1、 STD-EIA JESD57-ENGL 1777 3234b00 0582CIOb 597 W . t EIINJEDEC STANDARD Bond Wire Modeling Standard EIAlJESD59 JUNE 1997 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT STD*EIA JESD59-ENGL 1997 = 3234b00 0582007 923 NOTICE EIA/JEDEC Standards and Publications contain material that has been
2、prepared, progressively reviewed, and approved through the JEDEC Council level and subsequently reviewed and approved by the EIA General Counsel. EINJEDEC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchases, f
3、acilitating interchangeability and improvement of products, and assisting the purchaser is selecting and obtaining with minimum delay the proper product for his particular need. Existence of such standards shall not in any respect predude any member or nonmember of JEDEC from manufacturing or sellin
4、g products not conforming to such standards, nor shall the existence of such standards preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. EINJEDEC Standards and Publications are adopted without regard to whether th
5、eir adoption may involve patents or articles, materials, or processes. By such action, EINJEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the EINJEDEC Standards or Publications. The information included in EINJEDEC Standards and
6、 Publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the EINJEDEC organization there are procedures whereby n EINJEDEC Standard or Publication may be further processed and ultimately becomes an ANSV
7、EIA Standard. Inquiries, comments, and suggestions relative to the content of this EINJEDEC Standard or Publication should be addressed to the JEDEC Executive Secretary at EIA Headquarters, 2500 Wilson Boulevard, Arlington, VA 22201. Published by ELECTRONIC INDUSTRIES ASSOCIATION 1997 Engineering De
8、partment 2500 Wilson Boulevard Arlington, VA 22201 “Copyright“ does not apply to JEDEC member companies as they are free to duplicate this document in accordance with the latest revision of the JEDEC Publication 21 “Manual of Organization and Proced Ure“. PRICE: Please refer to the current Catalog o
9、f EIA, JEDEC, and TIA STANDARDS and ENGINEERING PUBLICATIONS or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) Printed in U.S.A. All rights reserved 1 2 3 4 5 6 7 8 EINJEDEC Standard No. 59 BOND WIRE MODELING STANDARD CONTENTS Objective Scope Introduc
10、tion Parameter description Bond wire model 5.1 Preferred model 5.2 Model simplification Electrical parameter approximations 6.1 Length determination 6.2 Inductance approximation 6.3 Resistance approhation Implementation 7.1 Package interpretation 7.2 Implementation in a three dimensional field solve
11、r Report on models and results Annex A Informative Figures 1 Parameters and constraints 2 Coordinates 3 Parameters and coordinates 4 Simplified bond wire model 5 6 7 Bond wire sections for the preferred model Bond wire sections for simplified model Top view of bond wire Tables 1 2 3 Bond wire length
12、 calculation 4 5 Inductance formulas for calculations 6 Parameters and constraints Calculation of bond wire coordinates Calculation of simplified bond wire coordinates Simplified bond wire length calculation 1 1 1 1 3 3 4 8 8 8 8 10 1 STD-EIA JESD57-ENGL 5997 323qbOD 0582007 2Tb EWJEDEC Standard No.
13、 59 Page 1 BOND WIRE MODELING STANDARD (From JEDEC Council Ballot JCB-96-22, formulated under the cognizance of JC- 15 Committee on Electrical and Thermal Characterization Techniques for Electronic Packages and Interconnects) 1 Objective The objective of this standard is to standardize the first ord
14、er modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. 2 Scope This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a bail or wedge type wire bond confguration. 3 Introduction This stand
15、ard provides a means of describing a bond wire through the use of five parameters. By specifjmg these parameters, anyone may duplicate the drawing of the bond wire either on a plot or with a three dimensional field solver. 4 Parameter descriptions There are five parameters and two constraints needed
16、 to completely draw a bond wire. These parameters and constraints are shown in figure 1. T Figure 1 -Parameters and constraints Previous page is blank EWJEDEC Standard No. 59 Page 2 4 Parameter descriptions (contd) The parameters are: a = The angle between horizontal plane and the wire at the bond p
17、ad. = The angle between horizontal plane and the wire at the lead. d = Total distance the Wire covers in the horizontal plane. hl = The height between the bond pad and the top of the loop. h2 = The height between the bond pad and the lead. The two constraints are: X3 set at Xz + d8 and is the approx
18、imation for the location of the end of the loop. X, set at di2 and is the approximaton for loop width. (See figure 2 for coordinate locations) The R, h e (5) 121 31 STD EIA JESD57-ENGL A797 3234b00 05820Ab 43b H EWJEDEC Standard No. 59 Page 8 7 Implementation 7.1 Package interpretation Each bond wir
19、e in a package will have its own set of five parameters. The bond wire starts in the middle of the bond pad and contacts the center of the lead at distance d as shown in figure 7. bond pads bond wire leads Figure 7 -Top view of bond wire 7.2 Implementation in a three dimensional field solver The imp
20、lementation of the bond wire geometry in a three dimensional field solver should be accomplished by the translation of a polygon, representing the cross-section of the bond wire, along the one-dimensional path specified earlier. This polygon should have at least four sides and should have the same c
21、ross- sectional area as the wire itself. The number of sides the polygon contains should be included in the fjnai report along with the five parameters. 8 Report on models and results The report should describe the five parameters for each bond wire. Tables 1 and 3 (preferred model) or tables 2 and
22、4 (simplified model) should be reported along with the values of the parameters and constraints listed in table 6. If the electrical parameters were calculated, they should also be reported, along with the calculated lengths, cross-sectional area, and conductivity of the material. If the model was d
23、one using a three dimensional field solver, the number of sides of the swept polygon should be reported. STD*EIA JESD59-ENGL 1777 3234b00 0582017 372 = Parameter and Constraints hl Value (units) EWJEDEC Standard No. 59 Page 9 8 Report on models and results (contd) I h2 I 1 d d8 d/2 STD-EIA JESD59-EN
24、GL 1797 W 3234b00 0582038 209 EWJEDEC Standard No. 59 Page 10 ANNEX A - Informative Bibliography i Rosa, E. B., ?The SelfandMutual Inductances oflinear Conductors?, Builetin of the Bureau of Standards, Vol. 4, No. 2, 1908, pp 301-308. 2 Coekin, J.A., ?High-Speed Pulse Techniques ?, Elmsford, New York, Pergamon Press Inc., Maxwell House, 1975, First Edition, pp 66-67. (31 Kraus, J.D., Keith, R.C., Electromagnetics, New York, McGraw-Hill, Inc., 1973, Second Edition, pp. 162-163 and pp 295-296. - STD*EIA JESD57-ENGL 3797 323Vb00 0582037 1115 W
