1、JEDEC STANDARD Low Temperature Storage Life JESD22-A119A (Revision of JESD22-A119, November 2004, Reaffirmed September 2009) OCTOBER 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC
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7、and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file
8、 the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Tech
9、nology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-A119A Page 1 Test Method A119A (Revision of A119) TEST METHOD A119A TEMPERATURE STORAGE LIFE (From JEDEC Board Ballot JC
10、B-15-50, formulated under the cognizance of JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices. Low Temperature storage test is typically used to determine the e
11、ffect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). During the test reduced temperatures (test conditions) are used without electrical stress a
12、pplied. This test may be destructive, depending on Time, Temperature and Packaging (if any). 2 Apparatus 2.1 Low temperature storage chambers The apparatus required for this test shall consist of a controlled temperature chamber capable of maintaining the specified temperature over the entire sample
13、 population under test. 2.2 Electrical test equipment Electrical equipment capable of performing the appropriate measurements for the devices being tested, including write and verify the required data retention pattern(s) for nonvolatile memories. JEDEC Standard No. 22-A119A Page 2 Test Method A119A
14、 (Revision of A119) 3 Procedure 3.1 Low temperature storage conditions The Devices under test shall be subjected to continuous storage at one of the Temperature Conditions of Table 1. Table 1 Low Temperature storage conditions Condition A: -40 (-10/+0) C Condition B: -55 (-10/+0) C Condition C: -65
15、(-10/+0) C NOTE CAUTION should be exercised when selecting an accelerated test condition since the accelerated temperature used may exceed the capabilities of the device and materials, thereby inducing overstress failures that would not occur under normal use conditions. The devices may be returned
16、to room ambient conditions for interim electrical measurements. 3.2 Measurements Unless otherwise specified, interim and final electrical test measurements shall be completed within 96 hours after removal of the devices from the specified test conditions. Intermediate measurements are optional unles
17、s otherwise specified. The electrical test measurements shall consist of parametric and functional tests specified in the applicable procurement document. For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing.
18、 3.3 Failure criteria A device will be considered a Low Temperature Storage failure if parametric limits are exceeded, or if functionality cannot be demonstrated under nominal and worst-case conditions, as specified in the applicable procurement document. For nonvolatile memories, the specified data
19、 retention pattern shall be verified before and after storage. A margin test may be used to detect data retention degradation. Mechanical damage, such as cracking, chipping, or breaking of the package, (as defined in JESD22-B101) will be considered a failure, provided that such damage was not induce
20、d by fixtures or handling and it is critical to the package performance in the specific application. Cosmetic package defects and degradation of lead finish, or solderability are not considered valid failure criteria for this stress. JEDEC Standard No. 22-A119A Page 3 Test Method A119A (Revision of
21、A119) 4 Summary The following details shall be specified in the applicable procurement document. a) Electrical test measurements b) Sample size and number of failures (specify zero if none observed) c) Condition per Table 1, and duration of stress d) Intermediate electrical test measurements, if req
22、uired e) Nonvolatile memory data retention pattern (for appropriate devices) JEDEC Standard No. 22-A119A Page 4 Test Method A119A (Revision of A119) Annex A (informative) Differences between JESD22-A119A and JESD22-A119 This annex briefly describes most of the changes made to entries that appear in
23、this standard, JESD22-A119A, compared to its predecessor, JESD22-A119 (November 2004). If the change to a concept involves any words added or deleted (excluding deletion of accidentally repeated words), it is included. Some punctuation changes are not included. Clause Description of change 4 Item C
24、was modified to remove the recommended duration of 168 hours. There are no known published reliability models that supported this duration. Rev. 7/09 Standards Improvement Form JEDEC JESD22-A119A The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry re
25、garding usage of the subject standard. Individuals or companies are invited to submit comments to JEDEC. All comments will be collected and dispersed to the appropriate committee(s). If you can provide input, please complete this form and return to: JEDEC Attn: Publications Department 3103 North 10t
26、hStreet Suite 240 South Arlington, VA 22201-2107 Fax: 703.907.7583 1. I recommend changes to the following: Requirement, clause number Test method number Clause number The referenced clause number has proven to be: Unclear Too Rigid In Error Other 2. Recommendations for correction: 3. Other suggestions for document improvement: Submitted by Name: Phone: Company: E-mail:Address: City/State/Zip: Date:
