1、 EIA ENGINEERING BULLETIN Diminishing Manufacturing Sources and Material Shortages (DMSMS) Management Practices GEB1 NOVEMBER 2000 ELECTRONIC INDUSTRIES ALLIANCE GOVERNMENT ELECTRONICS AND INFORMATION TECHNOLOGY ASSOCIATION ENGINEERING DEPARTMENT A SECTOR OF GEB1Copyright Government Electronics that
2、 is, the effects are addressed only when they are seen. This reactive approach to DMSMS solutions leads to decisions that put a premium on faster solution paths with attractive short-term gains in order to avoid system inoperability, while ignoring the long-term solution paths that would lead to gen
3、eric families of solutions or larger-scale solutions with the capability of avoiding future DMSMS issues. In order to solve DMSMS issues with lower overall cost, DMSMS solutions must change from reactive to proactive. The building blocks of effective proactive management of DMSMS are established dur
4、ing the design and development of systems. If systems are designed with the inevitability of DMSMS in mind, early solution paths with large-scale solutions can be started at an appropriately early time to enable intelligent choices without the imminent threat of system inoperability. Such generic la
5、rge-scale solutions and a consensus on where DMSMS threats are most prevalent can be better forecasted by the use of a standard set of DMSMS management practices used by the foremost members of industry. The creation, dissemination, and widespread use of such a standard can greatly help the cause of
6、 proactive management of DMSMS. This guideline presents a set of management practices that can be used by original equipment manufacturers (OEMs) during the design and development of military electronic systems to mitigate the effects of DMSMS. Such practices will help future builders and modifiers
7、of DoD weapon systems to design proactively to address the issues of future component obsolescence. Copyright Government Electronics Shaw, J. “Product Life Cycles and Product Management,“ Quorum Books, New York, New York, 1989 Copyright Government Electronics for example, certain linear devices aver
8、age less than 14.5 years while some microprocessors and memories average less than 5 years. The following shows the average introduction rate for new generations of commercial integrated circuits4: Device Category Average Introduction Rate Logic Families 6 years Memory Families 9 months Microprocess
9、ors 2 yearsDigital Signal Processor (DSP) 3 years Programmable Logic Device (PLD) 1 year Linear Interfaces 8 years Gate Arrays 2 years Observations from various industry sources indicate that these average introduction rates have gotten shorter in more recent years. 2Pecht, M.G.; Das D. “Electronic
10、Part Life Cycle,“ IEEE Transactions on Components and Packaging Technologies, Volume 23 Issue 1, March 2000, pp.190-192 3Bick, E. (TACTech Inc.). “New validate the manufacturing or production process; and, demonstrate system capabilities through testing. Continued trade studies, Value Engineering Ch
11、ange Proposals (VECP), design analysis, spares and permit an orderly increase in the production rate for the system, sufficient to lead to full-rate production upon successful completion of operational testing. LRIP provides key opportunity to update and validate available knowledge to reflect actua
12、l schedules, parts Magrab, E.B.; Anand, D.K.; Eisinger, K.; McLeish, J.G.; Torres, M.A.; Lall, P.; Dishongh, T.J. “Perspectives To Understand Risks In The Electronic Industry,“ IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Volume 20 Issue 4, Dec. 1997, pp.542-547
13、7Hitt, E.F.; Schmidt, J. “Technology Obsolescence (TO) Impact On Future Costs,“ Proceedings of the 17th Digital Avionics Systems Conference (DASC), 1998, AIAA/IEEE/SAE, Volume 1, pp.A33-1 - A33-7 Stage 1IntroductionStage 2GrowthStage 3MaturityStage 4SaturationStage 5DeclineStage 6Phase-OutMicrocircu
14、it Lifecycle0 50 100YearsNotional Projected LifetimeDevelopmentStartBase Model IOCPlanned Phase Out(Last Model)Extended Life2017+ 86+ YearsKC-135195719542040+ 94+ YearsB-52195519462010+51+ YearsF-15197519692010+41+ YearsF-141973196949+ YearsUH-119591955UNITED STATESARMY2026+56+ YearsSSN 688197619702
15、025+ 72+ YearsAIM-9195519532004+Copyright Government Electronics the DMSMS mitigation approaches applied will vary depending on the electronic system involved and applicable acquisition phase of the program. Electronic System Life Cycle Vs. DMSMS Mitigation Approaches Phase 0 Phase I Phase II Phase
16、III Concept Exploration Program Definition and Risk Reduction EMD / LRIP Production, Fielding / Deployment, Lachenmaier, R.N.; Messing, J.P.; Frink, A. “Architectures for Next Generation Military Avionics Systems,“ IEEE 1998 Aerospace Conference, 1998 Volume 1, pp.265-281 Copyright Government Electr
17、onics Concha, L.; Bohannan, R. “VHDL Design Environment For Legacy Electronics (VDELE),“ Proceedings of the VHDL International Users Forum, 1997, IEEE, pp.162-169 Fitzhugh, G.L. “Rapid Retargeting - A Solution To Electronic Systems Obsolescence,“ Proceedings of the IEEE 1998 National Aerospace and E
18、lectronics Conference (NAECON 1998), pp.169-176 Copyright Government Electronics RAM-based devices are reconfigured dynamically. Field Programmable Gate Arrays (FPGAs) combine the integration of an ASIC with the flexibility of user-programmed logic. FPGAs present the user with basic cells and interc
19、onnect resources, which serve as the building blocks for design implementation. Users specify their design with a schematic or hardware description language. This design is then converted to a vendor-specific format with the components of the design mapped onto the basic cells of the FPGA. Once the
20、design has been successfully simulated, interconnect resources are programmed by the user. FPGAs are extremely useful in migrating existing designs to new hardware technology and are, therefore, an effective means to mitigate microelectronics obsolescence. Though specific FPGA families are discontin
21、ued as frequently as other integrated circuit technologies, they can be cost-effectively transitioned to new technologies using the hardware description from the original FPGA design. 11Barker, D. “Why Are People Always Talking About VHDL?“ 16 Aug. 1999. http:/www.ml.afrl.af.mil/ib/dpdsp/AFMC_VHDL_A
22、rticle.PDF (23 Nov. 2000). Copyright Government Electronics Bate, I.; Grigg, A. “Portable Code: Reducing the Cost of Obsolescence In Embedded Systems,“ Computing Garcia, M.L. “Technology Roadmapping: The Integration of Strategic and Technology Planning for Competitiveness,“ Innovation in Technology
23、Management - The Key to Global Leadership. PICMET 97: Portland International Conference on Management and Technology, 1997, IEEE, pp.25-28 Copyright Government Electronics it includes costs associated with delivery issues, component failure detection in receiving and assembly manufacturing, failed c
24、omponent troubleshooting (part replacement and system regression testing), availability lifetimes, etc. Data on each of these factors should be gathered and analyzed in order to properly gauge these latter costs, and these in turn should be an integral part of the Total Ownership Cost equation. The
25、acquisition cycle front end also includes all System Engineering activities performed to preclude or minimize DMSMS cases from developing during the acquisition cycle. Most of these activities occur during the design phases (i.e., Concept Exploration through E manufacturingcapabilities; producibilit
26、y DMSMS resolution alternativesReview and SelectBest Alternative(s)Periodically Repeatand Refine Potential Vendors Risk Assessment Status of requirements Current Funding Profile Update algorithms Revise product andtechnology status Adopt and revise schedule Contract options (vehiclesand methods) Alt
27、ernatives for incentivizingproactive DMSMS practices Lessons learned- adjustprocesses? Technology roadmapadjustments Process improvements(e.g., DMEA FlexibleFoundry, GEM and VHDL) DMSMS status change sincestep 1?FurtherAnalysisRequired ?Technology InsertionSolution Cost avoided Schedule maintained P
28、erformanceenhancedYesNoCopyright Government Electronics McDermott, J.T. “DMSMS Teaming Group Process.“ 1998. http:/www.gidep.org/dmsms/initiatives/teamgroup.htm (23 Nov. 2000). Copyright Government Electronics & Information Technology Association Reproduced by IHS under license with GEIA Not for Res
29、aleNo reproduction or networking permitted without license from IHS-,-,-GEB1 22 4.1.6 Other System Design Approaches 4.1.6.1 Part Selection Guidelines When selecting components for use in new equipment designs, the life cycle of the components should be considered in order to minimize the negative i
30、mpact of obsolescence during product development and subsequent product support. New design activity should focus on selecting devices that are in the early stages of their product life cycle. When selecting device manufacturers, consideration should be given to those manufacturers who have establis
31、hed agreements with aftermarket sources for product life cycle extension. Examples of industry guidelines that include consideration for component life cycles when selecting components are ANSI/AIAA-R100-1996 Parts Management, IEC CA-AWG/1/DC Component Management Plans, and CENELEC ES 59010 Electron
32、ic Component Policy and Management Programme. SD-18, Defense Standardization Program Guide for Part Requirements and Application, provides part acquisition guidelines for Program Managers (PMs)/System Program Offices (SPOs) and original equipment manufacturers (OEMs). The database contains guidance
33、that enables OEMs to use military and commercially specified parts for military equipment. It provides guidance on how the DOD and its contractors can cooperatively select devices, which will result in the lowest cost of ownership for the DOD. 4.1.6.2 Part Documentation A process should be in place
34、to collect, store, and retrieve component data needed to address DMSMS issues that will arise in the future. For example, in cases where engineering drawings (e.g. SCDs) were used in conjunction with design disclosure packages, these drawings would be used in conjunction with evaluating candidate re
35、placement parts. Component data to be considered may include the original device manufacturers data sheet, application data, qualification data, etc. For complex devices, functional and behavioral level models (e.g. VHDL) should be included to allow designs to be cost-effectively transitioned to new
36、 technologies. 4.1.7 Executive Agent for DoD Microelectronics DMSMS The Defense Microelectronics Activity (DMEA) has been designated the Executive Agent for DoD Microelectronics DMSMS. As such, DMEA develops and coordinates solutions to DoDs obsolescence problems and is responsible for issues relati
37、ng to IC microelectronics DMSMS. These responsibilities include: Develop partnerships with the military services, other DoD and non- DoD organizations, the Semiconductor Industry, and Electronics Manufacturing Industry to foster cooperation and achieve a joint resolution to current and/or potential
38、DMSMS issues that affect the DoD. Advocate and develop cost-effective technical solutions to the DoDs IC Microelectronics DMSMS problems. Implement an “IC Clearinghouse“ for IC problems and solutions in order to provide a vehicle to talk about common DMSMS problems, and share in the solutions. Devel
39、op guidelines and strategies in conjunction with the military services and DLA that will help weapon system program managers effectively manage and mitigate microelectronics obsolescence and related issues. Provide design recommendations for mitigating microelectronics obsolescence throughout the li
40、fe cycle of a weapon system. Copyright Government Electronics & Information Technology Association Reproduced by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEB1 23 4.1.7.1 Flexible Foundry DMEAs Flexible Foundry is being developed t
41、o support obsolete 5-volt semiconductors that the commercial industry has abandoned in the pursuit of newer lower voltage technologies. The program was implemented after the commercial semiconductor industry made the understandable and justifiable business decision to no longer produce parts for the
42、 low-volume, long-product-cycle military market. DMEAs Flexible Foundry solves this problem by licensing and fabricating proven industry microelectronics processes. This allows DoD to obtain its small volume requirements from DMEAs Flexible Foundry while large volume orders are supplied by industry.
43、 The flexible foundry provides a diverse mix of functions ranging from personalization of device and gate arrays to full custom fabrication of ASICs. Copyright Government Electronics & Information Technology Association Reproduced by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-
