1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2006 09 19 Revised Inserted 3.0; Deleted 3.3 & 4 1980 06 18 Revised & Retyped CF4K-RD576983-7 1978 10 31 Released (Was XF-M99GX27), F4H-70 Printed copies are uncontrolled Copyright 2006, Ford Global Technologies, LLC Page 1 of 1 ENCAPSULANT,
2、SILICONE DIELECTRIC GEL ESF-M99G128-A 1. SCOPE The material defined by this specification is a very soft, 2 part, silicone gel. 2. APPLICATION This specification was released originally for a compound used in sealing and potting diodes in the alternator rectifier circuit. 3. REQUIREMENTS Material sp
3、ecification requirements are to be used for initial qualification of materials. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 To be run on each lot of material
4、. 3.1.1 Viscosity - Brookfield Viscometer, mm2/s (ASTM D 1084 Method “B“, model LVT, 30 rpm, #3 spindle) 3.1.1.1 Part A 200 - 700 3.1.1.2 Part B 200 - 700 3.1.1.3 Mixed 200 - 700 3.1.2 Gel Time at 135 C 5 - 15 minutes (ASTM D 2471, mix components at R.T.) 3.1.3 Hardness 3 - 8 (FLTM BJ 023-03, cured 1 h at 150 C) 3.2 To be run for Initial Approval and as required by quality control. Samples cured 1 h at 150 C. 3.2.1 Dielectric Strength, min 375 vpm (15 kV/mm) (ASTM D 149/IEC 243, 0.060 in (1.5mm) thick) 3.2.2 Specific Gravity 0.94 - 0.97 3.2.3 Volatility, loss, m x 3.0% (2 g for 2 h at 150 C)
