1、JEDEC STANDARD Test Methods and Acceptance Procedures for the Evaluation of Polymeric Materials JESD72A (Revision of JESD72, June 2001) MARCH 2018 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through
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9、tate Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 72 -i- Test Methods and Acceptance Procedures for the Evaluation of Polymeric Materials Contents 1 Scope . 1 2 App
10、licable Documents . 1 3 Requirements 3 3.1 Apparatus 3 3.2 Material Acquisition Specification 3 3.3 Certification of Compliance . 3 3.4 Evaluation Procedures 3 3.5 Properties of Uncured Materials 3 3.6 Properties of Cured Materials . 5 3.7 Responsibility for Test . 8 3.8 Classification of Testing 9
11、4 Procedures 10 4.1 Methods of Examination and Test . 10 4.2 Materials 10 4.3 Viscosity 10 4.4 Pot Life 11 4.5 Shelf Life . 11 4.6 Thermogravimetric Analysis 11 4.7 Outgassed Materials . 12 4.8 Ionic Impurities 13 4.9 Bond Strength . 14 4.10 Coefficient of Linear Thermal Expansion 15 4.11 Thermal Co
12、nductivity 15 4.12 Volume Resistivity . 16 4.13 Dielectric Constant 17 4.14 Dissipation Factor . 17 4.15 Sequential Test Environment 18 4.16 Density 18 4.17 Mechanical Integrity 19 4.18 Operation Life Test 20 4.19 Test Deviation . 20 5 Summary 20 Annex A (informative) Differences between revisions 2
13、1 JEDEC Standard No. 72 -ii- JEDEC Standard No. 72A Page 1 TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS (From Board Ballot JCB-18-04, formulated under the cognizance of the JC-13.5 Subcommittee on Hybrid, RF/Microwave, and MCM Technology.) 1 Scope This Test Method
14、 covers the minimum requirements that should be in effect for the evaluation and acceptance of polymeric materials for use in industrial, military, space, and other special-condition products which may require capabilities beyond standard commercial microelectronics applications. It is not the inten
15、t of this Publication to specify a material, but to evaluate the material to assure that the quality and reliability of the microelectronic devices are not compromised. These materials shall be classified in two types as follows: 1) Type I being electrically conductive. 2) Type II being electrically
16、 insulative. The user may elect to use test data from routine tests or evaluations for all or part of the user certification. The test methods included as a part of this Publication are those which best address those physical, chemical, mechanical, and electrical properties of materials which can im
17、pact the reliability of these microelectronic devices. This Publication is not designed to be exhaustive of all techniques available as newer and more nearly absolute techniques are constantly being developed. 2 Applicable documents The Standards and Publications listed, of current issue, form a par
18、t of this Test Method to the extent specified herein. MIL-STD-883, Test Methods and Procedures for Microelectronics MIL-PRF-38534, General Specification Hybrid Microcircuits MIL-PRF-38535, General Specification for Integrated Circuits (Microcircuits) Manufacturing FED-STD-406, Federal Test Method St
19、andard for Test of Adhesives ANSI/NCSL Z540-1, General Requirements for Calibration Laboratories, Measuring and Test Equipment ASTM C177, Steady State Heat Flux Measurement and Thermal Transmission Properties by Means of the Guarded Hot Plate Apparatus ASTM C518, Steady State Heat Flux Measurement a
20、nd Thermal Transmission Properties by Means of the Heat Flowmeter Apparatus ASTM D150, AC Loss Characteristics and Dielectric Constant of Solid Electrical Insulating Materials JEDEC Standard No. 72A Page 2 2 Applicable documents (contd) ASTM D257, DC Resistance or Conductance of Insulating Materials
21、 ASTM D972, Evaporation Loss of Lubricating Greases and Oils ASTM D1002, Apparatus Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tensile Loading (Metal to Metal) ASTM D3574, Flexible Cellular Materials-Slab, Bonded, and Molded Urethatne Forms ASTM D3386, Coefficient of Line
22、ar Thermal Expansion of Electrical Insulating Materials by Thermogravimetric Method ASTM D3850, Rapid Thermal Degradation of Solid Electrical Insulating Materials by Thermogravimetric Method (TGA) ASTM E1461, Thermal Diffusivity of Solids by the Flash Method JEP114, Guidelines for Particle Impact No
23、ise Detection (PIND) Testing, Operator Training and Certification JESD22-A104, Temperature Cycling JESD22-A106, Thermal Shock JESD22-B103, Variable Frequency Vibration JESD22-B104, Mechanical Shock 3 Requirements 3.1 Apparatus Suitable measurement equipment necessary to determine compliance with the
24、 requirements of the applicable acquisition document and other apparatus as required in the referenced test methods. 3.2 Material acquisition specification The microcircuit manufacturer shall prepare an acquisition specification describing the detailed electrical, mechanical, chemical, and thermal r
25、equirements for the polymeric material to be acquired. The requirements shall not be less stringent than those imposed by this method, but may be increased to reflect the specific parameters of a particular material or requirements of a particular application. 3.3 Certificate of compliance The mater
26、ial supplier shall provide upon the users request a certificate of compliance for each polymeric order. This certificate shall contain the actual test data for the suppliers testing as prescribed in this Publication. JEDEC Standard No. 72A Page 3 3.4 Evaluation procedures Evaluation procedures for p
27、olymeric materials shall be performed as specified in 4.1 through 4.18. 3.5 Properties of uncured materials 3.5.1 Materials The components of a polymeric material and/or system shall be examined in accordance with Table 1 and 4.2 and shall be uniform in consistency and free of lumps or foreign matte
28、r when examined in film, liquid or other acceptable form. Any filler shall remain uniformly dispersed and suspended during the required pot life (see 4.4). The electrically conductive fillers used in type I materials shall be gold, silver, alloys of gold or silver, or other precious metals. 3.5.1.1
29、Encapsulating compounds Encapsulating compounds are liquid material and are to be tested in accordance with the requirements in Table 1. 3.5.1.2 Molding compounds Molding compounds as used in microelectronic devices are normally solid material and are to be tested in accordance with MIL-PRF-38535. J
30、EDEC Standard No. 72A Page 4 3.5 Properties of uncured materials (contd) Table 1 Requirements Test Adhesives Absorbers Film Dielectrics 1/ Particle Getters Test or Condition Method Supplier User Supplier User Supplier User Supplier User Paragraph A C A C A C A C A C A C A C A CMaterials (3.5.1) 4.2
31、X X X X X X X X X X X X X X X XViscosity (3.5.2) 4.3 X X X X X X Pot Life (3.5.3) 4.4 X X X X X X Shelf Life (3.5.4) 4.5 X X X X Thermogravimetric analysis (3.6.2) 4.6 X X X X X X X Outgassed materials (3.6.3) 4.7 X X X X XIonic impurities (3.6.4) 4.8 X X X X X X Bond Strength (3.6.5) 4.9 X2/ X X Co
32、efficient of linear thermal expansion (3.6.6) 4.10 X Thermal conductivity (3.6.7) 4.11 X Volume resistivity (3.6.8) 4.12 X Type 1 materials X2/ X Type 2 materials X X X X X Dielectric constant (3.6.9) 4.13 X X Dissipation factor (3.6.10) 4.14 X X Sequential test environment (3.6.11) 4.15 X X X Densi
33、ty (3.6.12) 4.16 Mechanical integrity (3.6.13) 4.17 XOperating life test (3.6.14) 4.18 XTest Method Paragraph Desiccants Junction Coatings Microwave Absorbers Encapsulating Compounds Test or Condition Supplier User Supplier User Supplier User Supplier User A C A C A C A C A C A C A C A C Materials (
34、3.5.1) 4.2 X X X X X X X X X X X X X X X X Viscosity (3.5.2) 4.3 X Pot Life (3.5.3) 4.4 Shelf Life (3.5.4) 4.5 X X X Thermogravimetric analysis (3.6.2) 4.6 X X X X X Outgassed materials (3.6.3) 4.7 X X X Ionic impurities (3.6.4) 4.8 X X X X X Bond Strength (3.6.5) 4.9 X X Coefficient of linear therm
35、al expansion (3.6.6) 4.10 X Thermal conductivity (3.6.7) 4.11 X Volume resistivity (3.6.8) 4.12 X Type 1 materials Type 2 materials X X X Dielectric constant (3.6.9) 4.13 X Dissipation factor (3.6.10) 4.14 X Sequential test environment (3.6.11) 4.15 X X Density (3.6.12) 4.16 X X X X Mechanical integ
36、rity (3.6.13) 4.17 Operating life test (3.6.14) 4.18 X X A = Performed at acceptance testing. C = Performed at certification testing. 1/ Film dielectrics are defined as polymeric materials that are used in film form to act as either interlayer dielectrics, passivation layers, and/or circuit support
37、films. 2/ Required at 25 C test condition only. No high temperature storage required. JEDEC Standard No. 72A Page 5 3.5 Properties of uncured materials (contd) 3.5.2 Viscosity The viscosity of paste materials shall be determined in accordance with 4.3. The viscosity, including an acceptable range, s
38、hall be specified in the material acquisition document. 3.5.3 Pot life The pot life when required shall be determined in accordance with 4.4 and shall be a minimum of 1 hour. The polymeric material shall be used within the pot life period after removal from the container, after mixing, or after thaw
39、ing to room temperature in the case of premixed frozen polymers. 3.5.4 Shelf life The shelf life, defined as the time that the polymeric material continues to meet the requirements of this Publication shall be determined in accordance with 4.5. This shelf life shall be a minimum of 12 months at 40 C
40、 or below for one component system and a minimum of 12 months at room temperature (32 C maximum) for two component systems unless the supplier certifies for some other period of time. The shelf life expiration date shall be affixed to the container by the supplier and no material shall be used after
41、 that date, unless it has been requalified. 3.5.4.1 Re-certification Materials may be re-certified by the user once. 3.6 Properties of cured polymer materials 3.6.1 Curing of polymer materials The material must be capable of meeting the requirements of this document when cured according to the suppl
42、iers instructions. The cure schedule for supplier tests shall be identical for all tests and shall be reported. The cure schedule for the user tests shall be the minimum cure schedule plus, as a minimum, the pre-seal bake specified in the users assembly document and shall be reported. Deviation from
43、 the suppliers recommended cure schedule will require verification by the user of the materials performance. 3.6.2 Thermogravimetric analysis (TGA) 3.6.2.1 Thermal stability The thermal stability of the cured material shall be determined in accordance with 4.6. Unless otherwise noted, the weight los
44、s at 200 C shall be less than or equal to 1.0 percent of the cured material weight. JEDEC Standard No. 72A Page 6 3.6 Properties of cured polymer materials (contd) 3.6.2.2 Filler content Polymeric materials using a filler to promote properties such as electrical and thermal conductivity shall be tes
45、ted in accordance with 4.6 to determine the inorganic filler content. For acceptance testing, the percent filler content shall not differ from the filler content in the certified materials by more than 2 percent. 3.6.3 Outgassed materials Outgassing of the cured material shall be determined in accor
46、dance with 4.7. Outgassed moisture, as determined in 4.7.1, shall be less than or equal to 5,000 ppmv (0.5 percent V/V) for 3 packages (0 failures) or 5 packages (1 failure). Other gaseous species present in quantities greater than or equal to 100 ppmv (0.01 percent V/V) shall be reported in ppmv or
47、 percent V/V. The data obtained in 4.7.2 shall also be reported in the same manner but for information only. The outgassing of the cured getter shall be determined in accordance with 4.7. The vapor content of the package with getter shall not exceed 2000 ppmv after 24 hours at 150 C and 3000 ppmv af
48、ter 1000 hours at 150 C. 3.6.4 Ionic impurities The ionic impurity content shall be determined in accordance with 4.8 and shall meet the requirements specified in Table 2. Ionic content analysis shall be in triplicate for certification and single analysis for acceptance testing. Failure at acceptanc
49、e shall require the passing of two additional samples. Table 2 Ionic impurity requirements Total ionic content specified electrical conductance 50 ppm shall be reported in ppm. . 3.6.5 Bond strength The bond strength of a polymeric material shall be determined in accordance with 4.9 at 25 C, and 25 C after 1,000 hours at 150 C. The bond strength shall
