1、 IEC 60749-37Edition 1.0 2008-01INTERNATIONAL STANDARD NORME INTERNATIONALESemiconductor devices Mechanical and climatic test methods Part 37: Board level drop test method using an accelerometer Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 37: Mthode dessai de chute au
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16、ication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60749-37Edition 1.0 2008-01INTERNATIONAL STANDARD NORME INTERNATIONALESemiconductor devices Mechanical and climatic test methods Part 37: Board
17、 level drop test method using an accelerometer Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 37: Mthode dessai de chute au niveau de la carte avec utilisation dun acclromtre INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE RICS 31.080
18、01 PRICE CODECODE PRIXISBN 2-8318-9569-3 2 60749-37 IEC:2008 CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope and object6 2 Normative references .6 3 Terms and definitions .6 4 Test apparatus and components.7 4.1 Test apparatus 7 4.2 Test components.8 4.3 Test board.8 4.4 Test board assembly .8 4.5 Numbe
19、r of components and sample size .9 5 Test procedure .9 5.1 Test equipment and parameters 9 5.2 Pre-test characterization .10 5.3 Drop testing.12 6 Failure criteria and failure analysis .12 7 Summary14 Annex A (informative) Preferred board construction, material, design and layout .15 Bibliography19
20、Figure 1 Typical drop test apparatus and mounting scheme for PCB assembly 10 Figure 2 Typical shock test half-sine pulse graphic and formulae .11 Figure 3 Fundamental mode of vibration of PCB supported with four screws14 Figure A.1 Recommended test board size and layout.18 Table 1 Quantity of test b
21、oards and components required for testing .9 Table 2 Component locations for test boards .13 Table A.1 Test board stack-up and material .15 Table A.2 Mechanical property requirements for dielectric materials 16 Table A.3 Recommended test board pad sizes and solder mask openings .17 Table A.4 X, Y lo
22、cations for components centre 18 60749-37 IEC:2008 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 37: Board level drop test method using an accelerometer FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide orga
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33、rd IEC 60749-37 has been prepared by IEC technical committee 47: Semiconductor devices. This standard cancels and replaces IEC/PAS 62050 published in 2004. This first edition constitutes a technical revision. The text of this standard is based on the following documents: FDIS Report on voting 47/193
34、7/FDIS 47/1948/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. 4 60749-37 IEC:2008 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60749 series,
35、 under the general title Semiconductor devices Mechanical and climatic test methods, can be found in the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in
36、 the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 60749-37 IEC:2008 5 INTRODUCTION Handheld electronic products fit into the consumer and portable market segments. Included in handheld electronic pr
37、oducts are cameras, calculators, cell phones, cordless phones, pagers, palm size PCs, personal computer memory card international association (PCMCIA) cards, smart cards, personal digital assistants (PDAs) and other electronic products that can be conveniently stored in a pocket and used while held
38、in users hand. These handheld electronic products are more prone to being dropped during their useful service life because of their size and weight. This dropping event can not only cause mechanical failures in the housing of the device but also create electrical failures in the printed circuit boar
39、d (PCB) assemblies mounted inside the housing due to transfer of energy through PCB supports. The electrical failures may result from various failure modes such as cracking of the circuit board, track cracking on the board, cracking of solder interconnections between the components and the board, an
40、d component cracks. The primary driver of these failures is excessive flexing of the circuit board due to input acceleration to the board created from dropping the handheld electronic product. This flexing of the board causes relative motion between the board and the components mounted on it, result
41、ing in component, interconnect or board failures. The failure is a function of the combination of the board design, construction, material, thickness and surface finish; interconnect material and standoff height and component size. Correlation between test and field conditions is not yet fully estab
42、lished. Consequently, the test procedure is presently more appropriate for relative component performance than for use as a pass/fail criterion. Rather, results should be used to augment existing data or establish a baseline for potential investigative efforts in package/board technologies. The comp
43、arability between different test sites, data acquisition methods, and board manufacturers has not been fully demonstrated by existing data. As a result, if the data are to be used for direct comparison of component performance, matching studies must first be performed to prove that the data are in f
44、act comparable across different test sites and test conditions. This method is not intended to substitute for full characterization testing, which might incorporate substantially larger sample sizes and increased number of drops. Due to limited sample size and number of drops specified here, it is p
45、ossible that enough failure data may not be generated in every case to perform full statistical analysis. 6 60749-37 IEC:2008 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 37: Board level drop test method using an accelerometer 1 Scope and object This part of IEC 60749 provides a t
46、est method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board
47、 and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. The purpose of this standard is to prescribe a standardized test method and reporting procedure. T
48、his is not a component qualification test and is not meant to replace any system level drop test that may be needed to qualify a specific handheld electronic product. The standard is not meant to cover the drop test required to simulate shipping and handling-related shock of electronic components or
49、 PCB assemblies. These requirements are already addressed in test methods such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded surface mounted packages. This test method uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The test method
