NAVISTAR MPAPS S-K-0 0-2015 Table of Contents CSection K CClips and Clamps-English Series.pdf

上传人:postpastor181 文档编号:963214 上传时间:2019-03-10 格式:PDF 页数:1 大小:125.76KB
下载 相关 举报
NAVISTAR MPAPS S-K-0 0-2015 Table of Contents CSection K CClips and Clamps-English Series.pdf_第1页
第1页 / 共1页
亲,该文档总共1页,全部预览完了,如果喜欢就下载吧!
资源描述

1、This document is restricted and may not be sent outside Navistar, Inc. or reproduced without permission from Corporate Technical Standards. Suppliers are required to assume all patent liability. 2015 by Navistar, Inc. JUNE 2015 Page 1 of 1 NAVISTAR, INC. Material, Parts, and Process Specifications (

2、MPAPS) NUMBER: MPAPS S-K-0.0 Former Designation: ESP-K-0.0 TITLE: Table of ContentsSection KClips and Clamps-English Series CURRENT REV No.: 1506 DATE: June 2015 WRITTEN/EDITED BY: Materials Engineering APPROVED BY: Materials Engineering SUPERSEDES: ESP-K-0.0 - June 2001 PRINTED COPIES OF THIS DOCUM

3、ENT MUST BE VERIFIED FOR CURRENT REVISION This specification may involve hazardous materials, equipment, and procedures. This specification does not purport to address all of the safety issues associated with its use. The user is responsible to consult appropriate safety and health practices and to determine the applicability of regulatory limits prior to use. Change Notice: Changed to New MPAPS format. Heavy Duty T-Bolt Clamps - (Noun Code - 1640) - English Series MPAPS S-K-1.115-GS/PL

展开阅读全文
相关资源
猜你喜欢
  • BS EN 61188-5-3-2007 Printed boards and printed board assemblies - Design and use - Attachment (land joint) considerations - Components with gull- wing leads on two sides《印制电路板和印制电.pdf BS EN 61188-5-3-2007 Printed boards and printed board assemblies - Design and use - Attachment (land joint) considerations - Components with gull- wing leads on two sides《印制电路板和印制电.pdf
  • BS EN 61188-5-4-2007 Printed boards and printed board assemblies - Design and use - Attachments (land joint) considerations - Components with J leads on two sides《印制电路板和印制电路板组件 设计和.pdf BS EN 61188-5-4-2007 Printed boards and printed board assemblies - Design and use - Attachments (land joint) considerations - Components with J leads on two sides《印制电路板和印制电路板组件 设计和.pdf
  • BS EN 61188-5-5-2007 Printed boards and printed board assemblies - Design and use - Attachment (land joint) considerations - Components with gull- wing leads on four sides《印制电路板和印制.pdf BS EN 61188-5-5-2007 Printed boards and printed board assemblies - Design and use - Attachment (land joint) considerations - Components with gull- wing leads on four sides《印制电路板和印制.pdf
  • BS EN 61188-5-6-2003 Printed boards and assemblies - Design and use - Attachment (land joint) considerations - Chip carriers with J-leads on four sides《印制板和组件 设计和使用 附件条件 四面带有J形引线的片.pdf BS EN 61188-5-6-2003 Printed boards and assemblies - Design and use - Attachment (land joint) considerations - Chip carriers with J-leads on four sides《印制板和组件 设计和使用 附件条件 四面带有J形引线的片.pdf
  • BS EN 61188-5-8-2008 Printed boards and nprinted board nassemblies — Design nand use — nPart 5-8 Attachment (land joint) nconsiderations — Area array ncomponents (BGA FBGA CGA LGA).pdf BS EN 61188-5-8-2008 Printed boards and nprinted board nassemblies — Design nand use — nPart 5-8 Attachment (land joint) nconsiderations — Area array ncomponents (BGA FBGA CGA LGA).pdf
  • BS EN 61188-7-2017 Printed boards and printed board assemblies Design and use Electronic component zero orientation for CAD library construction《印制电路板和印制电路板组件 设计和使用 CAD文库结构的电子元件零定位.pdf BS EN 61188-7-2017 Printed boards and printed board assemblies Design and use Electronic component zero orientation for CAD library construction《印制电路板和印制电路板组件 设计和使用 CAD文库结构的电子元件零定位.pdf
  • BS EN 61189-1-1997 Test methods for electrical materials printed boards and other interconnection structures and assemblies - General test methods and methodology《印刷电路板和互连结构及附件用电气材.pdf BS EN 61189-1-1997 Test methods for electrical materials printed boards and other interconnection structures and assemblies - General test methods and methodology《印刷电路板和互连结构及附件用电气材.pdf
  • BS EN 61189-11-2013 Test methods for electrical materials printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperatu.pdf BS EN 61189-11-2013 Test methods for electrical materials printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperatu.pdf
  • BS EN 61189-2-2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structu.pdf BS EN 61189-2-2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structu.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1