1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2004 02 20 Revised Para 3.0 inserted; para 3.1, 3.2, 3.3, 3.8 and 4 deleted para 3.6.4 revised W. Scholz 1994 08 03 EP00E10428885000 WSK-M3G184-A4 added W. Scholz 1992 03 02 EP00E10176262000 Released KW, conc. J. Schult Printed copies are unco
2、ntrolled Copyright 2004, Ford Global Technologies, LLC Page 1 of 2 TAPE, PRESSURE SENSITIVE ADHESIVE, TWO SIDED, EXTERIOR, WSK-M3G184-A1 POLYETHYLENE/VINYLACETATE TAPE, PRESSURE SENSITIVE ADHESIVE, TWO SIDED, EXTERIOR, WSK-M3G184-A3 CHLOROPRENE/NEOPRENE TAPE, PRESSURE SENSITIVE ADHESIVE, TWO SIDED,
3、EXTERIOR, WSK-M3G184-A4 POLYETHER 1. SCOPE The materials defined by these specifications are adhesive foam tapes based on polymer material. The tapes are protected by release paper or polymer liner. 2. APPLICATION WSK-M3G184-A1: This specification was released originally for materials used for retai
4、ning bodyside moldings as well as emblems to painted surfaces and to bond rubber parts to bumpers. WSK-M3G184-A3/A4: This specification was released originally for materials used for fixing script ornaments, emblems and moldings. 3. REQUIREMENTS Adhesive tapes according to these specifications shall
5、 meet the requirements of the performance specification as required on Engineering Drawing, e.g. WSK-M11P48-A for weatherstrip application, WSK-M11P49-A for Body Side Moldings, WSK-M11P50-A for bumper inserts or WSK-M11P51-A for emblems. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material su
6、ppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 PREPARATION OF TEST PANELS Resistance tests shall be conducted using stainless steel panels (ASTM D 1000) 125 x 50 mm, unless otherwise noted. Test Panels shall be cleaned wit
7、h laboratory grade wiping paper and Acetone prior to applying the tape. The tape shall be applied to the sample with liner. Use of primer is not permitted. Test specimens shall be aged for 72 hours at room temperature prior to testing unless otherwise specified. 3.5 MATERIAL PROPERTIES 3.5.1 Dimensi
8、ons As specified on Engineering Drawing 3.5.2 Color As specified on Engineering Drawing ENGINEERING MATERIAL SPECIFICATIONWSK-M3G184-A1/A3/A4 Printed copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 2 of 2 3.5.3 Density, kg/m3Must be within +/- 10% (ASTM D 3574, A) of initi
9、al sample 3.6 RESISTANCE PROPERTIES The figures below are minimum requirements. The original values and the type of failure (cohesive/adhesive failure) shall be noted in the Initial Sample Report. 3.6.1 90 Peel Adhesion, N/cm, min (FLTM BU 112-02, Method A) A1 A3 A4 20 minutes RT 7 5.5 6 72 hours RT
10、 15 5.5 7.5 3.6.2 T-Peel Adhesion, N/cm, min 10 9 7.5 (FLTM BU 112-02, Method B) 3.6.3 T-Block Adhesion, N/cm2, min* 80 45 55 (FLTM BU 112-02, Method D) 3.6.4 Dynamic Shear Adhesion, N/cm2, min* 70 55 88 (FLTM BU 101-06, Method A) * For initial approval only. 3.6.5 Tensile Strength, N/cm2, min 200 1
11、70 200 (ASTM D 412, Die C) 3.6.6 Elongation, %, min 440 200 300 (ASTM D 412, Die C, 500 mm/minute) 3.7 QUALITY The adhesive tapes must be adaptable for application in accordance with the appropriate Ford Motor Company Process Specification. The adhesive tapes must be compatible with all related mate
12、rials, e.g. paint materials, primers, substrate materials, etc. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of these specifications. 5.1 STORAGE STABILITY 12 months Storage at temperatures below 30 C or according supplie
13、rs technical data sheet. The release liner shall remove easily when measured by hand peel examination and shall not change appreciably after storage. 5.2 MATERIAL REFERENCE All related materials as well as the tape dimensions, used for approval of adhesive tapes according to this specification, e.g. paint materials, cleaners or substrate materials, shall be noted in the Initial Sample Report of the tape. 5.3 MINIMUM APPLICATION TEMPERATURE 15 C The adhesive tape shall not be used if the temperature of the parts to be bonded is below 15 C.
