1、JEDEC STANDARD External Visual JESD22-B101C (Revision of JESD22-B101B, August 2009) OCTOBER 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequentl
2、y reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selec
3、ting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles,
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5、ecification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with this standard m
6、ay be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents for alternative contact inf
7、ormation. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to charge for
8、or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street
9、 Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-B101C Page 1 Test Method B101C Revision of Test Method B101B METHOD B101C EXTERNAL VISUAL (From JEDEC Board Ballot JCB-15-49, formulated under the cognizance of
10、the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices) 1 Scope External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished packaged device. External visual is a noninvasive and nondestructive test. It is functional f
11、or qualification, quality monitoring, and lot acceptance. This test method is applicable to: finished packaged devices only (hereafter referred to as devices); NOTE Devices sampled for external visual inspection must be considered physically representative of the as-shipped product. all solid-state
12、device package types/styles; devices having attachments as shipped (see clause 3 for definition). This test method is not applicable to: customer-processed devices (see clause 3 for definition); piece parts incoming to a device assembly operation, or to sub-assemblies in a manufacturing line (WIP);
13、the carrier, dry bag, packing, or container used to ship devices; the orientation or loading aspects of devices in carriers, (applicable to the device only); the internal, non-viewable features of a device. This test method does not apply to or require any inspection, measurement, or analysis other
14、than the procedure described in clause 5. This test method does not preclude the use of specialized tools or equipment to inspect or measure devices for conformance to physical specifications. JEDEC Standard No. 22-B101C Page 2 Test Method B101C Revision of Test Method B101B 2 Informative references
15、 JEP170, Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA) JESD22-B100, Physical Dimensions JESD22-B114, Mark Legibility JESD22-B118, Semiconductor Wafer and Die Backside External Visual Inspection JESD201, Environmental Acceptance Requirements for Tin Whisker Suscept
16、ibility of Tin and Tin Alloy Surface Finishes 3 Terms and definitions attachment: A capacitor, substrate cap, lid, heat sink, etc. that is glued, soldered, or mechanically affixed to a packaged device. carrier: A pocket tape, tray, tube or other fixture used to store and transport components and dev
17、ices. component: (1) A constituent part. NOTE 1 Examples include source and drain regions as components of transistors, lead frames and dice as components of packaged integrated circuits, resistors and integrated circuits as components of printed circuit boards, motherboards as components of compute
18、rs, LCD screens as components of monitors, ac and dc components of complex waveforms, and loops and algorithms as components of software programs. NOTE 2 The classification of an item as a device or as a component depends upon the intention of the owner at the time of classification. critical sealan
19、t: A polymeric material designed to completely or partially cover, intimately adhere to, and protect critical electrical features such as metal wire bonds, metal leadframes, metal fan-outs on a substrate, or the die active faces and die edges. customer-processed device: A device that has been solder
20、ed to, or desoldered from, a circuit board or other mounting surface. device: A piece of equipment, a mechanism, or another entity designed to serve a special purpose or perform a special function. NOTE 1 In JEDEC documents, the word “device” is often used as an abbreviated reference to the type or
21、types of solid-state devices that are within the scope of those documents. Context could indicate otherwise; e.g., in the phrase “the device used to hold the device under test”, the first usage of the word “device” refers to a mechanism; the second to a solid-state device. NOTE 2 The classification
22、of an item as a device or as a component depends upon the intention of the owner at the time of classification. substrate: A supporting material having one or more wired layers, upon which or within which one or more components and/or devices are fabricated or attached. WIP: “Work in progress” or “w
23、ork in process”. JEDEC Standard No. 22-B101C Page 3 Test Method B101C Revision of Test Method B101B 4 Apparatus The following is a list of material needed to perform the test outlined in this standard. Grounded and lighted workstation Grounded wrist strap Vacuum pickup or other suitable handling too
24、l (tweezers, etc.) Antistatic finger cots Microscope or other magnifying aids 5 Procedure 5.1 To minimize inspection induced damage, it is strongly recommended that a device be inspected in its carrier, and only when necessary be picked up with a vacuum wand or other suitable tool for inspection. 5.
25、2 At all times proper, ESD-free handling procedures must be followed. 5.3 Loose, dry, foreign material may be blown or vacuumed off the device surface using a clean, filtered air stream of +/- 27 meters per second (+/- 88 feet per second) maximum velocity. 5.4 The device shall be viewed by the eyes,
26、 unaided or with low magnification (3X to 7X) 5.5 Uncertain visual observations may be verified by using a higher magnification (up to 30X). 5.6 If potential failures (per clause 6) are still suspected but not certain after step 5.5, specialized tools or equipment may be used for further analysis an
27、d verification. 5.7 The same failure criteria (clause 6) shall apply to both the external visual inspection and to any specialized analyses used for verification. JEDEC Standard No. 22-B101C Page 4 Test Method B101C Revision of Test Method B101B 6 Failure criteria 6.1 Any dimension which is non-conf
28、orming to an applicable drawing or specification. 6.2 Any physical feature (type, material, color, finish, etc.) that is non-conforming to an applicable drawing or specification. 6.3 Any flaw or defect that renders the device cosmetically unacceptable or mechanically unfit for use, as defined by an
29、applicable drawing or specification. 6.4 Contamination that renders the device cosmetically unacceptable or mechanically unfit for use, as defined by an applicable drawing or specification. 6.5 Any specific condition that is inspected for separately by specialized equipment (for example coplanarity
30、or other physical dimensions) may be excluded from the external visual inspection. See JESD22-B100 regarding Physical Dimension requirements. 6.6 No more than 5% maximum exposure of the base material that is intended to be covered by the Lead Finish Design (i.e. dam bar trim area, lead tip trim area
31、, and/or 0.254mm (10 mils) maximum mold resin bleed area from peripheral leaded package body are not intended by design to be covered by lead finish) 6.7 Failures caused by handling damage during the course of the inspection are not to be counted. 7 Report form - External Visual This form or an equi
32、valent form may be used to report the results of external visual inspection. Part Number Description Lot Number Supplier Applicable Drawing Number Applicable Specification Number Quantity inspected Quantity good Date Inspector Comments - failed condition JEDEC Standard No. 22-B101C Page 5 Test Metho
33、d B101C Revision of Test Method B101B 7.1 Leads Inspected: Yes No N/A Defects List A/U* Comments Cracked or broken Missing or extra Incorrect placement or spacing (pitch) Improperly bent, reverse-bent, twisted, or misshapen Non-coplanar seating Non-parallel Notched or creased Improper dimensions (wi
34、dth, length, thickness) Improper foot angle and/or foot length Improper exit locations Metal burrs Missing or improperly located standoff swages Other 7.2 Lead Finish Inspected: Yes No N/A Defects List A/U* Comments Pitted or corroded Missing Deeply scratched or abraded Cracked or flaked Extraneous
35、material Icicles Lump (slump) Bridged Oxidized Tin whiskers, See JESD201 Contaminated Other JEDEC Standard No. 22-B101C Page 6 Test Method B101C Revision of Test Method B101B 7.3 Molding and Mold Compound Inspected: Yes No N/A Defects List A/U* Comments Incomplete fill Surface pits, craters, or pinh
36、oles Ejector pin marks (indentations) Top/bottom reversal (reverse mold) Top/bottom offset (misalignment) Cracked Gaps, cracks, or spaces between body and leads Gaps, cracks, or spaces between body and molded-in metal heat sink Surface blisters Surface dents (depressions) Plastic protrusions (flash)
37、 Missing lead 1 identifying mark Dam bar protrusions Dam bar intrusions Warped Contaminated Other 7.4 Critical Sealant Inspected: Yes No N/A Defects List A/U* Comments Incomplete coverage Air bubbles or voids Surface pits, craters, or pinholes Contaminated Other JEDEC Standard No. 22-B101C Page 7 Te
38、st Method B101C Revision of Test Method B101B 7.5 Attachments Inspected: Yes No N/A Defects List A/U* Comments Excessive gaps, cracks, or spaces in glue joint and TIM (thermal interface material) Solder bridging, solder balls Missing or extra Misplaced or mis-positioned Poor or improper fit Cracked
39、or broken Bent or warped Contaminated Other 7.6 Marking Inspected: Yes No N/A Defects List A/U* Comments Illegible characters (deformed, broken, faint), See JESD22-B114 Missing or extra characters Wrong DoubledExtraneous marks Other 7.7 Solder Balls Inspected: Yes No N/A Defects List A/U* Comments L
40、ow volume Missing or extra Pitted or corroded Smeared Cracked or broken Oxidized Contaminated Other JEDEC Standard No. 22-B101C Page 8 Test Method B101C Revision of Test Method B101B 7.8 Substrate Inspected: Yes No N/A Defects List A/U* Comments Non-plated areas Cracked, chipped, broken, or otherwis
41、e damaged Blisters, delamination, or other soldermask defects Extraneous metal Bent or warped Contaminated Other 7.9 Exposed (Backside) Silicon Inspected: Yes No N/A Defects List A/U* Comments Physical damage (i.e., cracks, etch marks, pits, scuffs, dimples, dings, scratches, etc.) Foreign film or m
42、aterial Other *Acceptable/Unacceptable 8 Summary The following details shall be specified in the applicable procurement document. a) Sample size and acceptance number. b) Any exceptions or change in failure criteria stated in clause 6. e) Any change in magnification from those stated in 5.4 and 5.5.
43、 f) Any exceptions or changes in defects stated in clause 7. JEDEC Standard No. 22-B101C Page 9 Test Method B101C Revision of Test Method B101B Annex A (informative) Differences between JESD22-B101C and JESD22-B101B This table briefly describes most of the changes made to entries that appear in this
44、 standard, JESD22-B101C, compared to its predecessor, JESD22-B101B (August 2009). If the change to a concept involves any words added or deleted (excluding deletion of accidentally repeated words), it is included. Some punctuation changes are not included. Page-Clause Description of change All Repla
45、ced the term Component with the term Device 1 - 1 Replaced the term finished component with finished packaged device 1 - 2 Added two new references: JEP170 and JESD22-B118 2 - 3 Added definitions for the terms component and device, and modified the definitions for the following terms: attachment, ca
46、rrier, critical sealant, customer-processed device, and substrate 3 - 5 Modified 5.1 to emphasize that device handling should be minimized and that inspection be performed within its carrier, whenever possible. 7 - 7 Modified the first item in the defect list for Attachments 7.5 8 - 7 Added Blisters
47、, delamination, and other soldermask defects” to Substrate checklist - 7.8 8 - 7 Added new inspection checklist, 7.9 Exposed (Backside) Silicon 9 - 8 Added Summary clause, which states items that may be put in procurement document that reference this test method A.1 Differences between JESD22-B101B
48、and JESD22-B101A (informative) This table briefly describes most of the changes made to entries that appear in this standard, JESD22- B101B, compared to its predecessor, JESD22-B101A (October 2004). If the change to a concept involves any words added or deleted (excluding deletion of accidentally re
49、peated words), it is included. Some punctuation changes are not included. Page-Clause Description of change 1 - 1 In Scope, change semiconductor to Solid State Device 1 - 2 Add Informative Reference section, new Section 2, renumber all following sections 2 - 3 Remove finished packaged prior to component in three locations, since first bullet in scope defines the term components 3 - 6 Specifically call out coplanarity, and add reference to JESD22-B100 5 - 7 Add line item for tin whiskers and a
