KS D 0259-2012 Methods of measurement of thickness thickness variation and bow for silicon wafer《硅片的厚度、厚度变化和弯曲度的测定方法》.pdf

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3、urface) . KS D 0259:2012 2 3 . 4 KS I ISO 14644 1 7 5 . 6 a) 4 . 2 , 2 90 . b) , 5 . c) 3 . 3 . . 7 7.1 KS B 5247 , KS B 5206 1 m . , , . 7.2 8 mm 3.5 mm . . 8 8.1 , 2 m . 2 mm2 . 8.2 2 mm ( 1 ). KS D 0259:2012 3 1 8.3 KS I ISO 14644 1 7 8.4 (scribe) 8.5 0.13 1.27 mm (0.130.025) mm . 8.5.1 0.25 m .

4、8.5.2 13 mm 1.6cm2 , 25 mm 2 2 m . 8.5.3 9.1 mm28.4 mm . 9 9.1 0.13 mm . 9.1.1 (production testing) (referee test) . 9.2 2 m . 9.3 9.2 0.13 mm 0.13 mm , ( 2 ). 6 mm4512330KS D 0259:2012 4 2 9.3.1 2 m , . 10 10.1 . 10.2 2 mm ( 1)( 1 ). 2 m , . 10.3 10.2 2 , ( 2)( 1 ). 10.4 90 3 2 mm , , ( 3)( 1 ). 10

5、.5 10.4 4 2 mm , ( 4)( 1 ). 10.6 10.4 4 2 mm , ( 5)( 1 ). 0.13 mm 0.13 mm 2 m KS D 0259:2012 5 11 11.1 , . 12 12.1 7.1 1 m, 784 mN . 12.2 3 3 ( ), . 6 mm . 3 3 13 13.1 . 13.2 . a) 5 mm 4 5 4 a) b) 30 6 mm 4 5 4 b) c) 5 mm 4 5 3 ( 4 10) KS D 0259:2012 6 ： mm a) b) 4 14 14.1 5 , m . m . 5 14.2 3 . , X

6、 m . , Y m ( 6 ). (B, m) . 2)( YXB= 5 5 6 30 KS D 0259:2012 7 6 15 . a) b) ( ) c) d) e) f) (m) g) , KS D 0259:2012 8 KS D 0259:2012 . 1989 1999 , 2002 , 2007 , 2002 . I , (bow) 1989 KS D 0259 , 75 mm , (bow) 75 mm , . , . ASTM F 533(Test Method for Thickness and Thickness Variation of Silicon Slices

7、), F 534(Test Method for Bow of Silicon Slices), F 657(Standard Test Method for Measuring Warp and Total Thickness Varation on Silicon Wafers by Noncontact Scanning), DIN 50441/1(Measuring der Geometrischen Dimensionen Von Halbleiterschiben) . II . , , . III 1 , a) , . IC LSI ( ) , , . , . . TTV(Tot

8、al Thickness Variation), LTV(Local Thickness Variation), TIR(Total Indicator Reading) , 5 . , , , , . KS D 0259:2012 9 b) . ASTM F 533, F 534, F 657 DIN 50411/1 . 2 a) JEDIA 43： 1987( ) “ , .” . ASTM “SORI” , . b) 3 25 75 mm 5 , 100, 125, 150, 200 mm . ASTM F 534 0.25 (6.35 mm) . mm , 6 mm . 3 ASTM

9、F 534 . c) 3 , . . 3 X , Y (X Y)/2 , . , . 100 mm , . 2007 1 . . KS B 6741( ) 3.2 “ ” “ ” 6. “c) 3 . 3 . .” 8.5 “0.13 1.27 mm (0.130.025) mm .” “ (National Bureau of Standard) .” . 8.5.1 “ 0.25 m .” “ 0.25 m .” . 2012 1 (KS M ISO 14644 1) KS I ISO 14644 1 . , 153787 1 92 3(13) (02)26240114 (02)262401489 http:/ Korean Agency for Technology and Standards http:/www.kats.go.kr KS D 0259:2012 KSKSKS SKSKS KSKS SKS KS SKS KSKS SKSKS KSKSKS Methods of measurement of thickness, thickness variation and bow for silicon wafer ICS 77.120.99