FORD WSD-M2D384-A1-2004 THERMOPLASTIC POLYESTER ETHER ELASTOMER (TEEE) 90 DUROMETER A HARDNESS GENERAL PURPOSE TO BE USED WITH FORD WSS-M99P1111-A 《通用硬度为90 A的热塑性聚酯乙醚弹性体(TEEE) 与标.pdf

上传人:周芸 文档编号:749849 上传时间:2019-01-14 格式:PDF 页数:3 大小:90.07KB
下载 相关 举报
FORD WSD-M2D384-A1-2004 THERMOPLASTIC POLYESTER ETHER ELASTOMER (TEEE) 90 DUROMETER A HARDNESS GENERAL PURPOSE  TO BE USED WITH FORD WSS-M99P1111-A  《通用硬度为90 A的热塑性聚酯乙醚弹性体(TEEE)  与标.pdf_第1页
第1页 / 共3页
FORD WSD-M2D384-A1-2004 THERMOPLASTIC POLYESTER ETHER ELASTOMER (TEEE) 90 DUROMETER A HARDNESS GENERAL PURPOSE  TO BE USED WITH FORD WSS-M99P1111-A  《通用硬度为90 A的热塑性聚酯乙醚弹性体(TEEE)  与标.pdf_第2页
第2页 / 共3页
FORD WSD-M2D384-A1-2004 THERMOPLASTIC POLYESTER ETHER ELASTOMER (TEEE) 90 DUROMETER A HARDNESS GENERAL PURPOSE  TO BE USED WITH FORD WSS-M99P1111-A  《通用硬度为90 A的热塑性聚酯乙醚弹性体(TEEE)  与标.pdf_第3页
第3页 / 共3页
亲,该文档总共3页,全部预览完了,如果喜欢就下载吧!
资源描述

1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2004 09 15 Revised Inserted 3.0; Deleted 3.1, 3.2, 3.4, 3.7, 3.8, 4; Corrected numbering in 3.7, 5 1988 10 31 All sheets revised. B/031517 TC B. Hennessey1988 04 11 Released WSD-M2D384-A1 only. SM/ER 3718 TC B. HennesseyPrinted copies are unco

2、ntrolled Copyright 2004, Ford Global Technologies, LLC Page 1 of 3 THERMOPLASTIC POLYESTER ETHER ELASTOMER (TEEE), WSD-M2D384-A1 90 DUROMETER A HARDNESS, GENERAL PURPOSE 1. SCOPE The material defined by this specification is a nominally 90 Durometer A melt-processable polyester-ether elastomer (TEEE

3、) for general purpose use where retention of visual appearance after outdoor exposure is not required (See General Information). 2. APPLICATION This specification was released originally for material used as a radio antenna-to-body seal. The material can withstand prolonged exposure to temperatures

4、up to 100 C. Being thermoplastic, the material will soften and creep significantly under load at temperatures exceeding 110 C. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Ma

5、terials (WSS-M99P1111-A). 3.3 DYNAMIC MECHANICAL ANALYSIS Ford Motor Company, at its option, may establish a shear modulus/damping vs. temperature curves plotted for -50 to +150 C temperature range for material/parts supplied to this specification. The shear modulus and damping curves established fo

6、r initial approval shall constitute the reference standard and shall be kept on file at the designated material laboratory. All samples shall produce shear modulus and damping curves that correspond to the reference standard when tested under the same conditions. 3.5 MOLDED TEST SPECIMEN 3.5.1 Prepa

7、ration of Test Specimens Unless otherwise specified, all test shall be conducted on specimens die cut from injection molded plaques 150 x 100 x 2.0 +/- 0.2 mm. The plaques shall be molded according to ISO 294 and film gated along the upper 100 mm edge. No annealing allowed, unless specified otherwis

8、e. 3.5.2 Density 1.18 1.20 g/cm3(ISO 1183, Method A/ASTM D 792, Method A1) 3.5.3 Hardness, International 85 - 95 (ISO 48/ASTM D 1415) ENGINEERING MATERIAL SPECIFICATIONWSD-M2D384-A1Printed copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 2 of 3 3.5.4 Hardness, Durometer A 8

9、5 - 95 (ISO 868/ASTM D 2240, instantaneous, plied-up specimen) 3.5.5 Tensile Strength, min 15 MPa (ISO R 527, type 2/ASTM D 412, Die C, 500 mm/min test speed) 3.4.5.1 Elongation at Break, min 300% (Test acc. to para 3.4.5) 3.5.6 Modulus at 100% Elongation, min 10 to 13 MPa (Test acc. to para 3.4.5)

10、3.5.7 Tear Strength, min (ISO 34, Method B, procedure a/ ASTM D 624, Die C) 3.5.7.1 Parallel to Flow 80 kN/m 3.5.7.2 Perpendicular to Flow 80 kN/m 3.5.8 Compression Set, max (ISO 815, Large Type-plied specimen/ASTM D 395, Method B, Type 1 plied specimen) 3.5.8.1 22 h at 70 +/- 1 C 70% 3.5.8.2 70 h a

11、t 100 +/- 2 C 85% 3.5.8.3 1,000 h at 100 +/- 2 C 85% 3.5.9 Brittleness Point, max -50 C (ASTM D 2137, Method A) 3.5.10 Ozone Resistance, max Rating 0 (FLTM BP 101-01, at 20% elongation) 3.5.11 Heat Aging (ISO 188/ASTM D 573, 1,000 h at 100 +/- 2 C) 3.5.11.1 Hardness Change, max +/- 5 3.5.11.2 Tensil

12、e Strength Change, max -15% 3.5.11.3 Elongation Change, max -10% 3.5.11.4 Modulus at 100% Elongation, min 11 to 14 MPa ENGINEERING MATERIAL SPECIFICATIONWSD-M2D384-A1Printed copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 3 of 3 3.6 FLAMMABILITY (ISO 3795) Burn Rate, max 1

13、00 mm/min The specimen size required for material approval is 355 x 100 x 2.0 +/- 0.1 mm with a smooth surface. 5. GENERAL INFORMATION The information below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 COEFFICIENT OF LINEAR THERMAL EXPANSION 15

14、to 22E-5/ C (ASTM D 696) 5.2 MOLD SHRINKAGE (ISO 2577, 150 x 100 x 2.0 +/- 0.2 mm injection molded specimen) 5.2.1 Molding Shrinkage After 48 h at 23 +/- 2 C 0.6 to 1.0% 5.2.2 Post Shrinkage (Separate specimens required for each test) After 48 h at 80 +/- 2 C 0.2 to 0.3% After 30 min at 120 +/- 2 C

15、0.3 to 0.9% 5.3 WEATHERING RESISTANCE When subjected to the following weathering tests, the material cannot be expected to exceed the following visual assessment ratings after polishing of the sample. Some surface crazing may also result. 5.3.1 1,600 h Weatherometer Rating 2 (FLTM BO 101-01) Lighter 5.3.2 12 Months Florida Rating 2 (5south, direct Lighter weathering inland)

展开阅读全文
相关资源
猜你喜欢
  • BS EN 60749-4-2002 Semiconductor devices - Mechanical and climatic test methods - Damp heat steady state highly accelerated stress test (HAST)《半导体器件 机械和气候试验方法 湿热、稳态态、高加速应力试验(HAST)》.pdf BS EN 60749-4-2002 Semiconductor devices - Mechanical and climatic test methods - Damp heat steady state highly accelerated stress test (HAST)《半导体器件 机械和气候试验方法 湿热、稳态态、高加速应力试验(HAST)》.pdf
  • BS EN 60749-40-2011 Semiconductor devices Mechanical and climatic test methods Board level drop test method using a strain gauge《半导体装置 机械和气候试验方法 利用变形测量器进行的板级落锤试验法》.pdf BS EN 60749-40-2011 Semiconductor devices Mechanical and climatic test methods Board level drop test method using a strain gauge《半导体装置 机械和气候试验方法 利用变形测量器进行的板级落锤试验法》.pdf
  • BS EN 60749-42-2014 Semiconductor devices Mechanical and climatic test methods Temperature and humidity storage《半导体器件 机械和气候试验方法 温度和湿度存储》.pdf BS EN 60749-42-2014 Semiconductor devices Mechanical and climatic test methods Temperature and humidity storage《半导体器件 机械和气候试验方法 温度和湿度存储》.pdf
  • BS EN 60749-44-2016 Semiconductor devices Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) test method for semiconductor devices《半导体器件 机械和气候试验.pdf BS EN 60749-44-2016 Semiconductor devices Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) test method for semiconductor devices《半导体器件 机械和气候试验.pdf
  • BS EN 60749-5-2017 Semiconductor devices Mechanical and climatic test methods Steady-state temperature humidity bias life test《半导体器件 机械和气候试验方法 稳态温度湿度偏差寿命试验》.pdf BS EN 60749-5-2017 Semiconductor devices Mechanical and climatic test methods Steady-state temperature humidity bias life test《半导体器件 机械和气候试验方法 稳态温度湿度偏差寿命试验》.pdf
  • BS EN 60749-6-2002 Semiconductor devices - Mechanical and climatic test methods - Storage at high temperature《半导体器件 机械和气候试验方法 高温下储存》.pdf BS EN 60749-6-2002 Semiconductor devices - Mechanical and climatic test methods - Storage at high temperature《半导体器件 机械和气候试验方法 高温下储存》.pdf
  • BS EN 60749-7-2011 Semiconductor devices Mechanical and climatic test methods Internal moisture content measurement and the analysis of other residual gases《半导体装置 机械和气候耐受性试验方法 其他残余.pdf BS EN 60749-7-2011 Semiconductor devices Mechanical and climatic test methods Internal moisture content measurement and the analysis of other residual gases《半导体装置 机械和气候耐受性试验方法 其他残余.pdf
  • BS EN 60749-8-2003 Semiconductor devices Mechanical and climatic test methods Sealing《半导体器件 机械和气候试验方法 密封》.pdf BS EN 60749-8-2003 Semiconductor devices Mechanical and climatic test methods Sealing《半导体器件 机械和气候试验方法 密封》.pdf
  • BS EN 60749-9-2002 Semiconductor devices - Mechanical and climatic test methods - Permanence of marking《半导体器件 机械和气候试验方法 永久性标记》.pdf BS EN 60749-9-2002 Semiconductor devices - Mechanical and climatic test methods - Permanence of marking《半导体器件 机械和气候试验方法 永久性标记》.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1