1、JEDECSTANDARDTest Methods and AcceptanceProcedures for the Evaluation ofPolymeric MaterialsJESD72JUNE 2001 (Reaffirmed: JANUARY 2007)JEDEC SOLID STATE TECHNOLOGY ASSOCIATIONNOTICEJEDEC standards and publications contain material that has been prepared, reviewed, andapproved through the JEDEC Board o
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10、ington, Virginia 22201-3834or call (703) 907-7559JEDEC Standard No. 72-i-Test Methods and Acceptance Procedures for the Evaluation of Polymeric MaterialsContents1 Scope 12 Applicable Documents 13 Requirements 33.1 Apparatus 33.2 Material Acquisition Specification 33.3 Certification of Compliance 33.
11、4 Evaluation Procedures 33.5 Properties of Uncured Materials 33.6 Properties of Cured Materials 53.7 Responsibility for Test 83.8 Classification of Testing 94 Procedures 104.1 Methods of Examination and Test 104.2 Materials 104.3 Viscosity 104.4 Pot Life 114.5 Shelf Life 114.6 Thermogravimetric Anal
12、ysis 114.7 Outgassed Materials 124.8 Ionic Impurities 134.9 Bond Strength 144.10 Coefficient of Linear Thermal Expansion 154.11 Thermal Conductivity 154.12 Volume Resistivity 164.13 Dielectric Constant 174.14 Dissipation Factor 174.15 Sequential Test Environment 184.16 Density 184.17 Mechanical Inte
13、grity 194.18 Operation Life Test 204.19 Test Deviation 205.0 Summary 20JEDEC Standard No. 72-ii-JEDEC Standard No. 72Page 1TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OFPOLYMERIC MATERIALS(From Board Ballot JCB-99-48A, formulated under the cognizance of the JC-13.5 Subcommitteeon Hybri
14、d, RF/Microwave, and MCM Technology.)1 ScopeThis Test Method covers the minimum requirements that should be in effect for the evaluationand acceptance of polymeric materials for use in industrial, military, space, and other special-condition products which may require capabilities beyond standard co
15、mmercial microelectronicsapplications. It is not the intent of this Publication to specify a material, but to evaluate thematerial to assure that the quality and reliability of the microelectronic devices are notcompromised. These materials shall be classified in two types as follows:a) Type I being
16、 electrically conductive.b) Type II being electrically insulative.The user may elect to use test data from routine tests or evaluations for all or part of the usercertification.The test methods included as a part of this Publication are those which best address thosephysical, chemical, mechanical, a
17、nd electrical properties of materials which can impact thereliability of these microelectronic devices. This Publication is not designed to be exhaustive ofall techniques available as newer and more nearly absolute techniques are constantly beingdeveloped.2 Applicable documentsThe Standards and Publ
18、ications listed below, of current issue, form a part of this Test Method tothe extent specified herein.MIL-STD-883, Test Methods and Procedures for MicroelectronicsMIL-PRF-38534, General Specification Hybrid MicrocircuitsMIL-PRF-38535, General Specification for Integrated Circuits (Microcircuits) Ma
19、nufacturingFED-STD-406, Federal Test Method Standard for Test of AdhesivesANSI/NCSL Z540-1, General Requirements for Calibration Laboratories, Measuring and TestEquipmentASTM C177, Steady State Heat Flux Measurement and Thermal Transmission Properties byMeans of the Guarded Hot Plate ApparatusJEDEC
20、Standard No. 72Page 22 Applicable documents (contd)ASTM C518, Steady State Heat Flux Measurement and Thermal Transmission Properties byMeans of the Heat Flowmeter ApparatusASTM D150, AC Loss Characteristics and Dielectric Constant of Solid Electrical InsulatingMaterialsASTM D257, DC Resistance or Co
21、nductance of Insulating MaterialsASTM D972, Evaporation Loss of Lubricating Greases and OilsASTM D1002, Apparatus Shear Strength of Single-Lap-Joint Adhesively Bonded MetalSpecimens by Tensile Loading (Metal to Metal)ASTM D3574, Flexible Cellular Materials-Slab, Bonded, and Molded Urethatne FormsAST
22、M D3386, Coefficient of Linear Thermal Expansion of Electrical Insulating Materials byThermogravimetric MethodASTM D3850, Rapid Thermal Degradation of Solid Electrical Insulating Materials byThermogravimetric Method (TGA)ASTM E1461, Thermal Diffusivity of Solids by the Flash MethodJEP114, Guidelines
23、 for Particle Impact Noise Detection (PIND) Testing, Operator Training andCertificationJESD22-A104, Temperature CyclingJESD22-A106, Thermal ShockJESD22-B103, Variable Frequency VibrationJESD22-B104, Mechanical ShockJEDEC Standard No. 72Page 33 Requirements3.1 ApparatusSuitable measurement equipment
24、necessary to determine compliance with the requirements ofthe applicable acquisition document and other apparatus as required in the referenced testmethods.3.2 Material acquisition specificationThe microcircuit manufacturer shall prepare an acquisition specification describing the detailedelectrical
25、, mechanical, chemical, and thermal requirements for the polymeric material to beacquired. The requirements shall not be less stringent than those imposed by this method, butmay be increased to reflect the specific parameters of a particular material or requirements of aparticular application.3.3 Ce
26、rtificate of complianceThe material supplier shall provide upon the users request a certificate of compliance for eachpolymeric order. This certificate shall contain the actual test data for the suppliers testing asprescribed in this Publication.3.4 Evaluation proceduresEvaluation procedures for pol
27、ymeric materials shall be performed as specified in 4.1 through4.18.3.5 Properties of uncured materials3.5.1 MaterialsThe components of a polymeric material and/or system shall be examined in accordance withTable 1 and 4.2 and shall be uniform in consistency and free of lumps or foreign matter whene
28、xamined in film, liquid or other acceptable form. Any filler shall remain uniformly dispersed andsuspended during the required pot life (see 4.4). the electrically conductive fillers used in type Imaterials shall be gold, silver, alloys of gold or silver, or other precious metals.3.5.1.1 Encapsulati
29、ng compoundsEncapsulating compounds are liquid material and are to tested in accordance with therequirements in Table 1.3.5.1.2 Molding compoundsMolding compounds as used in microelectronic devices are normally solid material and are tobe tested in accordance with MIL-PRF-38535.JEDEC Standard No. 72
30、Page 43.5 Properties of uncured materialsTable 1 RequirementsTest Adhesives Absorbers Film Dielectrics 1/ Particle GettersTest or Condition Method Supplier User Supplier User Supplier User Supplier UserParagraph A C A C A C A C A C A C A C A CMaterials (3.5.1) 4.2 X X X X X X X X X X X X X X X XVisc
31、osity (3.5.2) 4.3 X X X X X XPot Life (3.5.3) 4.4 X X X X X XShelf Life (3.5.4) 4.5 X X X XThermogravimetric analysis (3.6.2) 4.6 X X X X X X XOutgassed materials (3.6.3) 4.7 X X X X XIonic impurities (3.6.4) 4.8 X X X X X XBond Strength (3.6.5) 4.9 X2/ XXCoefficient of linear thermalexpansion (3.6.
32、6)4.10 XThermal conductivity (3.6.7) 4.11 XVolume resistivity (3.6.8) 4.12 XType 1 materials X2/ XType 2 materials X X X X XDielectric constant (3.6.9) 4.13 X XDissipation factor (3.6.10) 4.14 X XSequential test environment (3.6.11) 4.15 X X XDensity (3.6.12) 4.16Mechanical integrity (3.6.13) 4.17 X
33、Operating life test (3.6.14) 4.18 XTest Desiccants Junction Coatings MicrowaveAbsorbersEncapsulatingCompoundsTest or Condition Method Supplier User Supplier User Supplier User Supplier UserParagraph A C A C A C A C A C A C A C A CMaterials (3.5.1) 4.2 X X X X X X X X X X X X X X X XViscosity (3.5.2)
34、 4.3 XPot Life (3.5.3) 4.4Shelf Life (3.5.4) 4.5 X X XThermogravimetric analysis (3.6.2) 4.6 X X X X XOutgassed materials (3.6.3) 4.7 X X XIonic impurities (3.6.4) 4.8 X X X X XBond Strength (3.6.5) 4.9 XXCoefficient of linear thermalexpansion (3.6.6)4.10 XThermal conductivity (3.6.7) 4.11 XVolume r
35、esistivity (3.6.8) 4.12 XType 1 materialsType 2 materials X X XDielectric constant (3.6.9) 4.13 XDissipation factor (3.6.10) 4.14 XSequential test environment (3.6.11) 4.15 X XDensity (3.6.12) 4.16 X X X XMechanical integrity (3.6.13) 4.17Operating life test (3.6.14) 4.18 X XA = Performed at accepta
36、nce testing.C = Performed at certification testing.1/ Film dielectrics are defined as polymeric materials that are used in film form to act as eitherinterlayer dielectrics, passivation layers, and/or circuit support films.2/ Required at 25C test condition only. No high temperature storage required.J
37、EDEC Standard No. 72Page 53.5 Properties of uncured materials3.5.2 ViscosityThe viscosity of paste materials shall be determined in accordance with 4.3. The viscosity,including an acceptable range, shall be specified in the material acquisition document.3.5.3 Pot lifeThe pot life when required shall
38、 be determined in accordance with 4.4 and shall be a minimumof 1 hour. The polymeric material shall be used within the pot life period after removal from thecontainer, after mixing, or after thawing to room temperature in the case of premixed frozenpolymers.3.5.4 Shelf lifeThe shelf life, defined as
39、 the time that the polymeric material continues to meet therequirements of this Publication shall be determined in accordance with 4.5. This shelf life shallbe a minimum of 12 months at 40 C or below for one component system and a minimum of12 months at room temperature (32 C maximum) for two compon
40、ent systems unless thesupplier certifies for some other period of time. The shelf life expiration date shall be affixed tothe container by the supplier and no material shall be used after that date, unless it has beenrequalified.3.5.4.1 Re-certificationMaterials may be re-certified by the user once.
41、3.6 Properties of cured polymer materials3.6.1 Curing of polymer materialsThe material must be capable of meeting the requirements of this document when curedaccording to the suppliers instructions. The cure schedule for supplier tests shall be identical forall tests and shall be reported. The cure
42、schedule for the user tests shall be the minimum cureschedule plus, as a minimum, the pre-seal bake specified in the users assembly document andshall be reported. Deviation from the suppliers recommended cure schedule will requireverification by the user of the materials performance.3.6.2 Thermograv
43、imetric analysis (TGA)3.6.2.1 Thermal stabilityThe thermal stability of the cured material shall be determined in accordance with 4.6. Unlessotherwise noted, the weight loss at 200C shall be less than or equal to 1.0 percent of the curedmaterial weight.JEDEC Standard No. 72Page 63.6 Properties of cu
44、red polymer materials (contd)3.6.2.2 Filler contentPolymeric materials using a filler to promote properties such as electrical and thermalconductivity shall be tested in accordance with 4.6 to determine the inorganic filler content. Foracceptance testing, the percent filler content shall not differ
45、from the filler content in the certifiedmaterials by more than 2 percent.3.6.3 Outgassed materialsOutgassing of the cured material shall be determined in accordance with 4.7. Outgassedmoisture, as determined in 4.7.1, shall be less than or equal to 5,000 ppmv (0.5 percent V/V) for3 packages (0 failu
46、res) or 5 packages (1 failure). Other gaseous species present in quantitiesgreater than or equal to 100 ppmv (0.01 percent V/V) shall be reported in ppmv or percent V/V.The data obtained in 4.7.2 shall also be reported in the same manner but for information only.The outgassing of the cured getter sh
47、all be determined in accordance with 4.7. The vaporcontent of the package with getter shall not exceed 2000 ppmv after 24 hours at 150 C and3000 ppmv after 1000 hours at 150 C.3.6.4 Ionic impuritiesThe ionic impurity content shall be determined in accordance with 4.8 and shall meet therequirements s
48、pecified in Table 2. Ionic content analysis shall be in triplicate for certification andsingle analysis for acceptance testing. Failure at acceptance shall require the passing of twoadditional samples.TABLE 2 Ionic impurity requirements.Total ionic content specifiedelectrical conductance50 ppm shall
49、 be reported in ppm.3.6.5 Bond strengthThe bond strength of a polymeric material shall be determined in accordance with 4.9 at 25 C,and 25 C after 1,000 hours at 150 C. the bond strength shall meet as a minimum the 1.0Xrequirement specified in figure 2019-4 of Method 2019 of MIL-STD-883 at each test condition.The manufacturer should test to shear or until twice the minimum 1.0X shear force is reached.JEDEC Standard No. 72Page 73.6 Properties of cured polymer materials (contd)3.6.6 Coefficient of linear thermal expansionThe coefficient of linear thermal expansion shall b
