KS C IEC 62137-3-2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints《电子零件装配技术 焊接结合的环境和耐久性试验方法选择指南》.pdf

上传人:ownview251 文档编号:816882 上传时间:2019-02-12 格式:PDF 页数:48 大小:901.32KB
下载 相关 举报
KS C IEC 62137-3-2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints《电子零件装配技术 焊接结合的环境和耐久性试验方法选择指南》.pdf_第1页
第1页 / 共48页
KS C IEC 62137-3-2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints《电子零件装配技术 焊接结合的环境和耐久性试验方法选择指南》.pdf_第2页
第2页 / 共48页
KS C IEC 62137-3-2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints《电子零件装配技术 焊接结合的环境和耐久性试验方法选择指南》.pdf_第3页
第3页 / 共48页
KS C IEC 62137-3-2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints《电子零件装配技术 焊接结合的环境和耐久性试验方法选择指南》.pdf_第4页
第4页 / 共48页
KS C IEC 62137-3-2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints《电子零件装配技术 焊接结合的环境和耐久性试验方法选择指南》.pdf_第5页
第5页 / 共48页
点击查看更多>>
资源描述

1、 KSKSKSKSKSKSKSK KSKSKS KSKSK KSKS KSK KS KS C IEC 62137 3 KS C IEC 62137 3:2012 2012 11 19 http:/www.kats.go.krKS C IEC 62137 3:2012 : ( ) ( ) ( ) : (http:/www.standard.go.kr) : :2012 11 19 2012-0617 : : (KPCA) ( 025097294) (http:/www.kats.go.kr). 10 5 , . KS C IEC 62137 3:2012 i . iii . iv 1 1 2 2

2、 3 .3 4 4 4.1 4 4.2 6 5 8 5.1 8 5.2 .9 5.3 .10 5.4 11 6 11 6.1 / SMD .11 6.2 .14 6.3 15 6.4 .16 6.5 18 6.6 19 A( ) 21 B( ) 23 C( ) 24 D( ) 27 E( ) 29 F( ) .31 G( ) .33 H( ) 38 1 5 2 SMD .6 3 7 4 8 5 11 KS C IEC 62137 3:2012 ii G.1 35 H.1 .39 1 1 2 .2 3 , SMD .9 4 .9 5 .10 6 .12 7 .13 8 13 9 14 10 15

3、 11 .15 12 .16 13 .17 14 .18 15 .18 16 .19 17 .20 A.1 (SN96,5AG3CU,5) 21 A.2 .22 B.1 .23 C.1 26 C.2 .26 C.3 26 D.1 .27 E.1 29 E.2 30 F.1 .32 G.1 .33 G.2 ( ) .36 G.3 .37 H.1 38 H.2 39 KS C IEC 62137 3:2012 iii . , , . , , KS C IEC 62137 3:2012 iv 2008 1 IEC/PAS 621373, Electronics assembly technology

4、Selection guidance of environmental and endurance test methods for solder joints . KS C IEC 62137 3:2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints 1 (SMD) . 1 . . ( ) . 1 KS C IEC 62137 3:2012 2 - . , . Sn96, 5Ag3Cu, 5 2 . - . ,

5、. . 2 2 . . ( ) . KS C IEC 60068 1, 1: KS C IEC 60068 2-78, ( ) KS C IEC 60194, , KS C IEC 61188 5( ): KS C IEC 61190 1-1, 1-1: KS C IEC 61190 1-2, 1-2: KS C IEC 61249 2-7:2002, 2-7: E , ( ) KS C IEC 62137, FBGA, BGA, FLGA, LGA, SON QFN KS C IEC 62137 1-1, KS C IEC 62137 3:2012 3 1-1: KS C IEC 62137

6、 1-2, 1-2: IEC 60068 2-2:2007, 2: , B: IEC 60068 2-14:1994, 2: N: IEC 62137 1-3(91/708/CDV), 1-3: IEC 62137 1-4(91/746/CDV), 1-4: IEC 62137 1-5(91/743/CDV), 1-5: 3 KS C IEC 60194 . 3.1 0.1 wt% 3.2 SMD SMD 3.3 SMD SMD SMD 3.4 SMD SMD SMD SMD 3.5 SMD SMDs , SMD 3.6 SMD SMDs SMDs 3.7 SMD CTE(coefficien

7、t of thermal expansion) KS C IEC 62137 3:2012 4 , , . 3.8 SMD SMDs 3.9 SMD SMD 3.10 SMD . 3.11 SMD . 3.12 SMD ( ) . 3.13 . , . 4 4.1 1 . . 4.2 . KS C IEC 62137 3:2012 5 1 ( ) / a, bKS C IEC 62137: B SMD aKS C IEC 62137 1-1 SMD ( ) aKS C IEC 62137 1-2 SMD a C SMD a D ( )cSMD ON/OFF / KS C IEC 62137 1

8、-4 SMD KS C IEC 62137 1-5 SMD ON/OFF / dKS C IEC 62137 1-3 SMD d E SMD F ( )c TH/ ON/OFF / G TH/ H TH/ . . . a . . b . BGA LGA . c . 1) ( ): Sn-Ag-Cu, Sn-Zn, Sn-Bi Sn-In 2) / : Sn-Zn 3) : Sn-Bi d Sn-Ag-Cu, Sn-Zn, Sn-Bi Sn-In KS C IEC 62137 3:2012 6 4.2 4.2.1 2 . 2 SMD 2 ( ) 2 , A,B C 3 2 ,/ A,B C 5

9、(cap ) 2 , A,B C ( ) 4 , A,B C C 1 4 A,B C C C 2 6 B A,B C 3 4 A,B A,B C C 2 , A,B B C (cap ) 2 MELF / / A,B B C 2 ( ) 2 A,B C C 3 6 C B C C 6 QFP, SOP A,B C C C B B . 6 QFN, SON A,B C B B B BGA, FBGA A,B C B B B LGA, FLGA A,B C B B B 1 A: . B: . C: . : . 2 . a) : SMD b) : SMD KS C IEC 62137 3:2012

10、7 2 SMD ( ) 3 . BGA, LGA QFN . 4 . . 5 . . 6 . a) ( ): Sn-Ag-Cu, Sn-Zn, Sn-Bi Sn-In b) / : Sn-Zn c) : Sn-Bi 4.2.2 ( ) . , . . . . , 3 . 3 , PWB A B A A TH B A A B TH A A 1 A: , B: , : . 2 . a) : b) : c) : d) : 3 Sn Ag Cu Sn Zn . 4 TH . . KS C IEC 62137 3:2012 8 5 5.1 a) . , 4 . 4 ( ) Sn Ag Cu Sn96,

11、5Ag3Cu, 5(A30C5) Sn Zn Sn91Zn9(Z90) Sn89Zn8Bi3(Z80B30) Sn Bi Bi58Sn42(B580) Sn In Sn88In8Ag3, 5Bi, 5(N80A35B5) Sn Cu Sn99, 3Cu, 7(C7) b) KS C IEC 61249 2-7 . , . , . . c) . SMDs . . . d) , SMD 3 . . KS C IEC 61188 5 . KS C IEC 62137 3:2012 9 : mm 3 , SMD 5.2 . 4 5 . Sn96,5Ag,3Cu,5Sn91Zn9,aSn89Zn8Bi3

12、 Bi58Sn42 Sn88In8Ag3,5Bi,5T1 150 130 100 140 T2 180 150 120 160 T3 220 200 150 206 T4 (2505) (2205) (1905) (2205) t1 (9030) s (9030) s (9030) s (9030) s t2 20 60 s 20 60 s 20 60 s 20 60 s aSn91Zn9 N2 . 4 PWB 1.6 t 90( ) (S)()KS C IEC 62137 3:2012 10 T0 t0s Tp tps Sn96, 5Ag3Cu, 5(A30C5) 100 120 30 90

13、 2505 3 5 Sn99, 3Cu,7(C7) 100 120 30 90 2505 3 5 5 5.2.1 . 5.3 5.3.1 ( ) KS C IEC 60068 2-14( ) SMDs , , . . ( ) , ( A ). 5 . , 500 1 000 . (S)() ( ): Tp : tp : T0 : t0KS C IEC 62137 3:2012 11 5 Sn96, 5Ag3Cu, 5 Sn91Zn9, Sn89Zn8Bi3 Bi58Sn42 Sn88In8Ag3, 5Bi, 5 40 40 40 40 30 min 30 min 30 min 30 min 1

14、25 125 85 125 30 min 30 min 30 min 30 min 5.3.2 (Bi58Sn42 ) KS C IEC 60068 2-2 SMD , , , . a) : 85 b) : 500 h 1 000 h 5.3.3 ( ) (Sn91Zn9 Sn89Zn8Bi3 ) KS C IEC 60068 2-78 SMD , , , . a) : 65 , 85 % b) : 500 h 1 000 h 5.4 a) . SMDs , , / . . b) . . / . c) . 6 6.1 / SMD KS C IEC 62137 3:2012 12 SMD , , . . 6.1.1 SMD . 6 45 . . . 0.5 mm QFP 0.008 3 mm/s(0.5 mm/min) . KS C IEC 62137 1-

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1