1、 ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions 2003 02 28 Revised Para 3.0 inserted; para 3.1, 3.2, 3.3, 3.13, 3.14, 4 deleted 1991 06 25 NB00I10043054103 Released D. Henrickson, L. Moriarty Printed copies are uncontrolled Page 1 of 3 Copyright 2003, For
2、d Global Technologies, Inc. ADHESIVE, HOT MELT, HOT APPLIED, 190 - 220 C WSB-M2G359-A 1. SCOPE The material defined by this specification is a heat activated synthetic resin type adhesive with good hot tack and good high and low temperature resistance. 2. APPLICATION This specification was originall
3、y released for material used to bond heat resistant ABS to itself in instrument panel assemblies. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4
4、 COLOR Amber oas specified on Engineering Drawing 3.5 SOLIDS, min 98 %(FLTM BV 150-10) 3.6 SPECIFIC GRAVITY 1.01 +/- 0.05 (ASTM D 792) 3.7 SOFTENING RANGE 138 - 148 C (ASTM E 28, Ring and Ball Apparatus) 3.8 VISCOSITY, mPa.s (ASTM D 4402, Brookfield RVT, Spindle No. 27) 200 +/- 2 C, 20 rpm 2,500 6,0
5、00 ENGINEERING MATERIAL SPECIFICATION WSB-M2G359-A Page 2 of 3 Copyright 2003, Ford Global Technologies, Inc. 3.9 ADHESION, LAP SHEAR (ASTM D 3163, Avg. of 5 tests at each condition, 13 mm/minute crosshead speed) Normal, min (Condition for 30 minutes at specified temperature prior to testing.) 3.9.1
6、 Test at 23 +/- 2 C 2.30 N/m23.9.2 Test at - 30 +/- 2 C 1.00 N/m23.9.3 Test at 90 +/- 2 C 0.10 N/m2Environmental Aging, min (After specified exposure, condition at 23 +/- 2 C for 30 minutes prior to testing at 23 +/- 2 C.) 3.9.4 1,000 h at 93 +/- 2 C 1.05 N/m23.9.5 1,000 h at 38 +/- 2 C and 1.15 N/m
7、298 +/- 2 % relative humidity 3.9.6 1,000 h water immersion at 23 +/- 2 C 0.35 N/m23.9.7 10 thermal cycles 0.20 N/m24 h at 90 +/- 2 C, 4 h at 38 +/- 2 C and 98 +/- 2 % relative humidity 16 h at - 30 +/- 2 C Sample Preparation: . Overlap 25 mm of two 100 x 25 x 3 mm coupons of the materials to be bon
8、ded using enough adhesive to completely fill the bond area and compress to a bondline thickness of 0.25 mm. Trim excess adhesive when cooled. . Allow bonded test coupons to cure for 24 h at 23 +/- 2 C prior to testing at above conditions. . Record peak load at failure and indicate type of failure. E
9、NGINEERING MATERIAL SPECIFICATION WSB-M2G359-A Page 3 of 3 Copyright 2003, Ford Global Technologies, Inc. 3.10 QUALITY The adhesive shall be a smooth, homogeneous mixture, free from foreign materials. The material must be adaptable for application in accordance with the appropriate Ford Motor Compan
10、y Process Specification and must be compatible with all related materials. 3.11 FOGGING (FLTM BO 116-03) Fog Number, min 60 Formation of clear film, droplets or crystals is cause for rejection. 3.12 FUNCTIONAL APPROVAL Materials being evaluated for approval to this specification shall be subjected t
11、o a production trial. Functional trial results must be approved by the affected assembly operation and Design Engineering. Results shall be made available to Materials Engineering prior to material approval and release. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 OPEN TIME 30 -45 s(At an operation temperature of 190 - 220 C)
