1、 Collection of SANS standards in electronic format (PDF) 1. Copyright This standard is available to staff members of companies that have subscribed to the complete collection of SANS standards in accordance with a formal copyright agreement. This document may reside on a CENTRAL FILE SERVER or INTRA
2、NET SYSTEM only. Unless specific permission has been granted, this document MAY NOT be sent or given to staff members from other companies or organizations. Doing so would constitute a VIOLATION of SABS copyright rules. 2. Indemnity The South African Bureau of Standards accepts no liability for any
3、damage whatsoever than may result from the use of this material or the information contain therein, irrespective of the cause and quantum thereof. ISBN 978-0-626-23156-9 SANS 61000-5-6:2009Edition 1IEC TR 61000-5-6:2002Edition 1SOUTH AFRICAN NATIONAL STANDARD Electromagnetic compatibility (EMC) Part
4、 5-6: Installation and mitigation guidelines Mitigation of external EM influences This national standard is the identical implementation of IEC TR 61000-5-6:2002 and is adopted with the permission of the International Electrotechnical Commission. Published by SABS Standards Division 1 Dr Lategan Roa
5、d Groenkloof Private Bag X191 Pretoria 0001Tel: +27 12 428 7911 Fax: +27 12 344 1568 www.sabs.co.za SABS SANS 61000-5-6:2009 Edition 1 IEC TR 61000-5-6:2002 Edition 1 Table of changes Change No. Date Scope National foreword This South African standard was approved by National Committee SABS TC 73, E
6、lectromagnetic compatibility, in accordance with procedures of the SABS Standards Division, in compliance with annex 3 of the WTO/TBT agreement. This SANS document was published in October 2009. TECHNICALREPORTIECTR 61000-5-6First edition2002-06Electromagnetic compatibility (EMC) Part 5-6:Installati
7、on and mitigation guidelines Mitigation of external EM influencesCompatibilit lectromagntique (CEM) Partie 5-6:Guides dinstallation et dattnuation Attnuation des influences lectromagntiques externesPRICE CODE IEC 2002 Copyright - all rights reservedNo part of this publication may be reproduced or ut
8、ilized in any form or by any means, electronic ormechanical, including photocopying and microfilm, without permission in writing from the publisher.International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 919 0
9、3 00 E-mail: inmailiec.ch Web: www.iec.chSFor price, see current catalogueCommission Electrotechnique InternationaleInternational Electrotechnical Commission PUBLICATION FONDAMENTALE EN CEMBASIC EMC PUBLICATIONSANS 61000-5-6:2009This s tandard may only be used and printed by approved subscription an
10、d freemailing clients of the SABS . 2 TR 61000-5-6 IEC:2002(E)CONTENTSFOREWORD.3INTRODUCTION.51 Scope and general considerations61.1 Scope61.2 General considerations62 Reference documents.83 Terms, definitions and acronyms 104 Mitigation of radiated and conducted disturbances .134.1 Topological conc
11、epts.134.2 Mitigation needs 144.3 The general concept of enclosure154.4 Interactions at the enclosure boundary165 Shielding 165.1 General .165.2 Classification of protection zones 185.3 Design principles for screening195.4 Implementation of screening216 Filters.266.1 General .266.2 Fundamental filte
12、r characteristics 276.3 Functional tasks 296.4 Additional filtering concerns 306.5 Selection criteria .306.6 Filter installation336.7 Filter testing 367 Decoupling devices 377.1 Isolation transformers377.2 Motor-generator sets .397.3 Engine generators .407.4 Uninterruptible power supplies (UPS) 407.
13、5 Optical links 418 Surge-protective devices 418.1 General .418.2 Direct equipment protection.428.3 Installation of multiple SPDs438.4 Side-effects of uncoordinated cascades 448.5 Typical protective devices .44Bibliography45SANS 61000-5-6:2009This s tandard may only be used and printed by approved s
14、ubscription and freemailing clients of the SABS .TR 61000-5-6 IEC:2002(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION_ELECTROMAGNETIC COMPATIBILITY (EMC) Part 5-6: Installation and mitigation guidelines Mitigation of external EM influencesFOREWORD1) The IEC (International Electrotechnical Commission
15、) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in additio
16、n to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwit
17、h the IEC also participate in this preparation. The IEC collaborates closely with the InternationalOrganization for Standardization (ISO) in accordance with conditions determined by agreement between thetwo organizations.2) The formal decisions or agreements of the IEC on technical matters express,
18、as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3) The documents produced have the form of recommendations for international use and are published in the formof standards, te
19、chnical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4) In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and
20、 regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity w
21、ith one of its standards.6) Attention is drawn to the possibility that some of the elements of this technical report may be the subject ofpatent rights. The IEC shall not be held responsible for identifying any or all such patent rights.The main task of IEC technical committees is to prepare Interna
22、tional Standards. However,a technical committee may propose the publication of a technical report when it has collecteddata of a different kind from that which is normally published as an International Standard, forexample “state of the art”.Technical reports do not necessarily have to be reviewed u
23、ntil the data they provide areconsidered to be no longer valid or useful by the maintenance team.IEC 61000-5-6, which is a technical report, has been prepared by subcommittee 77C: Highpower transient phenomena, of IEC technical committee 77: Electromagnetic compatibility.It has the status of a basic
24、 EMC publication in accordance with IEC Guide 107.The text of this technical report is based on the following documents:Enquiry draft Report on voting77C/110/CDV 77C/122/RVCFull information on the voting for the approval of this technical report can be found in thereport on voting indicated in the a
25、bove table.This document, which is purely informative, is not to be regarded as an InternationalStandard.SANS 61000-5-6:2009This s tandard may only be used and printed by approved subscription and freemailing clients of the SABS . 4 TR 61000-5-6 IEC:2002(E)The committee has decided that the contents
26、 of this publication will remain unchanged until2007. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended.A bilingual version of this technical report may be issued at a later date.SANS 61000-5-6:2009This s tandard may only be used and printed by a
27、pproved subscription and freemailing clients of the SABS .TR 61000-5-6 IEC:2002(E) 5 INTRODUCTIONIEC 61000 is published in separate parts according to the following structure:Part 1: GeneralGeneral considerations (introduction, fundamental principles)Definitions, terminologyPart 2: EnvironmentDescri
28、ption of the environmentClassification of the environmentCompatibility levelsPart 3: LimitsEmission limitsImmunity limits (in so far as they do not fall under the responsibility of productcommittees)Part 4: Testing and measurement techniquesMeasurement techniquesTesting techniquesPart 5: Installatio
29、n and mitigation guidelinesInstallation guidelinesMitigation methods and devicesPart 6: Generic standardsPart 9: MiscellaneousEach part is further subdivided into several parts published either as International Standardsor as technical specifications or technical reports, some of which have already
30、been publishedas sections. Others will be published with the part number followed by a dash and a secondnumber identifying the subdivision (example: IEC 61000-6-1).This part of IEC 61000 gives guidelines for the mitigation of external electromagneticinfluences.SANS 61000-5-6:2009This s tandard may o
31、nly be used and printed by approved subscription and freemailing clients of the SABS . 6 TR 61000-5-6 IEC:2002(E)ELECTROMAGNETIC COMPATIBILITY (EMC) Part 5-6: Installation and mitigation guidelines Mitigation of external EM influences1 Scope and general considerations1.1 ScopeThis part of IEC 61000
32、covers guidelines for the mitigation of external electromagneticinfluences impinging upon a facility, aimed at ensuring electromagnetic compatibility (EMC)among electrical and electronic apparatus or systems. These influences include lightning,RF transmitters, power-line and telecom transients, high
33、-altitude electromagnetic pulse(HEMP) and other high-power electromagnetic transients. More particularly, this technicalreport is concerned with the arrangement of shielding and screening against radiateddisturbances, and with mitigation of conducted disturbances. These arrangements includeappropria
34、te electromagnetic barriers for industrial, commercial, and residential installations.The concept of barriers installed for mitigating potentially penetrating and unwantedelectromagnetic noise is applicable even when there is no designed-in electromagnetic shield.The enclosure through which power an
35、d signal (communications, control, etc.) cables mustenter or exit may be considered as a potential electromagnetic barrier that will provide somelevel of protection. The concept of enclosure can be understood as the perimeter walls of abuilding, the walls of a single room, or the housing of an appar
36、atus, with protection installedat all points of electromagnetic penetration into the enclosure.This technical report is intended for use by installers, manufacturers and users of sensitiveelectrical or electronic installations or systems, and of equipment with emission levels thatcould degrade the o
37、verall electromagnetic (EM) environment. It applies primarily to newinstallations but, where economically feasible, it may be applied to extensions ormodifications to existing facilities. While the technical principles are applicable to individualequipment or apparatus, such application is not inclu
38、ded in the scope of this technical report.1.2 General considerations1.2.1 Elementary interference controlIn its simplest form, the interference problem consists of a source of disturbance, a victim andthe medium between the two. Interference control consists of suppressing the disturbancesource, str
39、engthening the victim, or impeding the source-victim interaction through themedium. When the source is not controllable (for example, lightning, portable transmitters,HEMP, etc.), and the inherent strength of the victim is dictated by other considerations (forexample, circuit density and operating p
40、ower), interference control is relegated to theintervening medium. Furthermore, for interference control oriented toward victim protection,control measures tend to be applied fairly close to the susceptible circuits (at the system orsubsystem levels).Increasing the separation between them, enclosing
41、 one or the other in a shield or ortho-gonalizing them (for example, rejecting common-mode interference on differential-modesignalling lines) can reduce the interaction between source and victim. All three techniquescan be combined to form a closed electromagnetic barrier between the source and the
42、victim.For sources outside the system, the barrier may be applied at the system level. For sourcesinside the system, electromagnetic compatibility requires two barriers: one at the source tocontrol emissions, and one at the victim to control susceptibility. This concept is illustrated infigure 1. In
43、 this technical report, we will concentrate on sources outside the system.SANS 61000-5-6:2009This s tandard may only be used and printed by approved subscription and freemailing clients of the SABS .TR 61000-5-6 IEC:2002(E) 7 System barrierOutsidesourcesSystemsourcesSubsystem 2 Subsystem 1Source Sou
44、rceVictim VictimBarriersPenetratingconductorIEC 1497/02Figure 1 System barrier topology1.2.2 Shields and interfacesShields are used for attenuating the direct coupling of radiated electromagnetic disturbancesfrom the external environment onto the internal electronics circuits and, conversely, to lim
45、itthe radiation of disturbances from the internal circuits to the exterior, thus contributing to theelectromagnetic compatibility (EMC) of the installation. The shields considered in thisdocument are electromagnetically closed structures. Any form of electromagnetically openstructure is not recommen
46、ded for achieving a fully compliant installation. Some examples ofstructure shielding applications include telecom facilities, such as relay stations, multipurpose radio installations; TV and broadcasting studios; test rooms and laboratories (telecom, metrology, high-voltage engineering); metrology
47、facilities in educational institutions; diagnostic and therapy rooms in medical facilities; computer rooms for business and industry.Interface protection devices are used for mitigating the propagation of conductedelectromagnetic disturbances from the environment into the internal electronics and ma
48、y,conversely, limit the emission of disturbances from the internal electronics into theenvironment. This assumes that bi-directional protection devices are applied. Thus, wheninstalled in conjunction with a shield, these devices contribute to achieving electromagneticcompatibility for the installati
49、on. Protection devices that will be discussed in this technicalreport include filters, decoupling devices and surge-protective devices (SPDs).The filters considered in this document are limited to low-voltage passive circuits for high-frequency disturbances that are part of an installation. Filters and other interface devicesincorporated in individual apparatus are not included within the scope of this document. Low-frequency filters, such as those used to mitigate power-li
