1、ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions2003 01 08 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.9, 3.10, 4 deleted 1994 06 30 NGA1E10370437006 Released R.J. Gordon Printed copies are uncontrolled Page 1 of 3 Copyright 2002, Ford Global Technolo
2、gies, Inc. ADHESIVE, TWO COMPONENT SILICONE, WSF-M2G378-A THERMALLY CONDUCTIVE 1. SCOPEThe material defined by this specification is a two component, primerless, thermal curing, solventfree, thermally conductive adhesive. This material shall consist of vinyl terminated polydimethylsiloxaane, platinu
3、m catalyst, adhesion promoters and aluminum powder. This material should notbe used as an electrical insulator.2. APPLICATIONThis specification was originally released as a adhesive to bond a Next Generation Speed Controlcircuit board to an aluminum base plate housing assembly. The material is inten
4、ded to function asa dielectric adhesive as well as a thermal transfer compound.3. REQUIREMENTS3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 CONSTITUENT MATERIA
5、LS 3.4.1 Adhesive Type Addition Cured Polydimethylsiloxane 3.4.2 Aluminum Particle Size (ASTM C925) Weight percent less than 450 mesh (.32 micrometer) 100 Weight percent less than 4 micrometer 30 3.4.3 Weight Per Volume (ASTM D 792, Method A) Part A 1.63 - 1.65 kg/L Part B 1.62 - 1.65 kg/L NOT TO BE
6、 USED FOR NEW DESIGN2015 02 03 N Status No replacement named L. Sinclair, NAENGINEERING MATERIAL SPECIFICATION WSF-M2G378-A Page 2 of 3 Copyright 2002, Ford Global Technologies, Inc. 3.4.3 Viscosity, mPa.s, range (ISO 2555, Brookfield RVF, #7 spindle) Part A (20 rpm) 13,000 - 27,000 mPa.s Part B (20
7、 rpm) 8,000 - 20,000 mPa.s Mixed 1:1 2.5 rpm 35K - 70K mPa.s 20 rpm 13K - 20K mPa.s 3.5 CURED ADHESIVE PHYSICAL PROPERTIES 3.5.1 Sample Preparation A cured sheet of silicone adhesive shall be prepared by curing a 1:1 ratio of parts A and B in a ASTM flat sheet mold (127 x 127 x 1.90 mm). The silicon
8、e shall be cured at 150 C for 30 minutes. 3.52 Colr Grey 3.5.3 Specific Gravity, range 1.62 - 1.66 (ASTM D 792, Method A) 3.5.4 Non-Volatile, min 99 % (ASTM D 2369) 3.5.5 Silicone Volatiles, max 0.7 % (FLTM AV 102-01, report D4 through D10 and L4 through L10) 3.5.6 Ash, max (ISO 3491, Method A, 760
9、+/- 30 C) 95.8 weight % 3.5.7 Odor Meets requirements The adhesive shall be free from objectionable or irritating odors, both as received and at application temperatures. 3.6 CURED ADHESIVE PERFORMANCE REQUIREMENTS 3.6.1 Adhesion, min 1.4 MPa (ISO 4587/ASTM D 1002) Test Method: Prepare lap shear sam
10、ples using 1.62 mm thick, coversion coated 5052-H32 aluminum as the substrates. Cure adhesive for 30 minutes at 150 C. Adhesive boundline to be 0.08 to 0.15 mm thick. 3.6.2 Thermal Conductivity, min 0.7 W/m C (ASTM F 433, 40 to 150 C, use a 0.15 mm thick sample) 3.6.3 Volume Resistivity, min 1 x 10E
11、E15 -cm (IEC 93/ASTM D 257) ENGINEERING MATERIAL SPECIFICATION WSF-M2G378-A Page 3 of 3 Copyright 2002, Ford Global Technologies, Inc. 3.6.4 Surface Resistivity, min 1 x 10EE14 (IEC 93/ASTM D 257) 3.6.5 Dielectric Constant, range 9.8 - 10.6 (ASTM D 150, 10 MHz) 3.6.6 Hardness, Durometer A, range 59
12、- 69 (ISO 868/ASTM D 2240) 3.7 SHELF LIFE, min 3 months Manufacturer shall certify that the material will meet the specification when stored in the original sealed container at 35 C for the specified period. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 RECOMMENDED CURE SCHEDULES 100 C for 120 minutes 120 C for 60 minutes 150 C for 30 minutes
