1、JEDEC STANDARD Inspection Criteria for Microelectronic Packages and Covers JESD9B (Revision of JESD9A, April 1987) MAY 2011 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Dire
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7、for alternative contact information. Published by JEDEC Solid State Technology Association 2011 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individua
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9、ber of copies through entering into a license agreement. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards and Documents for alternative contact information. JEDEC Standard No.
10、9B -i- INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS Contents Page Foreword ii 1 Scope 1 2 Normative Reference 1 3 Terms and Definitions 2 4 General Requirements 10 4.1 Quality System 10 4.2 Quality and Screening 10 4.3 Order of Precedence 10 4.4 Inspection Magnification 10 4.5 Control
11、ling Dimension 10 5 Insulator Criteria (Metal Packages: Glass-to-metal and Ceramic-to-metal Seals) 11 5.1 Insulator Bubbles 11 5.2 Insulator Cracks, Chip-outs, Crazing 13 5.3 Insulator Climb, Overflow, Splatter 17 5.4 Other Insulator Conditions 19 6 Braze Criteria (Metal Packages) 21 6.1 Undercut Br
12、aze, Non-continuous Braze, Misalignment 21 6.2 Porous and Peeling Braze 22 6.3 Braze Run-out 23 6.4 Braze Climb 24 7 Leads (Metal and Ceramic Packages) 26 7.1 Lead Nicks, Pits, Voids, Indentations, Scratches, Over-etching, Protrusions 26 7.2 Lead Surface Finish 29 7.3 Off-center, Bent, Angled, or Br
13、oken Leads 31 8 General Package Criteria (Metal Packages) 34 8.1 Package Nicks, Pits, Voids, Indentations, Scratches, Protrusions, Chip-outs 34 8.2 Package Surface Finish 40 9 General Cover Criteria (Metal Covers) 42 9.1 Cover Nicks, Pits, Voids, Indentations, Scratches, Protrusions, Chip-outs 42 9.
14、2 Cover Surface Finish 45 10 General Package Criteria (Ceramic Packages: Non-metallized Areas) 46 10.1 Ceramic Chip-outs, Cracks, Delamination, Separation, Voiding, Protrusions, Fins 46 11 Metallization Criteria (Ceramic Packages) 50 11.1 General 50 11.2 Contact Pad Metallization 50 11.3 Seal Area M
15、etallization 53 11.4 Bonding Area Metallization 57 11.5 Die Attach Area 61 11.6 Braze Pad Metallization 64 11.7 Castellation Metallization 66 12 Lead Attachment (Ceramic Packages) 67 12.1 Lead to Braze Pad Attachment 67 12.2 Lead to Pad Misalignment 69 Annex A (informative) Index of Figures 70 Annex
16、 B (informative) Differences between revisions 73 JEDEC Standard No. 9B -ii- Foreword The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits / microcircuits (hereaf
17、ter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard implements a complete r
18、e-write and significant technical changes and information from the previous edition. This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: Exter
19、nal Visual. This standard provides the package manufacturer, microcircuit manufacturer, and microcircuit customer a complete set of microelectronic package workmanship inspection requirements. JEDEC Standard No. 9B Page 1 INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS (From JEDEC Board
20、Ballot JCB-11-23, formulated under the cognizance of the JC-13.5 Committee on Hybrid Microcircuit Technology) 1 Scope This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids). 2 Normative Reference The following normative
21、documents contain provisions that, through reference in this text, constitute provisions of this standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this standard are encouraged to investigate the
22、possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. MIL-PRF-38534, Hybrid Microcircuits, General Specification for MIL-PRF-38535, Microcircuits, General Specification fo
23、r MIL-STD-883, Test Method Standard, Microcircuits Military Standards are available in electronic format from: http:/assist.daps.dla.mil and in hard copy format from: Standardization Documents Order Desk Building 4D, 700 Robbins Avenue Philadelphia, PA 19111-5904 JEDEC Standard No. 9B Page 2 3 Terms
24、 and Definitions For the purpose of this standard, the terms, definitions, and symbols of MIL-PRF-38534, MIL-PRF-38535, and MIL-STD-883 and the following shall apply and shall be used in the applicable procurement documentation: 3.1 annular ring: The metallization pad area around the top or bottom o
25、f a castellation hole. 3.2 base: The bottom main support area of a package. 3.3 base metal: The unplated main metal material of which the metal package, lead, or braze is constructed. 3.4 blistering: Detachment of material from the surface creating a bubble-like shape. 3.5 bonding (critical) area: T
26、he surface on a lead or package to which wires will be bonded (i.e., the wirebond area). NOTE 1 This term is not to be confused with the “die bond area” which is specified as the “die attach area” in this specification. NOTE 2 The critical wire bond area on a ceramic package is a metallization trace
27、 whose length is 0.015 inches (0.381 mm) and whose width is 80% of the width of the designed wirebond trace, as specified in the applicable procurement document. 3.6 bonding trace; wirebond trace: A metallized path on a package or substrate to which a bond wire is wirebonded. 3.7 braze: A metallic m
28、aterial used to join two metals or metallized components. 3.8 braze climb: The distance from the surface of the package to the top of the braze line on a lead, not including braze flash. 3.9 braze flash: The braze material that has flowed over or out of the designed contained braze area and is less
29、than 0.001 inches (0.0254 mm) thick. 3.10 braze run-out: The braze material that has flowed over or out of the designed contained braze area, not including braze flash. 3.11 braze, undercut: The braze material recessed from the package surface at the interface of the package wall and the package bas
30、e. 3.12 bubble, subsurface: A bubble in the glass-to-metal seal that is below the top surface of the seal and is not open or can not be opened with a wood probe. JEDEC Standard No. 9B Page 3 3 Terms and Definitions (contd) 3.13 bubble, surface; open-surface bubble: A bubble in the glass-to-metal sea
31、l that is at the top surface of the seal and is either open or can be opened with a wood probe. 3.14 castellation: A semicircular or crown-shaped metallized surface. 3.15 chip-out: An area where a crack has allowed a portion of the insulator to break away leaving a void in the insulator at the metal
32、 interface. 3.16 concentric: Having a common center point. 3.17 corrosion: The breaking down or destruction of a material, especially a metal, through a chemical reaction. NOTE The most common form of corrosion is rusting, which occurs when iron combines with oxygen and water. 3.18 cover: A lid that
33、 is soldered, seam-sealed, projection-welded, etc. to the package to create a hermetically sealed microcircuit. 3.19 crack, circumferential: A crack that appears on the surface of an insulator and follows the shape of the package hole. 3.20 crack, meniscus: A crack confined to the meniscus area of t
34、he seal above the average low point of the insulator. 3.21 crack, radial: A crack that appears on the surface of the insulator and either starts at the package and extends towards the lead or starts at the lead and extends towards the package propagating past the average low point of the insulator.
35、3.22 crazing: Multiple minute cracks that appear on the surface of the insulator. 3.23 delamination: The detachment of a sheet-like layer of material from a surface. JEDEC Standard No. 9B Page 4 3 Terms and Definitions (contd) 3.24 die (attach) area: An area of a package used for die placement and t
36、ypically located on the bottom inside surface of the base of the package. NOTE For ceramic package cavities, the die attach area is defined as the area that is within a 0.020-inch (0.508-mm) perimeter from the die attach cavity wall (Figure 3.24-1). Figure 3.24-1 Critical die attach area in a cerami
37、c package cavity 3.25 eyelet: A ring of metal used as the outside member of a hermetic lead seal to hold a feed-through in place, typically soldered into the package. 3.26 fin: A fine feather edge protrusion occurring at an edge. 3.27 fin, hanging: A fin that can be moved with a probe but is still c
38、onnected to the surface. 3.28 flaking: The detachment of a sheet-like layer of material from a surface. 3.29 foreign material: Any adhering material or residue not intentionally added or included in the piece part composition by design. 3.30 heat sink: A heat exchange material, typically metal or ce
39、ramic, designed to absorb and dissipate excess heat from one or more devices in a circuit. 3.31 indentation: A notch or deep recess in a surface. 3.32 insulator: A lead seal material (typically matched glass, compression glass, or brazed ceramic) that electrically isolates a lead from the package an
40、d creates a hermetic seal. 3.33 insulator climb: The amount of insulator measured from the surface of the package to the top of the insulator line on the lead. JEDEC Standard No. 9B Page 5 3 Terms and Definitions (contd) 3.34 insulator overflow: The insulator that flows over or out of the designed c
41、ontained insulator area, typically the package hole. 3.35 insulator splatter: Small particles of the insulator that adhere to the surfaces of the package or lead during fusing and remain attached after cleaning or plating or both. 3.36 insulator webbing: The joining of overflow between adjacent seal
42、s. 3.37 lead: The flexible, semi-flexible, or solid/rigid conductor leading out from the microcircuit and used for electrical and mechanical connections. NOTE 1 Leads may be classified as round (pin, nail-head pin, terminal, etc.) and flat (etched or stamped planar, etc.). NOTE 2 Leads are typically
43、 surrounded by an insulator for electrical connections isolated from the metal package or brazed directly to the metal package for electrical (ground) connections to the package. They are typically brazed directly to the braze pad for electrical connections to a ceramic package. 3.38 lead head: On a
44、 ceramic package, the portion of the lead meant to be brazed to the braze pad. 3.39 meniscus: The area of the insulator that wicks / wets up the lead above the average low point of the seal at the lead and package (on both sides of the seal) at the lead and/or package interface (Figure 3.39-1). Figu
45、re 3.39-1 Meniscus JEDEC Standard No. 9B Page 6 3 Terms and Definitions (contd) 3.40 mounting surface; seating plane: The external area of the package on which the package will mount to the end application PCB, heat sink, etc. NOTE This is typically the base on the external, opposite side of the pac
46、kage cavity die attach or substrate attach area. 3.41 nick: A small notch, groove, chip, dent, etc. cut into or existing in a surface and typically due to mechanical damage. 3.42 package: The body of the device, case, header, housing, etc. 3.43 package exterior: The exterior of the package that will
47、 be exposed to the usage and storage environment. NOTE Leads projecting to the exterior of the package are called “outside” leads. 3.44 package hole: A hole in the package intended by design, typically an external mounting hole or feed-through hole filled with a glass or ceramic seal. 3.45 package i
48、nterior; package cavity: The interior of the package that will become the sealed cavity containing and protecting the product circuitry connected to the leads extending to the interior of the package. NOTE Leads projecting into this area are called “inside” leads. 3.46 pad, braze: A metallized pad o
49、n the ceramic microcircuit package used to braze a lead for electrical and mechanical connections. 3.47 pad, contact: A metallized pad on the outer edge of the ceramic microcircuit package used for electrical and mechanical connections, typically a castellation. 3.48 peeling: The detachment of a sheet-like layer of material from a surface. 3.49 pit: A hollow or indentation in a surface, typically caused by a chemical attack. 3.50 plating: A thin coating of metal applied to the base metal or another plating layer by mechanical, chemical, or electrochemical means. 3.51 polymer: Any of
