JEDEC JEP175-2017 DDR4 PROTOCOL CHECKS.pdf

上传人:wealthynice100 文档编号:807000 上传时间:2019-02-05 格式:PDF 页数:16 大小:114.24KB
下载 相关 举报
JEDEC JEP175-2017 DDR4 PROTOCOL CHECKS.pdf_第1页
第1页 / 共16页
JEDEC JEP175-2017 DDR4 PROTOCOL CHECKS.pdf_第2页
第2页 / 共16页
JEDEC JEP175-2017 DDR4 PROTOCOL CHECKS.pdf_第3页
第3页 / 共16页
JEDEC JEP175-2017 DDR4 PROTOCOL CHECKS.pdf_第4页
第4页 / 共16页
JEDEC JEP175-2017 DDR4 PROTOCOL CHECKS.pdf_第5页
第5页 / 共16页
点击查看更多>>
资源描述

1、JEDEC PUBLICATION DDR4 PROTOCOL CHECKS JEP175 JULY 2017 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC lega

2、l counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the

3、 proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action

4、JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally

5、from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated

6、 in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State

7、Technology Association 2017 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE:

8、Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107

9、 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Publication No. 175 -i- DDR4 PROTOCOL CHECKS Contents PageForeword iiIntroduction ii1 Scope 12 Normative references 13 Terms and definitions 14 DDR4 Protocol Checks Based on Timing Between Events 25 DDR4 Protocol Check

10、s Based on Ordering of Events 8JEDEC Publication No. 175 -ii- Foreword The intended use of this document is for the validation and debug of DDR4 based designs. This document contains protocol checks, sometimes referred to as memory access rules or protocol violations. These protocol checks can be im

11、plemented in simulation for pre-silicon verification or implemented in a protocol analyzer, logic analyzer, or oscilloscope for post silicon verification. The contained list of protocol checks is by no means the definitive list of protocol checks as other checks not contained in this list probably d

12、o exist. This document was created by the JC-40.5 JEDEC Committee. This document is subservient to the JEDEC JESD79-4B DDR4 Specification and the SPD Specification, JESD 21-C Section Title: Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules. JEDEC Publication No. 175 Page 1 DDR4 PROTOCOL C

13、HECKS (From JEDEC Board Ballot JCB-17-17, formulated under the cognizance of the JC-40.5 Subcommittee on Logic Validation and Verification.) 1 Scope This document contains a list of checks that can be used during the verification or debug stages of development to check that accesses to a DDR4 DRAM a

14、dhere to JESD79-4B. These checks are derived from JESD79-4B. The intent of this document is not to supplant the JESD79-4B document, but to help consolidate the checks into a single easy to read document. This document was not intended to indicate how a protocol check measurement would be made, but w

15、hat measurement would be made. The how can differ based on the testing requirements or the equipment at hand. This document is not a definitive list as other DDR4 protocol checks do exist and can be added to this document during subsequent revisions. 2 Normative reference JESD79-4B, DDR4 SDRAM Stand

16、ard. 3 Terms and definitions For the purposes of this document, the following terms and definitions are used in this document. Symbol: A shorthand notation per JESD79-4B for the Parameter. NOTE Where the cell is grayed out, there is no official JEDEC parameter currently defined. However the equation

17、 is defined. Parameter: A text description from JESD79-4B describing the time between events targeting the DDR4 DRAM. Violation Criteria: in formula format is derived from the JESD79-4B specification. This is the protocol check. It is written such that if the condition is satisfied the protocol chec

18、k fails and a violation exists. Reference: A guide to the reader of where to look in JESD79-4B for more information on this protocol check. By no means is the reference exhaustive as the Parameter may be listed in many places. This is meant to be a starting point for the reader. Units: How the proto

19、col check will be measured. Notes: Guidance as to special cases that concern that particular check and can be found in JESD79-4B. JEDEC Publication No. 175 Page 2 4 DDR4 Protocol Checks based on Timing between events In general, the DDR4 specification details commands and the allowable time between

20、those commands targeted to the DDR4 DRAM. Generally speaking, those commands cannot be too close or too far apart in time. A protocol check is the measurement to ensure that this is adhered to. Parameter Symbol Violation Criteria (Formula) Reference Units Notes Read to Read Same Bank Group Write to

21、Write Same Bank Group MPR page x to MPR page x (where x = 1,2 or 3) tCCD_L Measurement is less than tCCD_Lmin. tCCD_Lmin = MAX(tCCD_LnCK, ROUNDUP(tCCD_Lns/tCKns) -.025) Table 14, Table 132, Table 133, Figure 60, Figure 61, Section 4.10.3, 4.25.7 nCK 1,4 Read to Read Different Bank Group Write to Wri

22、te Different Bank Group MPR page 0 to MPR page 0 tCCD_S Measurement is less than tCCD_Smin. Table 132, Table 133, Figure 60, Figure 61, Figure 82, Figure 83, Figure 117, Figure 118, Section 4.10.3, 4.25.7 nCK 1 Read to Write Same Bank Group Read to Write Different Bank Group Measurement is less than

23、 CL - CWL + RBL/2 +1tCK + tWPRE WL+BL/2 +1tCK+tWPRE Section 4.25.6, Figure 84 nCK 1,3 Write to Read Same Bank Group Measurement is less than CWL + WBL/2 + MAX(tWTR_LnCK, ROUNDUP(tWTR_Lns/tCKnS) -.025) Section 4.25.6, Table 132, Table 133, Figure 65 nCK 1,3,4 Write to Read Different Bank Group Measur

24、ement is less than CWL + WBL/2 + MAX(tWTR_SnCK, ROUNDUP(tWTR_SnS/tCKnS) -.025) Section 4.25.6, Table 132 and Table 133, Figure 64 nCK 1,3,4 Activate to Activate Same Bank Group tRRD_L Measurement is less than tRRD_Lmin. tRRD_Lmin = MAX(tRRD_LnCK, ROUNDUP(tRRD_Lns/tCKnS) -.025) Table 132, Table 133,

25、Figure 62 nCK 1,2,4 Activate to Activate Different Bank Group tRRD_S Measurement is less than tRRD_Smin. tRRD_Smin = MAX(tRRD_SnCK, ROUNDUP(tRRD_Sns/tCKns) -.025) Table 132,133, Figure 62 nCK 1,2,4 Greater than 4 Activate commands window tFAW Measurement is less than tFAWmin. tFAWmin = MAX(tFAWnCK,

26、ROUNDUP(tFAWns/tCKns)-.025) Table 132, Table 133, Figure 63 nCK 1,2,4 JEDEC Publication No. 175 Page 3 Parameter Symbol Violation Criteria (Formula) Reference Units Notes READ to PRE or PREA to the same Bank Measurement is less than MAX(tRTPnCK, ROUNDUP(tRTPns/tCKns)+ AL Section 4.24.3, Figure 98,Fi

27、gure 100 Table 132, Table 133 nCK 1,3,7 WR to PRE or PREA to the same Bank If both DM and CRC are enabled Measurement is less than WL + BL/2 + ROUNDUP(tWRnS/tCKns) -.025) WL + BL/2 + MAX(tWR_CRC_DMnCK, ROUNDUP(tWR_CRC_DMnS/tCKns) Figure 131, Section 4.25.5, Table 132, Table 133 nCK 1,3,7 DLL locking

28、 time: DLL Reset (MR0 b8) to any command requiring a locked DLL or CKE low. Commands requiring a locked DLL; RD, RDS4, RDS8, RDA, RDAS4, RDAS8 tDLLK Measurement is less than tDLLKmin. Table 14, Table 132, Table 133, Section 3.3.1, Section 4.27, Figure 6 nCK 1 Mode Register Set command cycle time: MR

29、S to MRS Exceptions: Gear Down Mode, C/A Parity Latency Mode, Per DRAM Addressability Mode, VrefDQ training value, mode and range, CS to Command/Address Latency Mode tMRD Measurement is less than tMRDmin. Table 132, 133. Figure 8, Section 3.4.1 nCK 1 Mode Register Command update delay: MRS to non-MR

30、S Command or ODT high Exceptions are listed in Note 2 Figure 9. tMOD Measurement is less than tMODmin. tMOD = MAX(tMODnCK, ROUNDUP(tMODns/tCKns) Table 132,133, Section 3.4.1, Figure 9, Figure 11 ODT reference 4.7.2 and Figure 15 nCK 1,7 Powerup and Reset calibration time: 1st ZQCL after Reset Low to

31、 High to any Command, ODT high, or CKE Low tZQinit Measurement is less than tZQinitmin. Table 132, Table 133, Figure 6, Figure 26 nCK 1 Normal Operation full calibration time: All but the 1st ZQCL after Reset Low to High to any Command, ODT high, CKE Low tZQoper Measurement is less than tZQopermin.

32、Table 132, Table 133, Figure 26 nCK 1 Normal Operation short calibration time: Time from ZQCS to any Command, ODT high, CKE Low tZQCS Measurement is less than tZQCSmin. Table 132, Table 133, Section 4.12.1, Figure 26 nCK 1 JEDEC Publication No. 175 Page 4 Parameter Symbol Violation Criteria (Formula

33、) Reference Units Notes RESET_n Low to High, then CKE Low to High to a valid Command tXPR Measurement is less than tXPRmin. tXPRmin = MAX(tXPRnCK, ROUNDUP(tRFCmin+10ns)/tCKns)-.025) Table 24, Table 132, Table 133, Figure 6, 7, Section 3.3.1 nCK 1,4 SRX to Commands not requiring a locked DLL Commands

34、 not requiring a locked DLL: ACT, PRE, PREA, REF, SRE, PDE,WRITE On Self-Refresh Exit DESELECT commands must be issued on every clock edge occurring during the tXS period. tXS Measurement is less than tXSmin. tXSmin = ROUNDUP(tRFCmin+10ns)/tCKns)-.025) Table 24, Table 132 and Table 133,Figure 11, Fi

35、gure 12, Section 4.4.3 Section 4.4.2, 4.27Note 8: Section 4.2nCK 1,4 SRX to any command not requiring a locked DLL in self refresh ABORT Commands not requiring a locked DLL: ACT, PRE, PREA, REF, SRE, PDE, WRITE Disable this check if MR4 A9 is not set (Disable Self Refresh Abort) tXS_ ABORT Measureme

36、nt is less than tXS_ABORTmin. tXS_ABORTmin = ROUNDUP(tRFC4+10ns)/tCKns)-.025) Table 24, Table 132 and Table 133,Figure 11, Figure 12, Section 4.4.3 Section 4.4.2, 4.27Section 3.5 nCK 1,4 SRX to ZQCL, ZQCS and MRS tXS_ FAST Measurement is less than tXS_FAST. tXS_FASTmin = ROUNDUP(tRFC4+10ns)/tCKns) T

37、able 132 and Table 133, Section 4.4.2 nCK 1,7 SRX to Commands requiring a locked DLL, READ or CKE Low or ODT High (synchronous ODT Commands) tXSDLL Measurement is less than tXSDLLmin tXSDLL = tDLLK(min) Table 132 and Table 133, Section 4.27 #2, Figure 146, Note 8 Section 4.2nCK 1 Exit Power Down wit

38、h DLL on to any valid Command Exit Precharge Power Down with DLL frozen to commands not requiring a locked DLL Exit Power Down to ODT =1: MR5 A5=0 (ODT enabled) tXP Measurement is less than tXPmin. tXPmin = MAX(tXPnCK, ROUNDUP(tXPns)/tCKns) Table 132 and Table 133. Figure 45, Figure 46, Figure 148,

39、Table 56 Table 132 and Table 133 Figure 184 nCK 1,7 JEDEC Publication No. 175 Page 5 Parameter Symbol Violation Criteria (Formula) Reference Units Notes Even Parity is present on PAR, ACT_n, RAS_n/A16, CAS_n/A15, WE_n/A14, BG0-BG1, BA0-BA1, A17-A0, and C0-C2 for 3DS. Only when MR5 A2:0 is NOT 000 On

40、ly when DLL mode is enabled ODD number of 1s present when Parity Enabled. Section 2.7, Table 13, Section 3.5 Section 4.5 integer number 3 Minimum CKE low width for Self refresh entry to exit timing This is the minimum amount of time the DRAM must stay in Self Refresh tCKESR Measurement is less than

41、tCKESRmin. tCKESRmin = tCKEmin + 1nCK Table 132 and Table 133, Figure 146 Section 4.27 nCK 1 CKE minimum pulse width (low and high) tCKE Measurement is less than tCKEmin. tCKEmin = MAX(tCKEnCK, ROUNDUP(tCKEns)/tCKns) Table 132 and Table 133 and Note 31 and Note 32. Figure 158 nCK 1,7 Power Down entr

42、y to exit timing minimum tPDmin Measurement is less than tPDmin. tPDmin = MAX(tCKEnCK, ROUNDUP(tCKEns)/tCKns) Table 132 and Table 133. Figure 45, Figure 158 nCK 1,7 Power Down entry to exit timing maximum ODT must be stable prior to Power Down entry and remain stable throughout tPDmax Measurement is

43、 greater than tPDmax. tPDmax=Roundup (9*tREFIns)/tCKns) Table 132 and Table 133. Figure 45, Figure 158 Figure 148, Figure 149 nCK 1,7 Timing of ACT command to Power Down entry tACTPDEN Measurement is less than tACTPDENmin. Table 132 and 133, Figure 155 nCK 1 Timing of PRE or PREA command to Power Do

44、wn entry tPRPDEN Measurement is less than tPRPDENmin. Table 132 and 133. Figure 156 nCK 1 Timing of RD or RDA command to Power Down entry tRDPDEN Measurement is less than tRDPDENmin. tRDPDENmin = RL + 4 + 1 Table 132 and 133. Figure 150 nCK 1 Timing of WR command to Power Down entry (BL8OTF, BL8MRS,

45、 BC4OTF) tWRPDEN Measurement is less than tWRPDENmin. tWRPDENmin = WL + 4 + ROUNDUP(tWRns/tCKns)-.025) Table 132 and 133. Figure 152 nCK 1,4 JEDEC Publication No. 175 Page 6 Parameter Symbol Violation Criteria (Formula) Reference Units Notes Timing of WRA command to Power Down entry (BL8OTF, BL8MRS,

46、 BC4OTF). WR in clock cycles as programmed in MR0 tWRAPDEN Measurement is less than tWRAPDENmin. tWRAPDENmin = WL + 4 + WR + 1 Figure 151, Table 132 and Table 133 Note 5 nCK 1 Timing of REF command to Power Down entry tREFPDEN Measurement is less than tREFPDENmin. tREFPDENmin = tREFPDENmin Table 132

47、 and Table 133. Figure 154 nCK 1 Timing of MRS command to Power Down entry tMRSPDEN Measurement is less than tMRSPDENmin. tMRSPDENmin = tMOD(min) Table 132 and Table 133. Figure 157 nCK 1 Activate to PRE command period Minimum tRASmin Measurement is less than tRASmin tRASmin = ROUNDUP(tRASminns/tCKn

48、s)-.025) Tables 107-113 nCK 1,4 Activate to PRE command period Maximum tRASmax Measurement is greater than tRASmax tRASmax = ROUNDUP(9*tREFIns/tnCKns) Tables 107 - 113 nCK 1,7 ACT to Read or Write Delay Time tRCD Measurement is less than tRCD tRCD = ROUNDUP(tRCDns/tCKns)-.025) Tables 107 - 113 nCK 1

49、,4 ACT to ACT or REF command period tRC Measurement is less than tRC tRC = ROUNDUP(tRCns/tCKns)-.025) Tables 107 - 113 nCK 1,4 REF to a non-Deselect Command tRFC1, tRFC2, tRFC4 Measurement is less than tRFCxmin tRFCx = ROUNDUP(tRFCxns/tCKns)-.025) Section 4.26, 4.9.2, Table 24, 132, 133. Figure 143 nCK 1,5,4 Average Refresh Interval tREFI1, tREFI2, tREFI4 Measurement equal or less than tREFIx measured over 8192 intervals with a rolling w

展开阅读全文
相关资源
猜你喜欢
  • DS EN 2127-1992 Aerospace series Aluminium alloy AL-P7075-T73511 Extruded bars and sections a or D 100 mm《航空航天系列 铝合金AL-P7075-T73511 挤压棒材或型材a或D≤100 mm》.pdf DS EN 2127-1992 Aerospace series Aluminium alloy AL-P7075-T73511 Extruded bars and sections a or D 100 mm《航空航天系列 铝合金AL-P7075-T73511 挤压棒材或型材a或D≤100 mm》.pdf
  • DS EN 2128-1992 Aerospace series Aluminium alloy AL-P7075-T7351 Drawn bars 6 mm a or D 75 mm《航空航天系列 铝合金AL-P7075-T77351 拉制棒材6 mm≤a或D≤75 mm》.pdf DS EN 2128-1992 Aerospace series Aluminium alloy AL-P7075-T7351 Drawn bars 6 mm a or D 75 mm《航空航天系列 铝合金AL-P7075-T77351 拉制棒材6 mm≤a或D≤75 mm》.pdf
  • DS EN 2143-1993 Aerospace series Rivets solid universal head in aluminium 1050A inch based series《航空航天系列 英寸系列铝合金1050A的实心通用头铆钉》.pdf DS EN 2143-1993 Aerospace series Rivets solid universal head in aluminium 1050A inch based series《航空航天系列 英寸系列铝合金1050A的实心通用头铆钉》.pdf
  • DS EN 2146-1993 Aerospace series Rivets solid universal head in aluminium 2017A inch based series《航空航天系列 英寸系列铝合金2017A的实心通用头铆钉》.pdf DS EN 2146-1993 Aerospace series Rivets solid universal head in aluminium 2017A inch based series《航空航天系列 英寸系列铝合金2017A的实心通用头铆钉》.pdf
  • DS EN 2148-1993 Aerospace series Rivets solid universal head in aluminium 5056A inch based series《航空航天系列 英寸系列铝合金5056A的实心通用头铆钉》.pdf DS EN 2148-1993 Aerospace series Rivets solid universal head in aluminium 5056A inch based series《航空航天系列 英寸系列铝合金5056A的实心通用头铆钉》.pdf
  • DS EN 2155-2-1993 Aerospace series Test methods for transparent materials for aircraft glazing Part 2 Determination of water absorption《航空航天系列 飞行器玻璃窗透明材料试验方法 第2部分:水吸收的测定》.pdf DS EN 2155-2-1993 Aerospace series Test methods for transparent materials for aircraft glazing Part 2 Determination of water absorption《航空航天系列 飞行器玻璃窗透明材料试验方法 第2部分:水吸收的测定》.pdf
  • DS EN 2155-3-1993 Aerospace series Test methods for transparent materials for aircraft glazing Part 3 Determination of refractive index《航空航天系列 飞行器玻璃窗透明材料试验方法 第3部分:折射系数的测定》.pdf DS EN 2155-3-1993 Aerospace series Test methods for transparent materials for aircraft glazing Part 3 Determination of refractive index《航空航天系列 飞行器玻璃窗透明材料试验方法 第3部分:折射系数的测定》.pdf
  • DS EN 22313-1993 Textile fabrics Determination of the recovery from creasing of a horizontally folded specimen by measuring the angle of recovery《纺织品 回复角测量法测定纬向折叠试样的折皱恢复能力》.pdf DS EN 22313-1993 Textile fabrics Determination of the recovery from creasing of a horizontally folded specimen by measuring the angle of recovery《纺织品 回复角测量法测定纬向折叠试样的折皱恢复能力》.pdf
  • DS EN 2236-1992 Aerospace series Pins headed close tolerance shank in alloy steel Technical specification《航空航天系列 带头,紧公差杆的合金钢销钉》.pdf DS EN 2236-1992 Aerospace series Pins headed close tolerance shank in alloy steel Technical specification《航空航天系列 带头,紧公差杆的合金钢销钉》.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1