1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2010 02 15 N-STATUS No replacement named S. Ryzyi, NA 2003 06 30 Revised Para 3.0 inserted; Para 3.4, 3.5, 3.6, 3.7, 3.8, 4 deleted 1980 12 02 CF3K-RD576983-14 Released (Was XF-M2LX39) Printed copies are uncontrolled Copyright 2010, Ford Globa
2、l Technologies, Inc. Page 1 of 1 WIRE, ALUMINUM, 0.03% SILICON ESF-M2L61-A1 WIRE, ALUMINUM, 1.0% SILICON ESF-M2L61-A2 NOT TO BE USED FOR NEW DESIGN 1. SCOPE The materials defined by these specifications are aluminum wire containing silicon. 2. APPLICATION These specifications were released originall
3、y for materials used in wire for internal semiconductor connections. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). A1 A2 3.1 CHEMICAL COMPOSITION (
4、See Notes) Silicon 0.03 max 1.0 +/- 0.5 Copper - - Magnesium - - Zirconium - - Aluminum Balance Balance Note: A1 All other elements are considered impurities. No single impurity shall exceed 0.05% and the total of all detectable impurities shall not exceed 0.09%. Determine impurities by spectrograph
5、ic analysis. A2 All other elements are considered impurities. No single impurity shall exceed 0.005% and the total of all detectable impurities shall not exceed 0.01%. Determine purity by spectrographic analysis. 3.2 TENSILE STRENGTH, MPa, min 62 207 (ASTM F 219) Elongation, % min 10 1.0 3.3 SURFACE
6、 QUALITY Surface shall be free from contaminants such as fingerprints, stains and lubricants and essentially free from particulate matter when viewed at 30X magnification. Surface shall be free from cracks and protrusions and essentially free from scratches, draw marks, nicks, pits and kinks when viewed at 30X magnification.
