1、 GEIA STANDARD Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder GEIA-STD-0005-1 June 2006 GOVERNMENT ELECTRONICS AND INFORMATION TECHNOLOGY ASSOCIATION GEIA-STD-0005-1ANSI/GEIA-STD-0005-1 Approved: February, 07 2007 Copyright Government Electroni
2、cs and was balloted and approved by GEIA G-12 (Solid State Subcommittee) and the GEIA Avionics Process Management Committee This standard is intended to work in concert with GEIA-HB-0005-1, GEIA-HB-0005-2, and GEIA-STD-0005-2. Figure 1 shows a schematic representation of their relationships with eac
3、h other, and with information about lead-free (Pb-free) electronics from sources external to the AHP industries. This standard may be referenced in proposals, requests for proposals, work statements, contracts, and other aerospace and high performance industry documents. Introduction The European Un
4、ion (EU) has enacted two directives; 2002/95/EC Restriction of Hazardous Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that restrict or eliminate the use of various substances in a variety of products that are put on the market after July 2006. One of the key mate
5、rials restricted is lead, which is widely used in electronic solder and electronic piece part terminations. These regulations may appear to affect only products for sale in the EU; however, due to the reduced market share of the AHP industries, many of the lower tier suppliers to those industries wi
6、ll change their products to serve their primary, non-AHP markets. Additionally, several U.S. states have enacted similar “green” laws and many Asian electronics manufacturers have recently announced completely green product lines. Since AHP is one of the few major industrial sectors that still repai
7、r Circuit Card Assemblies (CCAs) and the lead-free materials and processes are relatively immature and poorly understood, an aerospace-wide approach to their application is desired. AHP industries products may be in one of a number of stages of the incorporation of Pb-free electronics, including: (1
8、) Products that have been designed and qualified with traditional tin-lead (SnPb) electronic piece parts, materials, and assembly processes, and that will need to be maintained in the SnPb configuration. (2) Products that have been designed and qualified with traditional SnPb electronic piece parts,
9、 materials and assembly processes, and have incorporated Pb-free electronic piece parts; (3) Products that have been designed and qualified with SnPb materials, and are incorporating Pb-free materials; (4) New products designed with Pb-free materials. ii Copyright Government Electronics and is inten
10、ded to address issues that are unique to those industries. Some applications may have unique requirements that exceed the scope of this standard, and should be covered separately. 2. Normative References IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. IPC/EIA J-STD-002
11、, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires. IPC/EIA J-STD-0003, Solderability Tests for Printed Boards. IPC/EIA J-STD-005, Requirements for Soldering Pastes. IPC/EIA J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid So
12、lders for Electronic Soldering Applications. IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices. IPC/EIA J-STD-028, Performance Standard for FlipChip/Chip Scale Bumps. IPC/JEDEC J-STD-033, Standard for Handling, Packing, and Shipping an
13、d Use of Moisture/Reflow Sensitive Surface Mount Devices. ARINC Project Paper 671: Guidelines for Lead-free Soldering, Repair, and Rework, draft 1, 31 March 2005. GEIA-HB-0005-1, Program Managers Handbook for Managing the Transition to Lead-free Electronics (in draft). 1This standard was developed p
14、rimarily for aerospace products; however, it also may be applicable, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged environments, high reliability, long lifetime, and repairability. Other industries may use this standard by substituting the na
15、me of their industry for the word “aerospace” in this standard. 1 Copyright Government Electronics examples include circuit cards and wire harnesses. Critical item or function, if defective, will result in the systems inability to retain operational capability, meet primary objective, or affect safe
16、ty. Customer refers to an entity or organization that (a) integrates a piece part, soldered assembly, unit, or system into a higher level system, (b) operates the higher level system, or (c) certifies the system for use. For example, this may include end item users, integrators, regulatory agencies,
17、 operators, original equipment manufacturers (OEMs), and subcontractors. 2 Copyright Government Electronics Piece parts supplied with solder ball technology; Solder alloys containing bismuth; 7 Copyright Government Electronics and Assure that repair, rework, and maintenance documents issued by the s
18、ystem design authority are consistent with the design authoritys Plan. Assure that sufficient information is provided to enable the repair and rework facility to use alloys, materials, finishes, and processes that are compatible with the item being repaired or reworked. NOTE 1: AT THE TIME OF PUBLIC
19、ATION OF THIS STANDARD, THE TIN-SILVER-COPPER (SAC) SYSTEM IS ONE OF THE MORE LIKELY PB-FREE ALLOYS THAT WILL BE USED TO REPLACE SNPB ALLOYS FOR ASSEMBLY OF HIGH-RELIABILITY ELECTRONIC SYSTEMS. BASED ON THE BEST CURRENT TECHNICAL INFORMATION, THE SAC SYSTEM IS A LIKELY ALLOY OF CHOICE FOR REPAIR AND
20、 REWORK FACILITIES, AND WITH PROPER UNDERSTANDING AND CONTROL, CAN BE COMPATIBLE WITH SNPB ALLOYS. THEREFORE, IT IS RECOMMENDED THAT EQUIPMENT DESIGNED WITH PB-FREE SOLDER AND FINISHES BE REPARABLE WITH ALLOYS BASED ON THE SAC SYSTEM. USERS OF THIS STANDARD ARE ADVISED TO VERIFY THIS OBSERVATION, AN
21、D TO STAY CURRENT WITH DEVELOPMENTS IN THIS AREA. NOTE 2: THE COMPOSITION RANGES FOR THE MAJOR CONSTITUENT ALLOYS OF THE SAC SYSTEM ARE: TIN: 95.5 96.5% SILVER: 3.0 4.0% COPPER: 0.5 0.7% ALL OTHERS: 0.1% The repair, rework, maintenance, and support facility shall: Assure that all repair, rework, mai
22、ntenance, and support processes are documented, and are in compliance with the requirements of the Plan; 10 Copyright Government Electronics (2) Removal of the solder material from the printed wiring board; (3) Attachment of the replacement piece part, using a solder alloy material that is verified
23、as compatible with alloy and finish of the piece part, and a controlled reflow process; (4) Related processes such as cleaning, underfill, etc. 7 Plan Administrative Requirements 7.1 Plan organization The Plan shall be organized in such a manner that each of the requirements of Clause 6 is addressed
24、 clearly, concisely, unambiguously; and in a manner that is verifiable by the customer or the customers representative. NOTE: FIGURE 1 SHOWS THE RELATIONSHIP BETWEEN THIS STANDARD AND OTHER SELECTED DOCUMENTS; AND FIGURE 2 SHOWS THE SUGGESTED STRUCTURE OF A PLAN. 7.2 Terms and definitions The terms
25、and definitions used in the Plan shall be those of Clause 3 of this standard, unless they are clearly defined otherwise in the Plan. 7.3 Plan focal authority The Plan shall identify a focal authority, internal to the Plan owner, with the following responsibilities: Act as the primary interface betwe
26、en the Plan owner and outside parties in matters pertaining to the Plan; Assure that the Plan is reviewed and updated as necessary; and Ensure that all technical and administrative issues are resolved in a timely manner. 7.4 References The Plan shall include a list of references to all the documents
27、 referenced in the Plan, including this standard, other industry and government documents, and the Plan owners internal documents. 7.5 Plan applicability The Plan shall document all the product types, families, or technologies to which the Plan applies. 11 Copyright Government Electronics BUT IT MAY
28、 BE MODIFIED, OR TAILORED, TO SATISFY INDIVIDUAL PROGRAM OR PRODUCT REQUIREMENTS. IN THIS CASE, THE BASELINE PLAN REMAINS IN EFFECT, AND THE MODIFIED PLAN BECOMES A PROGRAM-SPECIFIC PLAN. NOTE 2: A TYPICAL MODIFICATION WOULD BE TO TAILOR THE BASELINE PLAN TO ADDRESS ISSUES SPECIFIC TO A GIVEN PROGRA
29、M OR PRODUCT, TO INCLUDE PROCESSES THAT THE PLAN OWNER DOES NOT INTEND TO USE FOR ALL PROGRAMS OR PRODUCTS. NOTE 3: THE TYPICAL MODIFICATION WOULD BE TO ADD PROGRAM- OR PRODUCT-SPECIFIC REQUIREMENTS. THE PROGRAM COST OF THESE REQUIREMENTS COULD THEN BE DETERMINED AND MADE AVAILABLE FOR PROGRAM MANAG
30、EMENT DECISIONS. NOTE 4: IF THE BASELINE PLAN IS PERMANENTLY MODIFED, IT IS SUPERSEDED BY THE MODIFIED PLAN, WHICH THEN BECOMES THE NEW BASELINE PLAN. NOTE 5: WITHIN THE AEROSPACE AND MILITARY INDUSTRIES, SPACE-RELATED PROGRAMS ARE KNOWN TO HAVE REQUIREMENTS THAT MAY NOT BE APPLICABLE TO PRODUCTS US
31、ED IN ATMOSPHERIC ENVIRONMENTS. In the event that a Plan is changed, a process shall be in place to notify all entities that are affected by the change. 12 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or n
32、etworking permitted without license from IHS-,-,-GEIA-STD-0005-1 Science Projects:JEITA, JG-PP, Soldertech, NEMI, NCMS, Part mfrs., PWB Assemblers, automotive mfrs., etc.GEIA-HB-0005-2, Technical GuidelinesGEIA-STD-0005-1, Performance StandardGEIA-STD-0005-2, Effects of Tin StandardIndustry specific
33、ations:IPC, IEC, JEDEC, etc.Available External ResourcesGEIA-HB-0005-1, Program Managers HandbookFigure 1. Relationship of documents GEIA-STD-0005-1, GEIA-STD-0005-2, GEIA-HB-0005-1, and GEIA-HB0005-2 with each other, and with information about Pb-free electronics from sources external to the aerosp
34、ace and high performance electronics industries. Plan for Using Lead-free Solder in Aerospace Applications, Clause 4Technical Requirements, Clause 66.1, 6.2. 6.3, 6.5, References to Documented ProcessesAdministrative Requirements, Clause 7Documented Processes6.4, Plan Compliant to GEIA-STD-0005-26.4
35、, Reference to Plan Compliant to GEIA-STD-0005-2Performance Plan Compliant to GEIA-STD-0005-1Figure 2. Schematic diagram of the content of a Performance Plan compliant to GEIA-STD-0005-1. 13 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA
36、 Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEIA-STD-0005-1 This page intentionally left blank. 14 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitt
37、ed without license from IHS-,-,-GEIA Document Improvement Proposal If, in the review or use of this document, a potential change is made evident for safety, health, or technical reasons please fill in the appropriate information below and mail or FAX to: Government Electronics and Information Techno
38、logy Association (GEIA) Standards & Technology Department 2500 Wilson Blvd. Arlington, VA 22201 FAX: (703) 907-7968 Document No. Document Title: Submitters Name: Telephone No.: FAX No.: E-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and/or Drawing: b.
39、 Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR GEIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-
