JEDEC JESD22-A102E-2015 Accelerated Moisture Resistance - Unbiased Autoclave.pdf
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1、JEDEC STANDARD Accelerated Moisture Resistance - Unbiased Autoclave JESD22-A102E (Revision of JESD22-A102D, November 2010) JULY 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Boar
2、d of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products,
3、and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adopt
4、ion may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications repre
5、sents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be
6、 in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and D
7、ocuments for alternative contact information. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the
8、individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technolog
9、y Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-A102E Page 1 Test Method A102E (Revision of Test Method A102D) TEST METHOD A102E ACCELERATED MOISTURE RESISTANCE - UNBIASED A
10、UTOCLAVE (From JEDEC Board Ballots JCB-00-55, JCB-01-62, and JCB-15-27, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are sub
11、jected to a condensing, highly humid atmosphere under pressure to force moisture into the package to uncover weaknesses such as delamination and metallization corrosion. This test is used to evaluate new packages or packages that have undergone changes in materials (e.g., mold compound, die passivat
12、ion) or design (e.g., die/paddle sizes). However, this test should not be applied on laminate or tape based packages, i.e., FR4 material, polyimide tape or equivalent. Some cautions should be considered when performing this test and evaluating test results. Failure mechanisms, both internal (e.g., d
13、ue to plastic package swelling from saturation) and external (e.g., dendritic growth of conducting material between leads), may be produced which are not applicable to the intended application use conditions. Most semiconductor components are not rated for field applications conditions exceeding 95%
14、 RH, including condensing moisture such as rain or fog. The combination of high humidity, high temperature (Tg) and high pressure may produce unrealistic material failures because absorbed moisture typically decreases the glass transition temperature for most polymeric materials. Extrapolation of au
15、toclave test results to arrive at an application life should be accomplished with care. The purpose of the “Unbiased Autoclave Test“ is performed to evaluate the moisture resistance integrity of non-hermetic packaged solid state devices using moisture condensing or moisture saturated steam environme
16、nts. It is a highly accelerated test that employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material (encapsulant or seal) or along the interface between the external protective material and the met
17、allic conductors passing through it. This test is used to identify failure mechanisms internal to the package and is destructive. 2 Apparatus The test requires a pressure chamber capable of maintaining a specified temperature, and relative humidity. 2.1 Records A permanent record of the temperature
18、profile for each test cycle is recommended, so the stress conditions can be verified. JEDEC Standard No. 22-A102E Page 2 Test Method A102E (Revision of Test Method A102D) 2 Apparatus (contd) 2.2 Devices under stress Devices under stress shall be no closer than 3 cm from the internal chamber surface,
19、 and must not be subjected to direct radiant heat. 2.3 Ionic contamination Ionic contamination of the test apparatus and storage chamber shall be controlled to avoid test artifacts. 2.4 Distilled or deionized water Distilled or deionized water with a minimum resistivity of 1 M-cm at room temperature
20、 shall be used. 3 Test conditions Test conditions consist of a temperature, relative humidity, vapor pressure and duration. Table 1 Temperature, relative humidity and pressure2,3Temperature1dry-bulb C Relative humidity1% Vapor pressure kPa (psia) 121 2 100% 205 (29.7) NOTE 1 Tolerances apply to the
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