1、 I n t e r n a t i o n a l T e l e c o m m u n i c a t i o n U n i o n ITU-T K.102 TELECOMMUNICATION STANDARDIZATION SECTOR OF ITU (08/2014) SERIES K: PROTECTION AGAINST INTERFERENCE Parameters of fixed-voltage thyristor overvoltage protector components used for the protection of telecommunication i
2、nstallations Recommendation ITU-T K.102 Rec. ITU-T K.102 (08/2014) i Recommendation ITU-T K.102 Parameters of fixed-voltage thyristor overvoltage protector components used for the protection of telecommunication installations Summary Recommendation ITU-T K.102 defines the basic electrical parameters
3、 to be met by fixed-voltage thyristor overvoltage protector components used for the protection of telecommunications equipment or lines from surges. Examples of equipment include those located either within a telecommunications centre b-ITU-T K.20, customer premises b-ITU-T K.21, in access or in tru
4、nk networks b-ITU-T K.45. It is intended that this Recommendation be used for the harmonization of existing or future specifications issued by thyristor surge protective component manufacturers, telecommunication equipment manufacturers, administrations or network operators. History Edition Recommen
5、dation Approval Study Group Unique ID* 1.0 ITU-T K.102 2014-08-29 5 11.1002/1000/12292 Keywords Electrical characteristics, electrical ratings, overvoltage protection, surge protective component (SPC), test methods, thyristor. _ * To access the Recommendation, type the URL http:/handle.itu.int/ in t
6、he address field of your web browser, followed by the Recommendations unique ID. For example, http:/handle.itu.int/11.1002/1000/11830-en. ii Rec. ITU-T K.102 (08/2014) FOREWORD The International Telecommunication Union (ITU) is the United Nations specialized agency in the field of telecommunications
7、, information and communication technologies (ICTs). The ITU Telecommunication Standardization Sector (ITU-T) is a permanent organ of ITU. ITU-T is responsible for studying technical, operating and tariff questions and issuing Recommendations on them with a view to standardizing telecommunications o
8、n a worldwide basis. The World Telecommunication Standardization Assembly (WTSA), which meets every four years, establishes the topics for study by the ITU-T study groups which, in turn, produce Recommendations on these topics. The approval of ITU-T Recommendations is covered by the procedure laid d
9、own in WTSA Resolution 1. In some areas of information technology which fall within ITU-Ts purview, the necessary standards are prepared on a collaborative basis with ISO and IEC. NOTE In this Recommendation, the expression “Administration“ is used for conciseness to indicate both a telecommunicatio
10、n administration and a recognized operating agency. Compliance with this Recommendation is voluntary. However, the Recommendation may contain certain mandatory provisions (to ensure, e.g., interoperability or applicability) and compliance with the Recommendation is achieved when all of these mandato
11、ry provisions are met. The words “shall“ or some other obligatory language such as “must“ and the negative equivalents are used to express requirements. The use of such words does not suggest that compliance with the Recommendation is required of any party. INTELLECTUAL PROPERTY RIGHTSITU draws atte
12、ntion to the possibility that the practice or implementation of this Recommendation may involve the use of a claimed Intellectual Property Right. ITU takes no position concerning the evidence, validity or applicability of claimed Intellectual Property Rights, whether asserted by ITU members or other
13、s outside of the Recommendation development process. As of the date of approval of this Recommendation, ITU had not received notice of intellectual property, protected by patents, which may be required to implement this Recommendation. However, implementers are cautioned that this may not represent
14、the latest information and are therefore strongly urged to consult the TSB patent database at http:/www.itu.int/ITU-T/ipr/. ITU 2015 All rights reserved. No part of this publication may be reproduced, by any means whatsoever, without the prior written permission of ITU. Rec. ITU-T K.102 (08/2014) ii
15、i Table of Contents Page 1 Scope . 1 2 References . 1 3 Definitions 3 3.1 Terms defined elsewhere 3 3.2 Terms defined in this Recommendation . 6 4 Abbreviations and acronyms 6 5 Conventions 7 6 Service conditions . 8 6.1 Normal service conditions 8 6.2 Storage temperature range, Tstgmin to Tstgmax .
16、 9 7 Electrical requirements . 9 7.1 Electrical characteristics . 9 7.2 Electrical ratings . 12 8 Test methods . 14 8.1 Electrical characteristics . 14 8.2 Electrical ratings . 20 9 Preferred values 24 9.1 V(BO) and VDRM 24 9.2 CO, VDRM and IPP . 25 9.3 IH 26 9.4 IPP and time to half value (duration
17、) . 26 10 Informative characteristics 27 10.1 Variation of holding current with temperature . 27 10.2 Variation of breakover voltage with temperature . 28 10.3 Variation of repetitive peak off-state voltage with temperature . 28 10.4 Variation of capacitance with voltage 29 10.5 Variation of non-rep
18、etitive a.c. surge current with time 29 11 Environment tests . 30 11.1 Robustness of terminations . 30 11.2 Solderability . 31 11.3 Resistance to soldering heat . 31 11.4 Vibration . 32 11.5 Bump 32 11.6 Rapid changes of temperature 32 11.7 Climatic sequence . 32 11.8 Damp heat, steady state 33 11.9
19、 Fire hazard 33 iv Rec. ITU-T K.102 (08/2014) Page 11.10 Solvent resistance of marking 33 11.11 Component solvent resistance 33 12 Identification . 33 12.1 Marking 33 12.2 Documentation . 34 13 Ordering information 34 Bibliography. 35 Rec. ITU-T K.102 (08/2014) 1 Recommendation ITU-T K.102 Parameter
20、s of fixed-voltage thyristor overvoltage protector components used for the protection of telecommunication installations 1 Scope Thyristor surge protective components (SPCs) are specially formulated thyristors designed to limit overvoltages and divert surge currents by clamping and switching actions
21、. This Recommendation applies to fixed-voltage thyristor overvoltage SPCs used in surge protective devices (SPDs) and telecommunications equipment ports to provide overvoltage protection for installations during lightning surges and AC power faults, in accordance with b-ITU-T K.11. Telecommunication
22、s equipment port test levels and criterion are defined by b-ITU-T K.20, b-ITU-T K.21 and b-ITU-T K.45, as appropriate and are supported by b-ITU-T K.44 with test circuit details and application guidance. This Recommendation covers fixed-voltage thyristor SPCs with a switching characteristic in the f
23、irst quadrant and a switching or blocking or conducting characteristic in the third quadrant. This Recommendation contains information on: a) terminology; b) letter and circuit symbols; c) essential electrical ratings and characteristics; d) rating verification and characteristic measurement; e) env
24、ironmental tests on packaging; f) identification and ordering information. It does not deal with: a) mountings and their effect on thyristor performance, the test results only apply for the mounting method used for that test; b) system signal performance such as insertion loss, see b-ITU-T G.117; c)
25、 mechanical dimensions; d) RoHS requirements; e) electrical overload; f) quality assurance requirements, see b-IEC 60738-1; g) specific cases of user agreed and regional values; h) conventional thyristors as covered by b-IEC 60747-6; i) gated thyristor SPCs. 2 References The following ITU-T Recommen
26、dations and other references contain provisions which, through reference in this text, constitute provisions of this Recommendation. At the time of publication, the editions indicated were valid. All Recommendations and other references are subject to revision; users of this Recommendation are there
27、fore encouraged to investigate the possibility of applying the most recent edition of the Recommendations and other references listed below. A list of the currently valid ITU-T Recommendations is regularly published. The reference to a document within this Recommendation does not give it, as a stand
28、-alone document, the status of a Recommendation. 2 Rec. ITU-T K.102 (08/2014) ITU-T K.96 Recommendation ITU-T K.96 (02/2014), Surge protective components: Overview of surge mitigation functions and technologies. IEC 60068-1 IEC 60068-1 ed5.0 (1988), Environmental testing Part 1: General and guidance
29、, plus Amendment 1 (1992). IEC 60068-2-1 IEC 60068-2-1 ed6.0 (2007), Environmental testing Part 2-1: Tests Test A: Cold. IEC 60068-2-2 IEC 60068-2-2 ed5.0 (2007), Environmental testing Part 2-2: Tests Test B: Dry heat. IEC 60068-2-6 IEC 60068-2-6 ed7.0 (2007), Environmental testing Part 2-6: Tests T
30、est Fc: Vibration (sinusoidal). IEC 60068-2-13 IEC 60068-2-13 ed4.0 (1983), Environmental testing Part 2-13: Tests Test M: Low air pressure. IEC 60068-2-14 IEC 60068-2-14 ed6.0 (2009), Environmental testing Part 2-14: Tests Test N: Change of temperature. IEC 60068-2-20 IEC 60068-2-20 ed5.0 (2008), E
31、nvironmental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads. IEC 60068-2-21 IEC 60068-2-21 ed6.0 (2006), Environmental testing Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices. IEC 60068-2-27 IEC
32、 60068-2-27 ed4.0 (2008), Environmental testing Part 2-27: Tests Test Ea and guidance: Shock. IEC 60068-2-29 IEC 60068-2-29 ed2.0 (1987), Environmental testing Part 2: Tests Test Eb and guidance: Bump. IEC 60068-2-30 IEC 60068-2-30 ed3.0 (2005), Environmental testing Part 2-30: Tests Test Db: Damp h
33、eat, cyclic (12 h+12 h cycle). IEC 60068-2-45 IEC 60068-2-45 ed1.0 (1980), Environmental testing Part 2-45: Tests Test XA and guidance: Immersion in cleaning solvents. IEC 60068-2-54 IEC 60068-2-54 ed2.0 (2006), Environmental testing Part 2-54: Tests Test Ta: Solderability testing of electronic comp
34、onents by the wetting balance method. IEC 60068-2-58 IEC 60068-2-58 ed3.0 (2004), Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD). IEC 60068-2-69 IEC 60068-2-69 ed2.0 (2
35、007), Environmental testing Part 2-69: Tests Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method. IEC 60068-2-78 IEC 60068-2-78 ed1.0 (2001), Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state. IEC 60695-11-5
36、IEC 60695-11-5 ed1.0 (2004), Fire hazard testing Part 11-5: Test flames Needle-flame test method Apparatus, confirmatory test arrangement and guidance. Rec. ITU-T K.102 (08/2014) 3 3 Definitions Where possible, terms, definitions, letter symbols and circuit diagram symbols are used from conventional
37、 thyristor b-IEC 60747-6 and rectifier diode b-IEC 60747-2 standards. 3.1 Terms defined elsewhere This Recommendation uses the following terms defined elsewhere: 3.1.1 Types of semiconductor component 3.1.1.1 bidirectional diode thyristor b-IEC 60050-521: Two-terminal thyristor having substantially
38、the same switching behaviour in the first and third quadrants of the current-voltage characteristic. 3.1.1.2 reverse conducting diode thyristor b-IEC 60050-521: Two-terminal thyristor which for negative anode voltage does not switch and conducts large currents at voltages comparable in magnitude to
39、the forward on-state voltage. 3.1.1.3 reverse blocking diode thyristor b-IEC 60050-521: Two-terminal thyristor which for negative anode voltage does not switch, but exhibits reverse blocking state. 3.1.1.4 (semiconductor) rectifier diode b-IEC 60050-521: Semiconductor diode designed for rectificatio
40、n and including its associated mounting and cooling attachments if integral with it. 3.1.1.5 thyristor b-IEC 60050-521: Bi-stable semiconductor device comprising three or more junctions which can be switched from the off-state to the on-state or vice versa. 3.1.2 General terms for semiconductor comp
41、onents 3.1.2.1 avalanche breakdown (of a PN junction) b-IEC 60050-521: Breakdown that is caused by the cumulative multiplication of charge carriers in a semi-conductor under the action of a strong electric field which causes some carriers to gain enough energy to liberate new hole-electron pairs by
42、ionization. 3.1.2.2 breakdown (of a reverse-biased PN junction) b-IEC 60050-521: Phenomenon, the initiation of which is observed as a transition from a state of high dynamic resistance to a state of substantially lower dynamic resistance for increasing magnitude of reverse current. 3.1.2.3 forward d
43、irection (of a PN junction) b-IEC 60050-521: Direction of current that results when the P-type semiconductor region is at a positive voltage relative to the N-type region. 3.1.2.4 reverse direction (of a PN junction) b-IEC 60050-521: Direction of current that results when the N-type semiconductor re
44、gion is at a positive voltage relative to the P-type region. 3.1.2.5 Zener breakdown (of a PN junction) b-IEC 60050-521: Breakdown caused by the transition of electrons from the valence band to the conduction band due to tunnel action under the influence of a strong electric field in a PN junction.
45、3.1.3 Component packaging 3.1.3.1 dual in-line package (DIP) b-IEC 61188-5-1: Rectangular component package that has a row of leads extending from each of the longer sides of its body that are formed at right angles to a plane that is parallel to the base of its body. 3.1.3.2 guarded measurement (th
46、ree terminal network) b-ITU-T K.95: Measurement technique that allows the direct impedance between two terminals to be measured correctly by applying a compensating voltage to the third terminal that removes the shunting effects of any impedances to the third terminal. 3.1.3.3 package b-IEC 60050-52
47、1: Enclosure for one or more chips, film elements or other components, that allows electrical connection and provides mechanical and environmental protection. 4 Rec. ITU-T K.102 (08/2014) 3.1.3.4 single in-line package (SIP) b-IEC 61188-5-1: Component package with one straight row of pins or wire le
48、ads. 3.1.3.5 surface mounting component b-IEC 61760-1: Electronic component designed for mounting on to terminal pads or conducting tracks on the surface of substrate. 3.1.3.6 surface-mount device, SMD b-IEC 60749-20-1: Plastic-encapsulated surface-mount devices made with moisture-permeable material
49、s. 3.1.3.7 surface-mount technology (SMT) b-IEC 61188-5-1: Technology where electrical connection of components is made to the surface of a conductive pattern of a printed board and does not utilize component lead holes. 3.1.3.8 surge protective component (SPC) ITU-T K.96: Component specifically included in a device or equipment for the mitigation of the onward propagation of overvolt
