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IEC 60384-21-1 CORR 1-2004 Fixed capacitors for use in electronic equipment - Part 21-1 Blank detail specification Fixed surface mount multilayer capacitors of ceramic dielectric C.pdf
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IEC 60384-20-1 CORR 1-2008 Fixed capacitors for use in electronic equipment - Part 20-1 Blank detail specification - Fixed metallized polyphenylene sulfide film dielectric surface .pdf
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IEC 60384-19-1-2006 Fixed capacitors for use in electronic equipment - Part 19-1 Blank detail specification - Fixed metallized polyethylene-terephthalate film dielectric surface mo.pdf
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36
IEC 60384-15-3-1984 Fixed capacitors for use in electronic equipment Part 15 Sectional specification Fixed tantalum capacitors with non-solid or solid electrolyte Blank detail sp.pdf
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IEC 60384-15-2-1984 Fixed capacitors for use in electronic equipment Part 15 Sectional specification Fixed tantalum capacitors with non-solid or solid electrolyte Blank detail sp.pdf
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612
IEC 60191-2-1966 Mechanical standardization of semiconductor devices Part 2 Dimensions《半导体器件的机械标准化 第2部分 尺寸》.pdf
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IEC 60191-2 AMD 9-2003 Mechanical standardization of semiconductor devices - Part 2 Dimensions Amendment 9《半导体器件的机械标准化.第2部分 尺寸.修改件9》.pdf
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IEC 60191-2 AMD 8-2003 Mechanical standardization of semiconductor devices - Part 2 Dimensions Amendment 8《半导体器件的机械标准化.第2部分 尺寸.修改件8》.pdf
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62
IEC 60191-2 AMD 7-2002 Mechanical standardization of semiconductor devices - Part 2 Dimensions Amendment 7《半导体器件的机械标准化.第2部分 尺寸.修改件7》.pdf
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56
IEC 60191-2 AMD 6-2002 Mechanical standardization of semiconductor devices - Part 2 Dimensions Amendment 6《半导体器件的机械标准化.第2部分 尺寸.修改6》.pdf
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