1、JEDEC STANDARD 300 mV Interface JESD8-28 JUNE 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal cou
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9、efer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 8-28 Page 1 300mV Interface Standard (From JEDEC Board Ballot JCB-15-11, formulated under the cognizance of the JC-16 Committee on Interface Technology.) 1 Scope This standard is to define and interface with a
10、CMOS rail to rail signal that uses a 300 mV signal swing. This specification defines the maximum signaling rate, the signal levels, overshoot and undershoot limits, and the maximum input capacitance. This interface is useful in short distance applications, typically of less than 5 mm. An important a
11、pplication of this interface is for in-package, die-to-die interconnection. In-package applications may also take advantage of reduced ESD (Electro-Static Discharge) tolerance requirements. This interface may be used in both logic to memory and logic to logic applications. The memory used may be eit
12、her volatile or non-volatile. This specification only defines interface parameters. The function and interconnection of other parts of the devices is to be defined elsewhere. JEDEC Standard No. 8-28 Page 2 2 Standard specifications 2.1 RECOMMENDED DC operation conditions Table 1 Recommended DC opera
13、tion conditions 2.2 VDDQ tracking with internal logic voltage VDDAt any time, the internal logic voltage VDDshould be equal or larger than VDDQ. 2.3 Input capacitance definitions Table 2 Input capacitance definitions 2.4 Signal levels for input signals1. Table 3 Recommended operational signal voltag
14、e level specification 1Input signals include both Uni and BiDi signals. Parameter Symbol Min Typ Max Unit Supply Voltage for Driver / Receiver VDDQ0.285 0.3 0.315 V Receiver Reference Voltage VREF0.45* VDDQ0.5* VDDQ0.55* VDDQV Symbol Parameter Up to 2 Gbps Units NotesMin Max CinPad Capacitance for a
15、ll Input pins - 0.4 pF CioPad Capacitance for BiDi pins - 0.4 pF Parameter Symbol Min Max Unit* Input High Voltage VIH0.70 * VDDQVDDQ+ 0.2 V Input Low Voltage VIL-0.2 0.30 * VDDQV * ALL SIGNAL LEVELS ARE REFERENCED TO VSSQ. JEDEC Standard No. 8-28 Page 3 2 Standard specifications (contd) 2.5 Receive
16、r mask for input signals Maximum input receiver mask will be a rectangular box shape between VIHand VILand 45% of UI. NOTE A UI is Unit Interval of time needed to send one data bit, as 1 / (data rate) or 1 / (data frequency *2 for DDR signal). 2.6 Slew rate for input signals Minimum Input Slew rate
17、when operating up to 2 Gbps will be 1 V/ns. 2.7 Overshoot/Undershoot conditions for input signals Table 4 Overshoot/Undershoot conditions for input signals Parameter Up to 2 Gbps Units Max Maximum peak amplitude allowed for overshoot area (see Figure 1) 0.3 V Maximum peak amplitude allowed for under
18、shoot area (see Figure 1) 0.3 V Maximum area above VDDQ(see Figure 1)* 0.1 V-ns Maximum area below VSSQ(see Figure 1)* 0.1 V-ns * Max/Min area is only for 2 Gbps Figure 1 Overshoot and Undershoot Definition 1 UI VDDQMaximum Amplitude Overshoot Area VSSQVolts (V) Maximum Amplitude Undershoot Area Tim
19、eJEDEC Standard No. 8-28 Page 4 Standard Improvement Form JEDEC JESD8-28 The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry regarding usage of the subject standard. Individuals or companies are invited to submit comments to JEDEC. All comments will
20、be collected and dispersed to the appropriate committee(s). If you can provide input, please complete this form and return to: JEDEC Attn: Publications Department 3103 North 10thStreet Suite 240 South Arlington, VA 22201-2107 Fax: 703.907.7583 1. I recommend changes to the following: Requirement, clause number The referenced clause number has proven to be: Unclear Too Rigid In Error Other 2. Recommendations for correction: 3. Other suggestions for document improvement: Submitted by Name: Phone: Company: E-mail: Address: City/State/Zip: Date:
