthing and bonding of equipment installed in locations other than
30、 telecommunication and data centres is covered by CENELEC EN 50310 i.6. 2 References 2.1 Normative references References are either specific (identified by date of publication and/or edition number or version number) or non-specific. For specific references, only the cited version applies. For non-s
31、pecific references, the latest version of the reference document (including any amendments) applies. Referenced documents which are not found to be publicly available in the expected location might be found at http:/docbox.etsi.org/Reference. NOTE: While any hyperlinks included in this clause were v
32、alid at the time of publication, ETSI cannot guarantee their long term validity. The following referenced documents are necessary for the application of the present document. 1 CENELEC HD 60364-4-41: “Low-voltage electrical installations - Part 4-41: Protection for safety - Protection against electr
33、ic shock“. 2 CENELEC HD 60364-5-54: “Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements, protective conductors and protective bonding conductors“. 3 CENELEC EN 60950-1: “Information technology equipment - Safety - Part 1: General
34、requirements“. 4 CENELEC EN 41003: “Particular safety requirements for equipment to be connected to telecommunication networks and/or a cable distribution system“. 2.2 Informative references References are either specific (identified by date of publication and/or edition number or version number) or
35、 non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the reference document (including any amendments) applies. NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee their
36、long term validity. ETSI ETSI EN 300 253 V2.2.1 (2015-06) 7 The following referenced documents are not necessary for the application of the present document but they assist the user with regard to a particular subject area. i.1 ITU-T handbook: “Earthing of telecommunication installations“. i.2 Recom
37、mendation ITU-T K.27 (1991): “Bonding Configurations and Earthing inside a Telecommunication Building“. i.3 IEC 60050: “International Electrotechnical Vocabulary“. i.4 IEC 60050-604: “International Electrotechnical Vocabulary. Chapter 604: Generation, transmission and distribution of electricity - O
38、peration“. i.5 IEC 60050-826: “International Electrotechnical Vocabulary. Electrical installations of buildings“. i.6 CENELEC EN 50310: “Application of equipotential bonding and earthing in buildings with information technology equipment“. i.7 CENELEC EN 62305 series: “Protection against lightning“.
39、 i.8 IEC 60050-195: “International Electrotechnical Vocabulary. Electrical installations of buildings“. Earthing and protection against electric shock. i.9 ETSI EN 300 132-2: “Environmental Engineering (EE); Power supply interface at the input to telecommunications and datacom (ICT) equipment; Part
40、2: Operated by -48 V direct current (dc)“. i.10 CENELEC EN 50162: “Protection against corrosion by stray current from d.c. system“. i.11 CENELEC HD 60364-1: “Electrical installation of buildings; Part 1: Scope, object and definitions“. 3 Definitions and abbreviations 3.1 Definitions For the purposes
41、 of the present document, the following terms and definitions apply. The following definitions with respect to earthing and bonding are introduced by the IEC 60050 i.3 and are used within the present document to maintain conformity. 3.1.1 IEC definitions (by IEC 60050 numbers) NOTE: IEC 60050 i.3 re
42、ferences are given in parentheses (see IEC 60050-604 i.4, IEC 60050-826 i.5 and IEC 60050-195 i.8). earth (195-01-03): part of the Earth which is in electric contact with an earth electrode and the electric potential of which is not necessarily equal to zero earthing arrangement earthing conductor (
43、195-02-03): conductor which provides a conductive path, or part of the conductive path, between a given point in a system or in an installation or in equipment and an earth electrode earth electrode (195-02-01): conductive part, which may be embedded in a specific conductive medium, e.g. concrete or
44、 coke, in electric contact with the Earth earthing network (604-04-07): part of an earthing installation that is restricted to the earth electrodes and their interconnections equipotential bonding (195-01-10): provision of electric connections between conductive parts, intended to achieve equipotent
45、iality main earthing terminal (826-13-15): terminal or busbar which is part of the earthing arrangement of an installation and enabling the electric connection of a number of conductors for earthing purposes ETSI ETSI EN 300 253 V2.2.1 (2015-06) 8 Neutral conductor (N) (826-01-03): conductor connect
46、ed to the neutral point of a system and capable of contributing to the transmission of electrical energy PEN conductor (826-13-25): conductor combining the functions of both a protective earthing conductor and a neutral conductor protective earthing conductor (PE) (826-13-23): protective conductor p
47、rovided for protective earthing IT, TN-C, TN-S, and TT systems (see HD 60 364-1: The codes used have the following meanings: First letter Relationship of the power system to earth: T = direct connection of one point to earth; I = all live parts isolated from earth, or one point connected to earth th
48、rough a high impedance. Second letter Relationship of the exposed-conductive-parts of the installation to earth: T = direct electrical connection of exposed-conductive-parts to earth, independently of the earthing of any point of the power system; N = direct electrical connection of the exposed-cond
49、uctive-parts to the earthed point of the power system Subsequent letter(s) (if any) Arrangement of neutral and protective conductors: S = protective function provided by a conductor separate from the neutral conductor or from the earthed line conductor. C = neutral and protective functions combined in a single conductor (PEN conductor). 3.1.2 Telecommunication definitions The following definitions, specific to telecommunication or data centre installations and not covered by the IEC 60050 i.3, are used within the pr
