1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions Rev 02 2012 05 07 N Status No usage or replacement N. Benipal, NA 2006 09 19 Revised Inserted 3.0; Deleted 3.3 & 4 1977 02 04 Released ( Was XF-M99GX23) F4G-40 Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page
2、 1 of 1 SILICONE, HEAT TRANSFER COMPOUND ESF-M99G123-A NOT TO BE USED FOR NEW DESIGN 1. SCOPE The material defined by this specification is a white, grease like compound consisting of silicone and fillers. 2. APPLICATION This specification was released originally for material used as a heat transfer
3、 compound in temperature sensor. 3. REQUIREMENTS Material specification requirements are to be used for initial qualification of materials. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Mater
4、ials (WSS-M99P1111-A). 3.1 To be run on each batch of material 3.1.1 Specific Gravity, min 2.3 (ASTM D 115, at 25 C) 3.1.2 Worked Penetration 260 - 340 (ASTM D 217, 60 strokes) 3.1.3 Bleed, max 0.01% (FED-STD-791, Method 321.2, 24 h at 200 C) 3.1.4 Evaporation, max 0.8% (FED-STD-791, Method 321.2, 24 h at 200 C) 3.2 To be run for initial approval and as required by Quality Control 3.2.1 Thermal Conductivity, min 0.0009 cal/cm2/C/s/cm (MIL C 47113 B) 3.2.2 Dielectric Strength, min 250 V/mil (10 kV/mm) (IEC 243, ASTM D 149, 0.050 in, (1.27 mm) thick) 3.2.3 Flash Point, min 200 C (ASTM D 93)
