1、 ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions 2003 02 28 Revised Para 3.0 inserted; Para 3.1, 3.2, 3.9, 4 deleted 1992 08 13 DF00E00107002205 Released J. Kelly Printed copies are uncontrolled Page 1 of 2 Copyright 2003, Ford Global Technologies, Inc. AD
2、HESIVE, EPOXY, ELECTRICALLY CONDUCTIVE WSF-M2G366-A 1. SCOPE The material defined by this specification is a one component, heat curing, thermosetting, electrically conductive epoxy adhesive. 2. APPLICATION This specification was released originally for material used to provide EMC bonding and groun
3、ding in an electronic module as well as provide a thermally conducting pathway for heat transfer. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.3
4、 COLOR Silver 3.4 VISCOSITY (ASTM D 1084, Brookfield Model RVT, #51 spindle, 10 rpm at 25 C) As Received 13,000 - 26,000 mPa.s 3.5 SOLIDS, min 99 %(ASTM D 2834, except heat at 100 +/- 2 C for 3 h in a mechanical convection oven) 3.6 VOLUME RESISTIVITY, max 0.001 /cm Note: Using stencil printing, or
5、a doctor blade drawn across pressure sensitive adhesive tape used as a shim, apply a stripe of adhesive to a cleaned glass slide 0.25 cm wide and 0.005 cm thick. The length of the adhesive stripe should be at least 7.5 cm. Cure sample for 60 minutes at 150 C. Measure sample resistance using a Kelvin
6、 Bridge (4 point). Calculate resistivity based on the following formula: Resistivity = (Resistance x thickness x width)/length ENGINEERING MATERIAL SPECIFICATION WSF-M2G366-A Page 2 of 2 Copyright 2003, Ford Global Technologies, Inc. 3.7 CURED ADHESIVE PROPERTIES 3.7.1 Cure to Handle at 150 C, max 6
7、0 minutes 3.7.2 Overlap Shear Strength (ASTM D 1002, aluminum to aluminum) 3.7.2.1 Normal (25 C), min 3.5 MPa 3.7.2.2 Elevated Temperature, min 2.0 MPa Test Method: Condition samples at 125 +/- 1 C for 1 h. Pull to failure at 125 +/- 1 C. 3.7.2.3 Low Temperature, min 3.5 MPa Test Method: Condition a
8、t - 30 +/- 1 C for 1 h. Pull to failure at - 30 +/- 1 C. General Test Method: Chemically clean 25 x 100 x 1.6 mm aluminum coupons at 70 +/- 1 C in a solution of 30 parts of distilled water, 4 parts of sodium, dichromate, and 10 parts of sulphuric acid (1.84 gr) for 5 minutes. Rinse thoroughly in run
9、ning tap water and force dry for 15 minutes at 70 +/- 1 C. Cool to 23 +/- 2 C. Coat aluminum with a thin film of adhesive and mate parts under finger pressure to obtain a total bond area of 6.5 cm2(film thickness 0.08 - 0.25 mm). Bonded assemblies shall be pulled in a testing machine having a jaw se
10、paration rate of 2.5 mm/minute. 3.8 STORAGE STABILITY The material shall be stored in closed containers at a temperature below 5 C, away from all sources of heat. Heat greatly accelerates aging. Under these storage conditions, the minimum shelf life of the material shall be 3 months. However, when s
11、tored at - 10 C the shelf life is extended to 6 months. When these materials are stored at temperatures below 23 C, they shall be conditioned at room temperature prior to application. Adequate conditioning permits the material to obtain its maximum application properties. 3.9 QUALITY The material shall be a smooth homogeneous mixture, free from foreign materials and properties detrimental to normal production operations.
