JEDEC JEP113-B-1999 Symbol and Labels for Moisture-Sensitive Devices《湿敏器件用符号和标签》.pdf

上传人:inwarn120 文档编号:806948 上传时间:2019-02-05 格式:PDF 页数:10 大小:595.93KB
下载 相关 举报
JEDEC JEP113-B-1999 Symbol and Labels for Moisture-Sensitive Devices《湿敏器件用符号和标签》.pdf_第1页
第1页 / 共10页
JEDEC JEP113-B-1999 Symbol and Labels for Moisture-Sensitive Devices《湿敏器件用符号和标签》.pdf_第2页
第2页 / 共10页
JEDEC JEP113-B-1999 Symbol and Labels for Moisture-Sensitive Devices《湿敏器件用符号和标签》.pdf_第3页
第3页 / 共10页
JEDEC JEP113-B-1999 Symbol and Labels for Moisture-Sensitive Devices《湿敏器件用符号和标签》.pdf_第4页
第4页 / 共10页
JEDEC JEP113-B-1999 Symbol and Labels for Moisture-Sensitive Devices《湿敏器件用符号和标签》.pdf_第5页
第5页 / 共10页
点击查看更多>>
资源描述

1、/EIA/JEDEC ENGINEERING PUBLICATION I JEPll3-B Symbol and Labels for Moisture= Sensitive Devices (Revision of JEP113-A) I MAY 1999 ELECTRONIC INDUSTRIES ALLIANCE JEDEC Solid State Technology Association Electroak Industncr Alliance NOTICE EWJEDEC standards and publications contain material that has b

2、een prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the EIA General Counsel. EWJEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers,

3、facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. EWJEDEC standards and public

4、ations are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the EWJEDEC standards or publications. T

5、he information included in EWJEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby an EWJEDEC standard or publication may be fur

6、ther processed and ultimately become an ANSUEIA standard. No claims to be in conformance with this standard may be made unless ail requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this EIA/EDEC standard or publication should be addressed to

7、 JEDEC Solid State Technology Association, 2500 Wilson Boulevard, Arlington, VA 2220 1-3834, (703)907-7560/7559 or www.jedec.org Published by ELECTRONIC INDUSTRIES ALLIANCE 1999 Engineering Department 2500 Wilson Boulevard Arlington, VA 22201-3834 This document may be downloaded free of charge, howe

8、ver EM retains the copyright on this material. By downloading this file the individual agrees not to charge or resell the resulting material. PRICE Please refer to the current Catalog of JEDEC Engineering Standards and Publications or call Global Engineering Documents, USA and Canada (1-800-854-7179

9、), hternational(303-397-7956) Printed in the U.S.A. All rights reserved JEDEC Publication No. 113-B Page 1 SYMBOL AND LABELS FOR MOISTURE-SENSITTVE DEVICES (From JEDEC Board Ballot JCB-98-132, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Device

10、s.) 1 Introduction Certain plastic surface-mount components are subject to permanent damage due to moisture- induced failures encountered during high-temperature surface-mount processing unless appropriate precautions are observed. The purpose of this publication is to provide a distinctive symbol a

11、nd labels to be used to identify those devices that require special packing and handling precautions. 3 Reference documents J-STD-O20 MoistureReflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices J-STD-O33 Standard for Handling And Shipping Of MoistureReflow Sensitive

12、Surface Mount Devices 4 Symbol and labels 4.1 Moisture-sensitive symbol This symbol (see Figure 1) indicates that devices are moisture sensitive to a level from 2 to 6 and it appears on all moisture sensitive caution labels (see Figure 4). Figure 1 - Moisture-sensitive symbol JEDEC Publication No. 1

13、13-B Page 2 4 Symbol and labels (contd) 4.2 Moisture-Sensitive IdenWication (MSID) label This label should be on the lowest level shipping container to indicate that moisture-sensitive devices are in the container. This label is recommended to be a minimum of 3/4 inch (19 millimeters) in diameter. S

14、ee Figure 2. Figure 2 - MSID Label 43 Moisture-sensitive caution labels 4.3.1 Level 1 This label is required only if the classification temperature is 235 “C and shall be placed on the lowest level shipping container to identify the devices as “NOT MOISTURE SENSITIVE”. See Figure 3. LEVEL NOT MOISTU

15、RE SENSITIVE These Devices do not require special storage conditions provided: 1. They are maintained at conditions equal to or less than 30 OC185 % RH, and 2. They are solder reflowed at a peak body temperature which does not exceed 235 OC Note: Level and body temperature defined by IPC/JEDEC J-STD

16、-020 Figure 3 - Information label for level i JEDEC Publication No. 1 13-B Page 3 4 Symbols and Labels (cont?d) 43.2 Levels 2-Sa The moisture-sensitive caution label shall be used for levels 2,2a, 3,4,5, and 5a as defined by J-STD-020. See Figure 4. This label is required on the moisture barrier bag

17、 and will provide the following infomation: (a) Moisture classification level. (b) The calculated shelf life in the sealed bag (c) The peak package body temperature (Top surface) used for device classification as defined by J-STD-020. (d) The floor life of the device at 30 ?C/o%RH as defined by J-ST

18、D-020. (e) The bag seal date utilizing ?MMDDYY?, ?YYWW? or equivalent format. An acceptable alternative will be to provide the above information on the adjacent bar code label. U CA UTI ON MOISTlJRESENSIVE DEVICES n lank. BB adjacent bar ce& label 1. Calaalated shelf life in sealed bag: 12 months at

19、 e 40 OC and e WA relave humidity (RH) 2. Peak package body temperature: ?C IfBlankaaeaajamlbarmdelabel 3. Mer bag is opened, devices that will be subjected to reflow colder or orner high temperature process must a) Mountedwimin: hours of factory b) stored at cl% AH a) Humidity Indicator Card is 10%

20、 when read at 23 f 5 C b) 3aor3bnotmet H Blank.see adjacarirbarcode labd conditions s 30 OC/WA 4. Devices requin? bake. before mpunting. if: 5. If baking is required. davices may be baked for 48 hours at 125 f 5 OC Note: If device containers cannot be subjected to high temperature or shorter bake Zm

21、es are desired, reference IPCIJEDEC JsTw33 for bake pm?dure Bag Seal Date: Il Blank see adiaeeni barcode label 1 Note: Level and body tempef&re defined by IPC/JEDEC J-STD420 11 Figure 4 - Moisture-sensitive caution label for leveis 2-Sa EDEC Publication No. 1 13-B Page 4 4 Symbols and Labels (contd)

22、 4.3.3 Level 6 Level 6 devices must be identified as “EXTREMELY MOISTURE SENSITIVE”. See Figure 5. This label is required on the moisture barrier bag andor the lowest level shipping container. The label must specify the peak package body temperature at which the device was classified. If the require

23、d information is not provided on the caution label then it must be on the adjacent bar code label. Level 6, as defmed by J-STD-020, does not require that devices be shipped in a moisture-barrier bag with desiccant, etc. (dry-pack), since these devices require baking by the end user before use. Howev

24、er, moisture-barrier bags have become a “symbol” for moisture-sensitive devices and therefore are recommended to be used with level 6 device shipments. It is also recommended that these bags be sealed even though desiccant and humidity indicator cards (HIC) may not be inside the bags. CAUTION EXTREM

25、ELY MOISTURE SENSITIVE - Peak package body temperature: OC If Blank see adpwnt bar ccde labe 1. Must be baked before mounting for 48 hourc. at 125 i 5 OC in high-temperature device containes Note If device containers cannot be subjected to high temperature w shorter bake times are desired. miefenCa

26、IPC/JEDEC J-sTpo33 tor bake procedure 2. After baking devices must be mounted within 6 hours at factory conditions of I 30 “C/6O% Rt Note: Level and body temperature defined by IPCIJEDEC J-STD-O20 Figure 5 - Moisture-sensitive caution label for level 6 43.4 Labelsize Labels are recommended to be a m

27、inimum of 3 inches (76.2 millimeters) by 3 inches (76.2 millimeters) square. JEDEC Publication No. 1 13-B Page 5 4.3.5 Label colors The ID and caution labels shall be contrasting colors. These labels shall be legible to normal vision at a distance of three feet. Monochromatic reproduction in any col

28、or that contrasts with the background may be used. Where the choice of color is arbitrary, it is suggested that: 1) The ID label background be blue (Pantone #297C) with a black symbol and letters. 2) The caution label background be white with a blue (Process blue) symbol and letters. Wherever possible the color red should be avoided as red suggests a personal hazard. JFiDEC Publication No. 113-B Page 6

展开阅读全文
相关资源
猜你喜欢
  • ITU-T Y 1702-2015 Generic protocol-neutral information model for transport resources (Study Group 15)《运输资源通用协议中性信息模型(研究组15)》.pdf ITU-T Y 1702-2015 Generic protocol-neutral information model for transport resources (Study Group 15)《运输资源通用协议中性信息模型(研究组15)》.pdf
  • ITU-T Y 1702-2016 Generic protocol-neutral information model for transport resources (Study Group 15).pdf ITU-T Y 1702-2016 Generic protocol-neutral information model for transport resources (Study Group 15).pdf
  • ITU-T Y 1703 AMD 2-2016 Internet protocol aspects C Operation administration and maintenance Architecture and specification of data communication network Amendment 2 (Study Group 1.pdf ITU-T Y 1703 AMD 2-2016 Internet protocol aspects C Operation administration and maintenance Architecture and specification of data communication network Amendment 2 (Study Group 1.pdf
  • ITU-T Y 1703-2008 Architecture and specification of data communication network (Study Group 15)《数据通信网络的架构与规格 15号研究组》.pdf ITU-T Y 1703-2008 Architecture and specification of data communication network (Study Group 15)《数据通信网络的架构与规格 15号研究组》.pdf
  • ITU-T Y 1703-2010 Architecture and specification of data communication network (Study Group 15)《数据通信网的体系结构和规范(研究组15)》.pdf ITU-T Y 1703-2010 Architecture and specification of data communication network (Study Group 15)《数据通信网的体系结构和规范(研究组15)》.pdf
  • ITU-T Y 1704 1 FRENCH-2003 Gestion r partie des appels et des connexions bas e sur l-interface r seau-r seau priv e (PNNI)《基于PNNI的分布式呼叫和连接管理(DCM) Y系列 全球信息基础设施和互联网协议概述 操作管理与维护 15号研究.pdf ITU-T Y 1704 1 FRENCH-2003 Gestion r partie des appels et des connexions bas e sur l-interface r seau-r seau priv e (PNNI)《基于PNNI的分布式呼叫和连接管理(DCM) Y系列 全球信息基础设施和互联网协议概述 操作管理与维护 15号研究.pdf
  • ITU-T Y 1704 1 SPANISH-2003 Distributed call and connection management (DCM) based on PNNI《基于PNNI的分布式呼叫和连接管理(DCM) Y系列 全球信息基础设施和互联网协议概述 操作管理与维护 15号研究组 也列为G 7713 1》.pdf ITU-T Y 1704 1 SPANISH-2003 Distributed call and connection management (DCM) based on PNNI《基于PNNI的分布式呼叫和连接管理(DCM) Y系列 全球信息基础设施和互联网协议概述 操作管理与维护 15号研究组 也列为G 7713 1》.pdf
  • ITU-T Y 1704 1-2003 Distributed call and connection management (DCM) based on PNNI SERIES Y GLOBAL INFORMATION INFRASTRUCTURE AND INTERNET PROTOCOL ASPECTS Internet protocol aspect(S.pdf ITU-T Y 1704 1-2003 Distributed call and connection management (DCM) based on PNNI SERIES Y GLOBAL INFORMATION INFRASTRUCTURE AND INTERNET PROTOCOL ASPECTS Internet protocol aspect(S.pdf
  • ITU-T Y 1704 2 FRENCH-2003 Distributed Call and Connection Management Signalling mechanism using GMPLS RSVP-TE《分布式呼叫和连接管理 使用GMPLS RSVP-TE信令机制 Y系列 全球信息基础设施和互联网协议概述 操作管理与维护 也列入G 7713.pdf ITU-T Y 1704 2 FRENCH-2003 Distributed Call and Connection Management Signalling mechanism using GMPLS RSVP-TE《分布式呼叫和连接管理 使用GMPLS RSVP-TE信令机制 Y系列 全球信息基础设施和互联网协议概述 操作管理与维护 也列入G 7713.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1