1、JEDEC SOLID STATE TECHNOLOGY ASSOCIATIONJEDECSTANDARDJESD84-C43June 2007Embedded MultiMediaCard (eMMC) Mechanical StandardNOTICEJEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and ap
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5、ication, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard.No claims to be in conformance with this standard may be made unless all
6、 requirements stated in the standard are met.Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or www.jedec.orgPublished byJEDEC Solid State Technology Association 20072500 Wils
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9、 through entering into a license agreement. For information, contact:JEDEC Solid State Technology Association2500 Wilson BoulevardArlington, Virginia 22201-3834or call (703) 907-7559JEDEC Standard No. JESD84-C43-i-ForewordThe Embedded MultiMediaCard (eMMC) Mechanical Standard has been prepared by JE
10、DEC. The Multi-MediaCard Association, hereafter referred to as MMCA, exists to promote adoption of a global standard for a compact, robust, affordable storage and retrieval device, the MultiMediaCard. Consumers worldwide will benefit from this standard, allowing them to carry with them, information
11、and entertainment that fits their needs, wherever they are, whenever they wish.JEDEC has taken the basic MMCA specification and adopted it for embedded applications, calling it “eMMC.” In addition to the packaging differences, eMMC devices use a reduced voltage interface. These specifications are de
12、tailed in the JEDEC JC-64 “JEDEC MMC Electrical Interface Specification.”The purpose of the standard is the mechanical definition of the eMMC.IntroductionThe MultiMediaCard is an universal low-cost data storage and communication media. It is designed to cover a wide area of applications such as smar
13、t phones, cameras, organizers, PDAs, digital recorders, MP3 players, pagers, electronic toys, etc. Targeted features are high mobility and high performance at a low cost price. These features include low power consumption and high data throughput at the memory card inter-face.MultiMediaCard communic
14、ation is based on an advanced 10-signal bus. The communication protocol is defined as a part of this standard and referred to as the MultiMediaCard mode.JEDEC Standard No. JESD84-C43 -ii-JEDEC Standard No. JESD84-C43Page 1Embedded MultiMediaCard (eMMC) Mechanical Standard1 ScopeThis standard describ
15、es the mechanical features of the eMMC.2 Normative referenceThere are no normative references for this document at this time.3 Terms and definitionsFor the purposes of this publication, the following terms and definitions apply:MMC: MultiMediaCardeMMC Embedded MultiMediaCardJEDEC Standard No. JESD84
16、C43Page 24 eMMC General descriptionThe JEDEC eMMC Mechanical Standard describes the mechanical and physical attributes of the Embed-ded MultiMediaCard.There are three physical configurations, AA, AB, and BA, that are each discussed in this document.NOTE: As used in this document, “shall” or “will”
17、denotes a mandatory provision of the standard. “Should” denotes a provision that is recommended but not mandatory. “May” denotes a feature whose presence does not preclude compliance, that may or may not be present at the option of the implementor.4.1 Device signalsJEDEC eMMC devices transfer data v
18、ia a configurable number of data-bus signals. The communication signals are shown in Table 1. Device initialization uses only the CMD channel and is, therefore, compatible with all devices.4.2 eMMC ComponentsBall assignments for AA and AB devices are depicted in Figure 1 on page 3. Ball assignments
19、for BA devices are shown in Figure 2 on page 4.Table 1 Communication signals Signal Symbol DescriptionClock CLK Each cycle of the clock directs a transfer on the command line and on the data line(s). The frequency can vary between the minimum and the maximum clock frequency.Command CMD This signal i
20、s a bidirectional command channel used for device initialization and com-mand transfers. The CMD signal has two operating modes: open-drain for initialization, and push-pull for command transfer. Commands are sent from the MultiMediaCard bus master to the device, and responses are sent from the devi
21、ce to the host.DATA DAT7:0 These are bidirectional data signals. The DAT signals operate in push-pull mode.By default, after power-up or RESET, only DAT0 is used for data transfer. The memory controller can configure a wider data bus for data transfer using either DAT3:0 (4-bit mode) or DAT7:0 (8-bi
22、t mode).JEDEC eMMC includes internal pull-up resistors for data lines DAT7:1. Immediately after entering the 4-bit mode, the device disconnects the internal pull-up resistors on the DAT1, DAT2, and DAT3. Correspondingly, immediately after entering the 8-bit mode, the device disconnects the internal
23、pull-ups on the DAT1DAT7.JEDEC Standard No. JESD84-C43Page 3Figure 1 Ball assignment: AA and BA devices (see MO-276 drawings for details)NC NC NC NCNC NC NC NCNCDAT7VccQVccNCCLKNCVssQNCNCNCNCNCNCNCNCNCNCNCNCNCNCABCDEFGHJKLMNPNCDAT3VDDINCNCNCNCNCNCNCNCNCVssQNCDAT0DAT4NCNCNCNCNCNCNCNCNCNCNCVccQDAT1DAT
24、5VssQNCVccQVccQVssQDAT2DAT6NCNCVccVssNCNCNCCMDVssQVccQNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCVssNCNCNCNCNCNCNCNCVssNCNCNCNCNCNCNCVccNCNCNCNCNCNCNCNCNCVssVccNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNC1 2 3 4 5 6 7 8 9 10 11 12 13 14Top ViewBall DownIndexNCNC NCNCNCNC NCNCR
25、TUVWYAAABACADAEAFAGAH1AB: 12mm x 18mm x 1.4mmAA: 12mm x 16mm x 1.4mmAB: 12mm x 18mm x 1.4mmAA: 12mm x 16mm x 1.4mmDrawing proportional;not precisely to scaleNote 1:Empty balls are position indicators only; they do notrepresent actual solder balls.Note 2:Ball pitch: 0.5mmAAABAAABJEDEC Standard No. JE
26、SD84-C43Page 4Figure 2 Ball assignments: BA devices (see MO-276 drawings for details)4.3 eMMC Physical descriptionJEDEC eMMC has 10 signals. The host is connected to the device using a dedicated 10-ball connector. Ball assignments are shown in Table 2 on page 5. Note that Table 2 continues on the fo
27、llowing page.NCDAT7VccQVccNCCLKNCVssQNCNCNCNCNCNCNCNCNCNCNCNCNCNCABCDEFGHJKLMNPNCDAT3VDDINCNCNCNCNCNCNCNCNCVssQNCDAT0DAT4NCNCNCNCNCNCNCNCNCNCNCVccQDAT1DAT5VssQNCVccQVccQVssQDAT2DAT6NCNCVccVssNCNCNCCMDVssQVccQNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCVssNCNCNCNCNCNCNCNCVssNCNCNCNCNCNCNCVccNCNCNCNCNCNCNCNCNCV
28、ssVccNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNC1 2 3 4 5 6 7 8 9 10 11 12 13 14Top ViewBall DownIndexBA devices:11.5mm x 13mmx 1.3mmBA devices:11.5mm x 13mmx 1.3mmNote 1:Ball pitch: 0.5mmJEDEC Standard No. JESD84-C43Page 5Table 2 Ball assignments 169-Ball Devices 15
29、3-Ball Devices Symbol Type Ball FunctionAA and AB Devices BA DeviceW6 M6 CLK Input Clock: Each cycle directs a 1-bit transfer on the com-mand and DAT lines.W5 M5 CMD Input Command: A bidirectional channel used for device initial-ization and command transfers. Command has two operating modes:1) Open-
30、drain for initialization.2) Push-pull for fast command transfer.H3 A3 DAT0 I/O Data I/O0: Bidirectional channel used for data transfer.H4 A4 DAT1 I/O Data I/O1: Bidirectional channel used for data transfer.H5 A5 DAT2 I/O Data I/O2: Bidirectional channel used for data transfer.J2 B2 DAT3 I/O Data I/O
31、3: Bidirectional channel used for data transfer.J3 B3 DAT4 I/O Data I/O4: Bidirectional channel used for data transfer.J4 B4 DAT5 I/O Data I/O5: Bidirectional channel used for data transfer.J5 B5 DAT6 I/O Data I/O6: Bidirectional channel used for data transfer.J6 B6 DAT7 I/O Data I/O7: Bidirectional
32、 channel used for data transfer.M6, N5, T10, U9 E6, F5, J10, K9 VCCSupply VCC: Flash memory I/F and Flash memory power supply.K6, W4, Y4, AA3, AA5C6, M4, N4, P3, P5 VCCQ Supply VCCQ: Memory controller core and MMC interface I/O power supply.M7, P5, R10, U8 E7, G5, H10, K8 VSSSupply VSS: Flash memory
33、 I/F and Flash memory ground connection.K4, Y2, Y5, AA4, AA6C4, N2, N5, P4, P6 VSSQ Supply VSSQ: Memory controller core and MMC I/F ground connection.K2 C2 VDDiVDDi:Connect 0.1F capacitor from VDDi to ground.JEDEC Standard No. JESD84-C43Page 6MiscellaneousL4 D4 NC Index Index: Can be connected to gr
34、ound or left floating.A4, A6, A9, A11, B2, B13, D1, D14, H1, H2, H6, H7, H8, H9, H10, H11, H12, H13, H14, J1, J7, J8, J9, J10, J11, J12, J13, J14, K1, K3, K5, K7, K8, K9, K10, K11, K12, K13, K14, L1, L2, L3, L12, L13, L14, M1, M2, M3, M5, M8, M9, M10, M12, M13, M14, N1, N2, N3, N10, N12, N13, N14, P
35、1, P2, P3, P10, P12, P13, P14,R1, R2, R3, R5, R12, R13, R14, T1, T2, T3, T5, T12, T13, T14, U1, U2, U3, U5, U6, U7, U10, U12, U13, U14, V1, V2, V3, V12, V13, V14, W1, W2, W3, W7, W8, W9, W10, W11, W12, W13, W14, Y1, Y3, Y6, Y7, Y8, Y9, Y10, Y11, Y12, Y13, Y14, AA1, AA2, AA7, AA8, AA9, AA10, AA11, AA
36、12, AA13, AA14, AE1, AE14, AG2, AG13, AH4, AH6, AH9, AH11A1, A2, A6, A7, A8, A9, A10, A11, A12, A13, A14, B1, B7, B8, B9, B10, B11, B12, B13, B14, C1, C3, C5, C7, C8, C9, C10, C11, C12, C13, C14, D1, D2, D3, D12, D13, D14, E1, E2, E3, E5, E8, E9, E10, E12, E13, E14, F1, F2, F3, F10, F12, F13, F14, G
37、1, G2, G3, G10, G12, G13, G14, H1, H2, H3, H5, H12, H13, H14, J1, J2, J3, J5, J12, J13, J14, K1, K2, K3, K5, K6, K7, K10, K12, K13, K14, L1, L2, L3, L12, L13, L14, M1, M2, M3, M7, M8, M9, M10, M11, M12, M13, M14, N1, N3, N6, N7, N8, N9, N10, N11, N12, N13, N14, P1, P2, P7, P8, P9, P10, P11, P12, P13
38、 P14NC No connect:Can be connected to ground or left floating.Table 2 Ball assignments (continued)169-Ball Devices 153-Ball Devices Symbol Type Ball FunctionAA and AB Devices BA DeviceP.O. Box 303, Sunol, CA 94586, U.S.A. www.mmca.orgMultiMediaCard, MMCA, and the MMCA logo are trademarks of the Mul
39、tiMediaCard Association. All other trademarks are the property of their respective owners.Standard Improvement Form JEDEC: _JESD84-C43_ The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry regarding usage of the subject standard. Individuals or compan
40、ies are invited to submit comments to JEDEC. All comments will be collected and dispersed to the appropriate committee(s).If you can provide input, please complete this form and return to:JEDECAttn: Publications Department2500 Wilson Blvd. Suite 220Arlington, VA 22201-3834Fax: 703.907.75831. I recom
41、mend changes to the following:Requirement, paragraph number:Test method number: Paragraph number:The referenced paragraph number has proven to be:Unclear Too rigid In errorOther:2. Recommendations for correction:3. Other suggestions for document improvement:Submitted by:Name: Phone:Company: Email:AddressCity/State/Zip Date:
