1、JEDEC PUBLICATION Obtaining and Accepting Material for Use in Hybrid/MCM Products JEP142 MAY 2002 (Reaffirmed: September 2009) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of D
2、irectors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and as
3、sisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption ma
4、y involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents
5、a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in co
6、nformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or www.jedec.org Published by
7、JEDEC Solid State Technology Association 2009 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting
8、 material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agre
9、ement. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or call (703) 907-7559 JEDEC Publication No. 142 GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS CONTENTS Page -i- 1 Scope 1 2 App
10、licable documents 1 2.1 Military / Government documents 1 2.2 Industry documents 2 2.3 Internet reference locations 3 3 Terms and definitions 3 4 Microcircuits and semiconductor die 3 4.1 Guidelines for establishing a procurement/acceptance plan for microcircuit and semiconductor die 3 4.2 Items to
11、evaluate 7 4.2.1 Semiconductor element evaluation options 7 4.3 Microcircuit element evaluation options 9 5 Passive elements 12 5.1 Passive element evaluation options 12 5.2 Additional guidelines for passive element evaluation 14 6 Surface Acoustic Wave (SAW) 17 6.1 Design 17 6.2 Process control 17
12、6.3 Test 17 6.4 Statistical process control (SPC) 17 7 Substrate evaluation 18 7.1 Electrical performance 18 7.2 Construction and dimensions 18 7.2.1 Visual inspection 18 7.3 Bondability 18 7.4 Adhesion testing 19 7.5 Attachability 19 7.6 Design and procurement concerns 19 8 Package and lid evaluati
13、on 20 8.1 Electrical performance 20 8.2 Construction and dimensions 21 8.3 Bondability 21 JEDEC Publication No. 142 GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS CONTENTS Page -ii- 8.4 Attachability 22 8.5 Design and procurement concerns 22 9 Adhesives 23 9.1 Adhesi
14、ve evaluation 23 10 General guidelines 23 Annex A (informative) 24 A.1 Element evaluation summary 24 JEDEC Publication No. 142 Page 1 GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS (From JEDEC Board ballots JCB-01-67A and JCB-02-52, formulated under the cognizance of
15、 the JC-13.5 Subcommittee on Hybrid, RF/Microwave, and MCM Technology.) 1 Scope This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid / MCM Products. As part of the risk assessment process,
16、both technical requirements and cost should be carefully considered with regard to testing / evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybri
17、d / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. 2 Applicable documents The following documents may be used as guidelines for developing test plans or for performing testing. The revision of these referenced documents is that which best satisfies the users
18、 requirements. 2.1 Military / Government documents MIL-PRF-20, Capacitor, Fixed Ceramic Dielectric (Temperature Compensating), Established Reliability and Non Established Reliability, General Specification for MIL-HDBK-103, List of Standard Microcircuit Drawings MIL-PRF-123, Capacitors, Fixed, Ceram
19、ic Dielectric, (Temperature Stable and General Purpose), High Reliability, General Specification for MIL-HDBK-179, Microcircuit Acquisition Handbook MIL-HDBK-199, Resistors, Selection and Use of MIL-STD-202, Test Methods for Electronic and Electrical Component Parts MIL-STD-690, Failure Rate Samplin
20、g Plans and Procedures MIL-STD-750, Test Methods for Semiconductor Devices MIL-STD-790, Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic and Fiber Optic Parts Specifications MIL-STD-883, Test Methods for Microcircuits Devices JEDEC Publica
21、tion No. 142 Page 2 2 Applicable documents (contd) 2.1 Military / Government documents (contd) MIL-STD-1686, Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (excluding electrically initiated explosive devices) (metric) MIL-PRF-19500
22、, Semiconductor Devices, General Specification for MIL-PRF-38534, Hybrid Microcircuits, General Specification for MIL-PRF-38535, Integrated Circuits (Microcircuits), Manufacturing, General Specification for MIL-PRF-39001, Capacitors, Fixed, Mica Dielectric, Established Reliability and - Non-Establis
23、hed Reliability, General Specification for MIL-PRF-49470, Capacitor, Fixed, Ceramic Dielectric, Switch Mode Power Supply (General Purpose and Temperature Stable), General Specification for MIL-PRF-55342, Performance Specification, Resistors, Fixed, Film, Chip Non-Established Reliability, Established
24、 Reliability, General Specification for MIL-PRF-55365, Capacitor, Fixed, Electrolytic (Tantalum), Chip, Non-Established Reliability, Established Reliability, General Specification for MIL-PRF-55681, Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Establish
25、ed Reliability, General Specification for MIL-PRF-87164, Capacitors, Fixed, Mica Dielectric, High Reliability, General Specification for 2.2 Industry documents JESD9, Metal Package Specification for Microelectronic Packages and Covers JESD22-A104, Temperature Cycling JESD22-A106, Thermal Shock JESD2
26、2-A107, Salt Atmosphere JESD22-A108, Temperature, Bias, and Operating Life JESD22-A109, Hermeticity JESD22-B102, Solderability JESD22-B104, Mechanical Shock JESD22-B107, Marking permanency JEDEC Publication No. 142 Page 3 2 Applicable documents (contd) 2.2 Industry documents (contd) JESD22-B116, Wir
27、e Bond Shear Test JESD49, Procurement Standard for Known Good Die EIA557, Statistical Process Control System JESD27, Ceramic Package Specification for Microelectronic Packages JEP135, Guideline for Supplier Management JEP132, Process Characterization Guideline JEP133, Guide For the Production and Ac
28、quisition of Radiation-Hardness Assured Multichip Modules and Hybrid Microcircuits ANSI/EIA-469, Standard Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors 2.3 Internet reference locations Defense Supply Center Columbus (DSCC), JEDEC Solid State Technology Associa
29、tion (JEDEC), www.jedec.org/ 3 Terms and definitions This section intentionally left blank. 4 Microcircuits and semiconductor die 4.1 Guidelines for establishing a procurement/acceptance plan for microcircuit and semiconductor die The following guidelines should be considered when evaluating microci
30、rcuit and semiconductor die. 4.1.1 Built-in test Fault testing (complex ASIC) devices have tests that are typically performed at the probe level that verify die performance. JEDEC Publication No. 142 Page 4 4.1 Guidelines for establishing a procurement/acceptance plan for microcircuit and semiconduc
31、tor die (contd) 4.1.2 Yield data Wafer/wafer lot yield (electrical /mechanical / visual) may be used to determine product/manufacturing maturity thereby establishing inspection / test levels for new material lots. However, wafer/wafer lot yield data may be considered proprietary by the die manufactu
32、rer and therefore may not be obtainable. 4.1.3 Electrical test following assembly a) Sample testing in monolithic form: Electrical Testing A sample of die may be packaged and subjected to electrical testing over temperature extremes. Burn-in, temperature cycling, mechanical shock or other testing ma
33、y be performed to increase the manufacturers confidence level of accepting the die for the intended functions. Electrical components should not be operated outside of the component manufacturer recommended operating conditions. b) Sample testing in production hardware: A sample of die may be assembl
34、ed into the Hybrid / MCM product. Validation that sample die meet electrical performance requirements in production hardware should increase the manufacturers confidence in the inspection lot of die and therefore the remaining die may not require additional element evaluation at the die level. 4.1.4
35、 Die complexity The level of testing for any particular die should consider the level of complexity required to fabricate the die and the users expectations of the end item part. 4.1.5 Construction and dimensions a) Visual inspection Visual Criteria MIL-STD-883 Method 2010 and MIL-STD-750 Methods 20
36、73 and 2072 may be used for visual inspection criteria for microcircuits, diodes, and transistors respectively. Suppliers may utilize visual inspection criteria developed internally. When procuring die, the visual inspection criteria should be identified. b) Dimensions Dimension verifications may be
37、 used where space limitations are critical. A lot to lot change in dimensions could be an indicator of nonconformances, i.e., wrong die, mask changes, etc. However, typically die of the same design from the same manufacturer are highly consistent regarding dimensions. Where die thickness is critical
38、 to the process, die thickness should be specified. JEDEC Publication No. 142 Page 5 4.1 Guidelines for establishing a procurement/acceptance plan for microcircuit and semiconductor die (contd) 4.1.5 Construction and dimensions (contd) c) SEM analysis SEM Analysis may be utilized to observe various
39、junctions, mask alignment or other characteristics typical of the die fabrication process. SEM Analysis is recommended for Class “K” Hybrid Applications. SEM Analysis may be used to detect thin metallization or critical junction characteristics. MIL-STD-883 Method 2018 or MIL-STD-750 Method 2077 may
40、 be used as a guide. 4.1.6 Radiation hardness (Also see 10.4) a) Neutron / Irradiation Testing may be performed using MIL-STD-883 Method 1017 or MIL-STD-750 Method 1017 as a guide. b) Ionizing Radiation Testing may be performed using MIL-STD-883 Method 1019 or MIL-STD-750 Method 1019 as a guide. 4.1
41、.7 Bondability a) Wire bond evaluation Sample bonding may be performed on die bond pads for each lot of received devices. Use wire bonding equipment and profiles that simulate end item use. b) Wire bonding strength testing This test may be performed on wire bondable elements in accordance with MIL-S
42、TD-883 Method 2011. Accelerated Wire Bond Stress Testing may be performed by heating the bonding sample to 300C for one hour in either air or an inert atmosphere prior to performing the wire bond strength test. Exposing the bond to 300 degrees centigrade for one hour tends to accelerate the interact
43、ion of intermetallics, thereby revealing corrosion and weak bond problems. When wires are subjected to the exposure described above, destructive pull force values should be reduced in accordance with MIL-PRF-38534. c) Plasma cleaning Plasma cleaning may be used on certain die to remove organic mater
44、ials prior to wire bonding. 4.1.8 Attachability a) Sample die shear: Backside metal requirements Considerations should be made for the types of attach that will be performed at the next level of assembly. Backside roughness and metallization material considerations should be determined for epoxy or
45、eutectic attach. For epoxy attach a conductive or non-conductive epoxy should be selected based on the die operating characteristics. JEDEC Publication No. 142 Page 6 4.1 Guidelines for establishing a procurement/acceptance plan for microcircuit and semiconductor die (contd) 4.1.8 Attachability (con
46、td) For eutectic attach, the backside die metallization should be suitable for the material the die is being attached to as well as the preform (if used) and the attach method. Also, the inherent die strength should be considered before selecting the assessment techniques. GaAs die, for example are
47、extremely brittle and considerations (due to die fracture) invalidate die shear test results. Testing may be performed using MIL-STD-883 Method 2019 as a guide. b) Mechanical shock or constant acceleration Mechanical shock or constant acceleration may be used to verify the mechanical integrity of th
48、e elements being attached. Suggested test methods are MIL-STD-883 Method 2002, Condition B, Y1 direction or Method 2001, 3000G, Y1 direction. Consideration should be given to the die attach metallization. c) Substrate attach strength Substrate attach strength may be performed in accordance with MIL-
49、STD-883 Method 2027 to evaluate the die attach strength to the package or substrate. 4.1.9 Design and procurement a) Traceability Die traceabilty is usually provided by the supplier to the wafer lot. Adequate tracking of die during Hybrid manufacturing is valuable for failure analysis. Lot evaluation may be required for each wafer lot. b) Mask control Die topography may change at the die manufacturer without notice. Auto bonders may not recognize new bond pad layouts or functions of pads may change. Inspection to sp
