1、Lessons Learned Entry: 0314Lesson Info:a71 Lesson Number: 0314a71 Lesson Date: 1993-04-15a71 Submitting Organization: MSFCa71 Submitted by: White, MargoSubject: Contamination, Silicone; Effect on Bonding Description of Driving Event: Silicone was used to compensate for the differences in coefficient
2、 of thermal expansion between electrical components and the basic epoxy module material. The silicone was transferred in some manner to the module baseplates and resulted in a poor bond and subsequent cracking.Lesson(s) Learned: Silicone, being colorless and fluidlike, can easily contaminate equipme
3、nt if not subjected to thorough fabrication controls. Silicone contamination can interfere with bonding.Recommendation(s): Provide an isolated area for silicone application, exclude hardware from the area when possible except for the hardware requiring silicone application, and provide personnel tra
4、ining.Evidence of Recurrence Control Effectiveness: The source data indicates that separate silicone application facilities and controls were established to prevent reoccurrence.Documents Related to Lesson: N/AMission Directorate(s): Provided by IHSNot for ResaleNo reproduction or networking permitt
5、ed without license from IHS-,-,-N/AAdditional Key Phrase(s): a71 HardwareAdditional Info: Approval Info: a71 Approval Date: 1994-04-15a71 Approval Name: White, Margoa71 Approval Organization: EH44a71 Approval Phone Number: 205-544-4182Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
