1、 JEDEC STANDARD Byte Addressable Energy Backed Interface JESD245B (Revision of JESD245A, September 2016) JULY 2017 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors lev
2、el and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the
3、purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve pa
4、tents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound appr
5、oach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance wi
6、th this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents for alter
7、native contact information. Published by JEDEC Solid State Technology Association 2017 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees
8、not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technology Association 3103
9、 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 245B -i- BYTE ADDRESSABLE ENERGY BACKED INTERFACE (From JEDEC Board Ballot JCB-17-15, formulated under the cognizance of the JC-45.6 Subcommittee
10、on Hybrid Modules.) CONTENTS Foreword v Introduction . v 1 Scope 1 2 Normative References 1 3 Terms and definitions 2 3.1 Acronyms 2 3.2 Terms and Definitions . 3 3.3 Keywords . 4 3.4 Conventions . 5 4 Introduction 6 5 I2C 7 5.1 I2C Bus . 7 5.2 I2C transactions 7 5.3 Paging 10 5.4 Typed Block Data 1
11、1 6 Serial Presence Detect 12 6.1 Byte Addressable Energy Backed Interface Discovery . 12 7 Features . 13 7.1 Controller Ready 13 7.2 Operations 13 7.2.1 Catastrophic Save operation . 13 7.2.2 Restore operation 15 7.2.3 Erase operation . 16 7.2.4 Arm operation . 16 7.2.5 Management operations 17 7.2
12、.6 Set Energy Source Policy operation . 17 7.2.7 Set Event Notification operation . 17 7.2.8 Firmware operations . 18 7.2.9 Factory Default operation . 19 7.2.10 Reset Controller operation 20 7.2.11 Operational Unit operations 21 7.2.12 Atomic Arm and Erase operation . 21 7.2.13 Abort operation . 22
13、 7.3 Energy Source 23 7.3.1 Local Energy Source. 23 7.3.2 Tethered Energy Source . 23 7.3.3 Host Energy Source 23 7.3.4 Shared Energy Source . 23 7.3.5 Energy Source Policy . 24 7.4 Event Notification 24 JEDEC Standard No. 245B -ii- 7.5 Error and Warning Thresholds 25 7.6 Module Firmware 25 7.7 CRC
14、Algorithm 28 7.8 Error Injection 29 7.9 Statistics . 29 7.10 Thermal 30 7.11 Host Area . 31 7.12 Vendor Log Page . 31 7.13 Vendor-Specific . 31 7.14 LCOM Interface 31 7.15 Label Data . 32 7.16 Catastrophic Save transition registers 32 8 Register Map 33 8.1 Page 0 register map 33 8.1.1 Paging Mechani
15、sm registers . 36 8.1.2 Version registers . 37 8.1.3 Characteristics registers 39 8.1.4 Runtime Command registers 49 8.1.5 Runtime Command Status registers 54 8.1.6 Catastrophic Save registers . 62 8.1.7 Thresholds registers 64 8.1.8 Module registers . 67 8.1.9 NVM Subsystem registers 74 8.2 Page 1
16、register map 75 8.2.1 Paging Mechanism registers . 76 8.2.2 Energy Source Version registers . 76 8.2.3 Energy Source Characteristics registers 77 8.2.4 Energy Source Runtime Command registers 79 8.2.5 Energy Source Runtime Command Status registers . 80 8.2.6 Energy Source registers 80 8.3 Page 2 reg
17、ister map 81 8.3.1 Paging Mechanism registers . 83 8.3.2 Device Statistics registers . 83 8.3.3 Error Injection registers 92 8.3.4 Host Area registers . 96 8.4 Page 3 register map 98 8.4.1 Paging Mechanism registers . 99 8.4.2 Typed Block Data registers 100 8.4.3 Firmware Update registers 103 8.4.4
18、Byte and Word Transaction Data registers for Typed Block Data . 103 8.4.5 Block Transaction Data registers for Typed Blocked Data 108 8.5 Page 4 register map 109 8.5.1 OPEN_PAGE Offset 0x00. 109 8.5.2 PDA_SUPPORTED Offset 0x04 . 109 8.5.3 PDA_VALID Offset 0x05 . 109 8.5.4 MRx_SHARED registers Offset
19、s 0x10-0x11 to 0x1C-0x1D 110 8.6 Page 5 register map 110 JEDEC Standard No. 245B -iii- 8.6.1 OPEN_PAGE Offset 0x00 111 8.6.2 MRx_PDA_SDRAMyy registers Offsets 0x10-0x11 to 0xFE-0xFF 111 8.7 Page 6 register map 111 8.7.1 OPEN_PAGE Offset 0x00. 111 8.7.2 RCD_FUNCTIONS_SUPPORTED0 Offset 0x04 111 8.7.3
20、RCD_FUNCTIONS_SUPPORTED1 Offset 0x05 112 8.7.4 RCD_FUNCTIONS_VALID0 Offset 0x06 112 8.7.5 RCD_FUNCTIONS_VALID1 Offset 0x07 112 8.7.6 Control word registers 112 8.8 Page 7 register map 113 8.8.1 OPEN_PAGE Offset 0x00. 113 8.8.2 Control word registers 113 8.9 Page 8 register map 113 8.9.1 OPEN_PAGE Of
21、fset 0x00. 113 8.9.2 Control word registers 113 8.10 Page 9 register map 114 8.10.1 OPEN_PAGE Offset 0x00. 114 8.10.2 Control word registers 114 9 Host Operation Workflows . 115 9.1 Controller Ready workflow . 115 9.2 Catastrophic Save workflow 115 9.3 Restore workflow 115 9.4 Arm workflow . 116 9.5
22、 Erase workflow 116 9.6 Abort Running Operation workflow 116 9.7 Firmware Update workflow . 117 9.8 Typed Block Data workflow . 122 9.8.1 Reading Typed Block Data workflow 123 9.8.2 Writing Typed Block Data workflow . 124 ANNEX A (normative) SDRAM and RCD Requirements for NVRDIMM-N Modules . 125 A.1
23、 SDRAM and RCD requirements during a Catastrophic Save operation . 125 A.2 SDRAM and RCD requirements related to a Restore operation . 125 A.2.1 Overview . 125 A.2.2 Restore operation requirements . 125 A.2.3 Post-restore transition entry requirements . 126 A.2.4 Post-restore transition exit require
24、ments 131 ANNEX B (informative) revision history 135 B.1 Differences Between JESD245 (v1.0) and JESD245A (v2.0) 135 B.2 Differences Between JESD245A (v2.0) and this standard (JESD245B)(v2.1) . 135 JEDEC Standard No. 245B -iv- FIGURES Figure 1: NVDIMM-N overview . 6 Figure 2: I2C Read Byte transactio
25、n 8 Figure 3: I2C Write Byte transaction . 8 Figure 4: I2C Read Word transaction . 8 Figure 5: I2C Write Word transaction 9 Figure 6: I2C Block Read transaction 9 Figure 7: I2C Block Write transaction . 9 Figure 8: I2C paging mechanism . 11 TABLES Table 1: Required SPD fields 12 Table 2: Firmware im
26、age header common format 26 Table 3: Firmware image header format 0 . 26 Table 4: Firmware image header format 1 . 27 Table 5: Temperature value bit definition . 30 Table 6: Mode register lower byte 32 Table 7: Mode register upper byte 32 Table 8: Page 0 register map categories 33 Table 9: Page 0 re
27、gister map . 34 Table 10: Major Revision and Minor Revision fields 37 Table 11: Reset Controller Scope field 40 Table 12. Page 1 register map categories 75 Table 13. Page 1 register map 75 Table 14. Page 2 register map categories 81 Table 15. Page 2 register map 82 Table 16. Page 3 register map cate
28、gories 98 Table 17. Page 3 register map 98 Table 18. Page 4 register map 109 Table 19. Page 5 register map 110 Table 20. Page 6 register map 111 Table 21. Page 7 register map 113 Table 22. Page 8 register map 113 Table 23. Page 9 register map 114 Table 24. MR0 requirements during a post-restore tran
29、sition . 127 Table 25. MR1 requirements during a post-restore transition . 127 Table 26. MR2 requirements during a post-restore transition . 127 Table 27. MR3 requirements during a post-restore transition . 128 Table 28. MR4 requirements during a post-restore transition . 128 Table 29. MR5 requireme
30、nts during a post-restore transition . 129 Table 30. MR6 requirements during a post-restore transition . 129 Table 31. RCD requirements during a post-restore transition . 130 Table 32. Host reprogramming RCD function 0 control words after a post-restore transition 132 Table 33. Host reprogramming RC
31、D function 1 control words after a post-restore transition 133 Table 34. Host reprogramming RCD function 4 control words after a post-restore transition 133 JEDEC Standard No. 245B -v- FOREWORD This standard has been prepared by JEDEC. The purpose of this standard is definition of a byte addressable
32、 energy backed function on a non-volatile dual in-line memory module (NVDIMM). This standard defines the feature set and commands implemented by the byte addressable energy backed function on an NVDIMM-N. INTRODUCTION An NVDIMM-N is a memory module that can be integrated into a standard platform. A
33、Byte Addressable Energy Backed Function on a NVDIMM is designed to preserve data in the event of the power failure. A Byte Address Energy Backed Function is backed by a combination of SDRAM and non-volatile memory (e.g., NAND flash) on the NVDIMM-N. It operates at SDRAM speeds and provides persisten
34、t storage by backing up the SDRAM contents into the non-volatile memory in the event of a power failure. This is made possible by an Energy Source (e.g., supercapacitor) which maintains charge on the module enabling back-up of data from SDRAM to the non-volatile memory, providing a storage-class mem
35、ory solution. To be able to provide interoperability and the ability for platform and platform software (e.g., BIOS) to support NVDIMM-Ns from various manufacturers, standardization of the host to module interface, discovery mechanism, the feature set and command operations are required, as describe
36、d in this standard. JEDEC Standard No. 245B -vi- JEDEC Standard No. 245B Page 1 BYTE ADDRESSABLE ENERGY BACKED INTERFACE (From JEDEC Board Ballot JCB-17-15, formulated under the cognizance of the JC-45.6 Subcommittee on Hybrid Modules.) 1 SCOPE This standard specifies the host and device interface f
37、or a DDR4 NVDIMM-N, which is a DIMM that achieves non-volatility by copying SDRAM contents into non-volatile memory (NVM) when host power is lost using an Energy Source managed by either the module or the host. Although this standard is targeted towards DDR4 NVDIMM only, it does not preclude adoptio
38、n of this standard by other implementations (e.g., DDR3 NVDIMM). 2 NORMATIVE REFERENCES The normative documents listed in this clause contain provisions that, through reference in this text, constitute provisions of this standard. For dated references, subsequent amendments to, or revisions of, any
39、of these publications do not apply. However, parties to agreements based on this standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to ap
40、plies. JESD21C, 4.20.28 DDR4 SDRAM Registered DIMM Design Specification, Revision 1.00 (August 2015) JESD21C, 4.1.2.L-4 Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules (DDR4 SPD Document Release 4) JESD21C, 4.1.2.L-5 Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules (DDR4 SPD
41、 Document Release 5)(forthcoming) JESD21C, 4.1.6 Definitions of the EE1004-v 4 Kbit Serial Presence Detect (SPD) EEPROM and TSE2004av 4 Kbit SPD EEPROM with Temperature Sensor (TS) for Memory Module Applications JESD21C, 4.1.6-2 Definitions of the EE1004av 4 Kbit Serial Presence Detect (SPD) EEPROM
42、and TSE2004av 4 Kbit SPD EEPROM with Temperature Sensor (TS) for Memory Module Applications (forthcoming) JESD79-4A, DDR4 SDRAM (November 2013) JESD79-4B, DDR4 SDRAM (June 2017) JESD82-31, DDR4 Registering Clock Driver DDR4RCD01 (August 2016) JESD82-31A, DDR4 Registering Clock Driver DDR4RCD02 (fort
43、hcoming) JESD82-32, DDR4 Data Buffer DDR4DB01 (August 2016) JESD82-32A, DDR4 Data Buffer DDR4DB02 (forthcoming) JESD245, Byte Addressable Energy Backed Interface (December 2015) JESD245A, Byte Addressable Energy Backed Interface (September 2016) JESD248 DDR4 NVDIMM-N Design Specification (Revision 1
44、.0)(September 2016) JESD248A DDR4 NVDIMM-N Design Specification (forthcoming) I2C Bus Specification Revision 6 (4 April 2014) System Management Bus (SMBus) Specification Version 3.0 (20 December 2014) JEDEC Standard No. 245B Page 2 3 TERMS AND DEFINITIONS For the purposes of this standard, the terms
45、 and definitions given in the document included in clause 2 “Normative References” and this clause apply. 3.1 Acronyms DDR3 Double Data Rate version 3 DDR4 Double Data Rate version 4 DIMM Dual In-line Memory Module ES Energy Source I2C Inter IC (inter integrated circuit) LCOM LCOM Bus NVDIMM Non-vol
46、atile Dual In-line Memory Module NVDIMM-N NVDIMM with a Byte Addressable Energy Backed Interface function NVM Non-Volatile Memory NVRDIMM-N NVDIMM-N that is an RDIMM RCD Registering Clock Driver RDIMM Registered DIMM SDRAM Synchronous Dynamic Random Access Memory SMBus System Management Bus SPD Seri
47、al Presence Detect JEDEC Standard No. 245B Page 3 3.2 Terms and Definitions Abort: Operation that stops the currently running operation on the module. See 0. Arm: Operation that enables or disables trigger(s) for a Catastrophic Save operation. See 7.2.4. Catastrophic Save: Operation that copies the
48、SDRAM contents into NVM when power is lost. The Catastrophic Save operation is started when an enabled trigger occurs or a write to an I2C register occurs. See 7.2.1. CKE Power Down mode: RCD mode in which all input buffers are disabled except for CK_t/CK_c, DCKEn, DRST_n, and sometimes DODTn and ER
49、ROR_IN_n. See JESD82-31A (DDR4RCD02). Clock Stopped Power Down mode: RCD mode in which all input buffers are disabled except for CK_t/CK_c. See JESD82-31A (DDR4RCD02). Device Managed Policy: Energy Source policy where the module manages the Energy Source used during the Catastrophic Save operation. Energy Source: A device that is capable of storing and providing energy to the module during a Catastrophic Save operation. See 0. Erase: Operation that deletes the previously saved SDRAM image in NVM. See 0. Factory Default: Operation that erases all NVM