UIC OR 518-2009 Testing and approval of railway vehicles from the point of view of their dynamic behaviour - Safety - Track fatigue - Running behaviour《从铁路车辆动态性能角度对铁路车辆的测试和验收 安全性 轨.pdf

上传人:ideacase155 文档编号:1067120 上传时间:2019-04-01 格式:PDF 页数:126 大小:11.98MB
下载 相关 举报
UIC OR 518-2009 Testing and approval of railway vehicles from the point of view of their dynamic behaviour - Safety - Track fatigue - Running behaviour《从铁路车辆动态性能角度对铁路车辆的测试和验收 安全性 轨.pdf_第1页
第1页 / 共126页
UIC OR 518-2009 Testing and approval of railway vehicles from the point of view of their dynamic behaviour - Safety - Track fatigue - Running behaviour《从铁路车辆动态性能角度对铁路车辆的测试和验收 安全性 轨.pdf_第2页
第2页 / 共126页
UIC OR 518-2009 Testing and approval of railway vehicles from the point of view of their dynamic behaviour - Safety - Track fatigue - Running behaviour《从铁路车辆动态性能角度对铁路车辆的测试和验收 安全性 轨.pdf_第3页
第3页 / 共126页
UIC OR 518-2009 Testing and approval of railway vehicles from the point of view of their dynamic behaviour - Safety - Track fatigue - Running behaviour《从铁路车辆动态性能角度对铁路车辆的测试和验收 安全性 轨.pdf_第4页
第4页 / 共126页
UIC OR 518-2009 Testing and approval of railway vehicles from the point of view of their dynamic behaviour - Safety - Track fatigue - Running behaviour《从铁路车辆动态性能角度对铁路车辆的测试和验收 安全性 轨.pdf_第5页
第5页 / 共126页
点击查看更多>>
资源描述
展开阅读全文
相关资源
猜你喜欢
  • BS EN 62047-1-2016 Semiconductor devices Micro-electromechanical devices Terms and definitions《半导体装置 微型电机装置 术语和定义》.pdf BS EN 62047-1-2016 Semiconductor devices Micro-electromechanical devices Terms and definitions《半导体装置 微型电机装置 术语和定义》.pdf
  • BS EN 62047-10-2011 Semiconductor devices Micro-electromechanical devices Micro-pillar compression test for MEMS materials《半导体装置 微电子机械装置 MEMS材料的微型柱压缩试验》.pdf BS EN 62047-10-2011 Semiconductor devices Micro-electromechanical devices Micro-pillar compression test for MEMS materials《半导体装置 微电子机械装置 MEMS材料的微型柱压缩试验》.pdf
  • BS EN 62047-11-2013 Semiconductor devices Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromecha.pdf BS EN 62047-11-2013 Semiconductor devices Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromecha.pdf
  • BS EN 62047-12-2011 Semiconductor devices Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures《半导体装置 微型.pdf BS EN 62047-12-2011 Semiconductor devices Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures《半导体装置 微型.pdf
  • BS EN 62047-13-2012 Semiconductor devices Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures《半导体设备 微型机电装置 MEMS结构用测量.pdf BS EN 62047-13-2012 Semiconductor devices Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures《半导体设备 微型机电装置 MEMS结构用测量.pdf
  • BS EN 62047-14-2012 Semiconductor devices Micro-electromechanical devices Forming limit measuring method of metallic film materials《半导体装置 微型电机装置 金属薄膜材料的成形极限测量方法》.pdf BS EN 62047-14-2012 Semiconductor devices Micro-electromechanical devices Forming limit measuring method of metallic film materials《半导体装置 微型电机装置 金属薄膜材料的成形极限测量方法》.pdf
  • BS EN 62047-15-2015 Semiconductor devices Micro-electromechanical devices Test method of bonding strength between PDMS and glass《半导体器件 微型机电装置 PDMS和玻璃之间的粘结强度的试验方法》.pdf BS EN 62047-15-2015 Semiconductor devices Micro-electromechanical devices Test method of bonding strength between PDMS and glass《半导体器件 微型机电装置 PDMS和玻璃之间的粘结强度的试验方法》.pdf
  • BS EN 62047-16-2015 Semiconductor devices Micro-electromechanical devices Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflectio.pdf BS EN 62047-16-2015 Semiconductor devices Micro-electromechanical devices Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflectio.pdf
  • BS EN 62047-17-2015 Semiconductor devices Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films《半导体器件 微型机电装置 用于测量薄膜力学性能的胀形试验方法》.pdf BS EN 62047-17-2015 Semiconductor devices Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films《半导体器件 微型机电装置 用于测量薄膜力学性能的胀形试验方法》.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1