1、 ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions 2015 02 03 N Status No replacement named L. Sinclair, NA 2003 03 28 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.8, 3.9, 4 deleted 1995 09 14 Activated S. DeGrood Page 1 of 3 Copyright 2015, Ford Global
2、 Technologies, Inc. ADHESIVE, TWO COMPONENT SILICONE, THERMALLY WSS-M2G385-A2 CONDUCTIVE, HIGH DIELECTRIC STRENGTH NOT TO BE USED FOR NEW DESIGN 1. SCOPE The material defined by this specification is a two component, primerless, thermal conducting, solvent free, thermally conductive adhesive. This m
3、aterial shall consist of vinyl terminated polydimethyl siloxane, platinum catalyst, adhesion promoters and alumina powder, with glass bead spacer material. 2. APPLICATION This specification was originally released as an adhesive to bond an anti-lock brake circuit board to an aluminum base plate hous
4、ing assembly. The material is intended to function as a dielectric adhesive as well as a thermal transfer compound. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WS
5、S-M99P1111-A). 3.4 CONSTITUENT MATERIALS 3.4.1 Adhesive Type Addition Cured Polydimethylsiloxane 3.4.2 Particle Size (ASTM C 925) Weight percent of alumina particles only, 99 % less than 50 microns. Weight percent of total material 0.3 - 0.4 % Average Particle Size - Spacer Beads only 125 - 175 micr
6、ons (distribution 85 %) ENGINEERING MATERIAL SPECIFICATION WSS-M2G385-A2 Page 2 of 3 Copyright 2015, Ford Global Technologies, Inc. 3.4.3 Specific Gravity, range (ASTM D 792, Method A) Part A 2.00 - 2.20 kg/L Part B 2.00 - 2.20 kg/L 3.4.4 Viscosity, mPa-s, range (ISO 2555, Brookfield RVF, # 5 spindl
7、e) Part A (20 rpm) 4050 - 8759 mPa.s Part B (20 rpm) 4500 - 7000 mPa.s Viscosity ratio, A/B 0.9 - 1.25 3.4.5 Thixoratio, part A only, at 2 rpm/ 1.75 20 rpm, max 3.5 CURED ADHESIVE PHYSICAL PROPERTIES 3.5.1 Sample Preparation A cured sheet of silicone adhesive shall be prepared by a curing a 1:1 rati
8、o of parts A and B in a ASTM flat sheet mold (127 x 127 x 1.90 mm). The silicone shall be cured at 150 C for 30 minutes. 3.5.2 Color Gray 3.5.3 Specific Gravity, range 2.10 - 2.20 (ASTM D 792, Method A) 3.5.4 Non-Volatile, min 99 % (ASTM D 2369) 3.5.5 Silicone Volatiles, max 0.7 % (FLTM AV 102-01, r
9、eport D4 through D10 and L4 through L10) 3.5.6 Ash, max 95.8 weight % (ISO 3491, Method A, 760 +/- 30 C ) 3.5.7 Cure Rate, ASTM D5289, Monsanto 4.5 min Oscillatory Disk Rheometer, T-90 time at 125 C 3.5.8 Odor The adhesive shall be free from objectionable or irritating odors, both as received and at
10、 application temperatures. ENGINEERING MATERIAL SPECIFICATION WSS-M2G385-A2 Page 3 of 3 Copyright 2015, Ford Global Technologies, Inc. 3.6 CURED ADHESIVE PERFORMANCE REQUIREMENTS 3.6.1 Adhesion, min 1.9 MPa (ISO 4587/ASTM D1002 lap shear, 2024 T3 aluminum alclad, cure sample 1 h at 125 C . Adhesive
11、bondline to be 20 mils.) Test Method: Prepare lap shear samples using 1.62 mm thick, coversion coated 5052-H32 aluminum as the substrates. Cure adhesive for 30 minutes at 150 C . Adhesive bondline to be 0.08 to 0.15 mm thick. 3.6.2 Thermal Conductivity, min 0.85 W/m C (ASTM F 433, 40 to 150 C , use
12、a 0.15 mm thick sample) 3.6.3 Volume Resistivity, min 1x10E13 ohm-cm (ASTM D 257/IEC 93) 3.6.4 Dielectric Strength, min 15.7 kV/mm (ASTM D 149) 3.6.5 Dielectric Constant, max 5.0 (ASTM D 150, 10 MHz) 3.6.6 Hardness, Durometer A, range 60 - 80 (ISO 868/ASTM D 2240) 3.7 SHELF LIFE, min 1 month at 35 C
13、 3 months at 25 C 4 months at 5 C Manufacturer shall certify that the material will meet the specification when stored in the original sealed container at the specified temperatures for the specified time periods. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 RECOMMENDED CURE SCHEDULES 100 C for 120 minutes 125 C for 30 minutes 150 C for 15 minutes
