1、JEDEC STANDARD Accelerated Moisture Resistance - Unbiased Autoclave JESD22-A102E (Revision of JESD22-A102D, November 2010) JULY 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Boar
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5、sents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be
6、 in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and D
7、ocuments for alternative contact information. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the
8、individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technolog
9、y Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-A102E Page 1 Test Method A102E (Revision of Test Method A102D) TEST METHOD A102E ACCELERATED MOISTURE RESISTANCE - UNBIASED A
10、UTOCLAVE (From JEDEC Board Ballots JCB-00-55, JCB-01-62, and JCB-15-27, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are sub
11、jected to a condensing, highly humid atmosphere under pressure to force moisture into the package to uncover weaknesses such as delamination and metallization corrosion. This test is used to evaluate new packages or packages that have undergone changes in materials (e.g., mold compound, die passivat
12、ion) or design (e.g., die/paddle sizes). However, this test should not be applied on laminate or tape based packages, i.e., FR4 material, polyimide tape or equivalent. Some cautions should be considered when performing this test and evaluating test results. Failure mechanisms, both internal (e.g., d
13、ue to plastic package swelling from saturation) and external (e.g., dendritic growth of conducting material between leads), may be produced which are not applicable to the intended application use conditions. Most semiconductor components are not rated for field applications conditions exceeding 95%
14、 RH, including condensing moisture such as rain or fog. The combination of high humidity, high temperature (Tg) and high pressure may produce unrealistic material failures because absorbed moisture typically decreases the glass transition temperature for most polymeric materials. Extrapolation of au
15、toclave test results to arrive at an application life should be accomplished with care. The purpose of the “Unbiased Autoclave Test“ is performed to evaluate the moisture resistance integrity of non-hermetic packaged solid state devices using moisture condensing or moisture saturated steam environme
16、nts. It is a highly accelerated test that employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material (encapsulant or seal) or along the interface between the external protective material and the met
17、allic conductors passing through it. This test is used to identify failure mechanisms internal to the package and is destructive. 2 Apparatus The test requires a pressure chamber capable of maintaining a specified temperature, and relative humidity. 2.1 Records A permanent record of the temperature
18、profile for each test cycle is recommended, so the stress conditions can be verified. JEDEC Standard No. 22-A102E Page 2 Test Method A102E (Revision of Test Method A102D) 2 Apparatus (contd) 2.2 Devices under stress Devices under stress shall be no closer than 3 cm from the internal chamber surface,
19、 and must not be subjected to direct radiant heat. 2.3 Ionic contamination Ionic contamination of the test apparatus and storage chamber shall be controlled to avoid test artifacts. 2.4 Distilled or deionized water Distilled or deionized water with a minimum resistivity of 1 M-cm at room temperature
20、 shall be used. 3 Test conditions Test conditions consist of a temperature, relative humidity, vapor pressure and duration. Table 1 Temperature, relative humidity and pressure2,3Temperature1dry-bulb C Relative humidity1% Vapor pressure kPa (psia) 121 2 100% 205 (29.7) NOTE 1 Tolerances apply to the
21、entire usable test area. NOTE 2 The test conditions are to be applied continuously except during any interim readouts. For interim readouts, devices should be returned to stress within the time specified in 5.2 NOTE 3 Previous revisions of this document specified the following test conditions: Condi
22、tion Duration A 24 hours (-0,+2) B 48 hours (-0, +2) C 96 hours (-0, +5) D 168 hours (-0, +5) E 240 hours (-0, +8) F 336 hours (-0, +8). The stress duration is specified by internal qualification requirements, JESD47 or the applicable procurement document. 96 hours duration is typical for this test.
23、 CAUTION: For plastic-encapsulated microcircuits, it is known that moisture reduces the effective glass transition temperature of the molding compound. Stress temperatures above the effective glass transition temperature may lead to failure mechanisms unrelated to operational use. JEDEC Standard No.
24、 22-A102E Page 3 Test Method A102E (Revision of Test Method A102D) 4 Procedure The test devices shall be mounted in a manner which exposes them to the specified temperature and humidity conditions. Exposure of devices to ambient environments greater than 100 oC and less than 10% R.H. shall be avoide
25、d, particularly during stress ramp-up, ramp-down and the pre-readout drying period. Ramp-up and ramp-down periods should be less than 3 hours each. Care should be taken through equipment control or cool down procedures to prevent destructive depressurization of the parts under test. Frequent cleanin
26、g of the test chamber is necessary to ensure elimination of contamination. 4.1 Test clock The test clock starts when the temperature and relative humidity reach the set points specified in clause 4 and stops at the beginning of ramp-down. 4.2 Readout Electrical test shall be performed not sooner tha
27、n 2 hours and not later than 48 hours after the end of ramp-down with room temperature testing done first in the sequence of testing. For intermediate readouts, devices shall be returned to stress within 96 hours of the end of ramp-down. The rate of moisture loss from devices after removal from the
28、chamber can be reduced by placing the devices in sealed moisture barrier bags, the bags should be non-vacuum sealed without a N2 purge and without desiccant. When devices are placed in sealed bags, the “test window clock“ runs at 1/3 of the rate of devices exposed to the laboratory ambient. Thus the
29、 test window can be extended to as much as 144 hours, and the time to return to stress to as much as 288 hours by enclosing the devices in sealed moisture barrier bags. NOTE 1 The electrical test parameters should be chosen to preserve any defect (i.e., by limiting the applied test current). NOTE 2
30、Additional time-to-test delay or return-to-stress delay time may be allowed if justified by technical data Condensed moisture on the exterior surface of the device package may be removed through contact with an absorbing medium or isopropyl alcohol. Because the purpose of this test is to identify fa
31、ilure mechanisms internal to the package, cleaning of the packaged device or leads is permitted, providing it doesnt induce anomalous failures or obscure valid failures. 4.3 Handling Hand-coverings that eliminate any source of ancillary contamination or ESD damage shall be used to handle devices and
32、 test fixtures. Contamination control is important in the application of this test method and any highly-accelerated moisture stress test. JEDEC Standard No. 22-A102E Page 4 Test Method A102E (Revision of Test Method A102D) 5 Failure criteria A device under accelerated moisture resistance shall be d
33、efined a failure if its parametric limits are exceeded, or its functionality cannot be demonstrated under nominal and worst-case conditions as specified in the applicable procurement document or data sheet. Electrical failures due to external package damage which are an artifact of the test method s
34、hall be excluded from the failure classification. 6 Safety Follow equipment manufacturers recommendation and local safety regulations. 7 Summary The following details shall be specified in the applicable procurement document: (a) Test duration. (b) Measurements after test. JEDEC Standard No. 22-A102
35、E Page 5 Test Method A102E (Revision of Test Method A102D) Annex A (informative) Differences between JESD22-A102E and its predecessors These tables briefly describe most of the non-editorial changes made to entries that appear in this standard, JESD22-A102E, compared to its predecessors, JESD22-A102
36、D (November 2010) and JESD22-A102C (December 2000). A.1 Differences between JESD22-A102E and JESD22-A102D Clause Description of change 1, 4.3 Changed “which” to “that”. 3 Changed “psia/kPa” to “kPa (psia)”. 4 1stparagraph, added 3rdsentence: “Ramp-up and ramp-down periods should be less than 3 hours
37、 each.” A.2 Differences between JESD22-A102D and JESD22-A102C Clause Description of change 1, 2 Combined to align with JEDEC Style Manual, JM7. All Renumbered accordingly. 4.4 Readout: Added two notes. A.3 Differences between JESD22-A102C, JESD22-A102B, JESD22-A102A, and JESD22-A102 No records are a
38、vailable. JEDEC Standard No. 22-A102E Page 6 Test Method A102E (Revision of Test Method A102D) Standard Improvement Form JEDEC JESD22-A102E The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry regarding usage of the subject standard. Individuals or co
39、mpanies are invited to submit comments to JEDEC. All comments will be collected and dispersed to the appropriate committee(s). If you can provide input, please complete this form and return to: JEDEC Attn: Publications Department 3103 North 10thStreet Suite 240 South Arlington, VA 22201-2107 Fax: 70
40、3.907.7583 1. I recommend changes to the following: Requirement, clause number Test method number Clause number The referenced clause number has proven to be: Unclear Too Rigid In Error Other 2. Recommendations for correction: 3. Other suggestions for document improvement: Submitted by Name: Phone:Company: E-mail: Address: City/State/Zip: Date:
