1、 IEC 61189-5-4 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies Solder alloys and fluxed and non-fluxed solid wire for
2、printed board assemblies Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-4: Mthodes dessai gnrales pour les matriaux et les assemblages Alliages braser et brasages solides fluxs et non fluxs pour les assemblages de cartes im
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20、vice Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61189-5-4 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other
21、interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Par
22、tie 5-4: Mthodes dessai gnrales pour les matriaux et les assemblages Alliages braser et brasages solides fluxs et non fluxs pour les assemblages de cartes imprimes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.180 ISBN 978-2-8322-1999-7 Registered tradem
23、ark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2
24、IEC 61189-5-4:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Accuracy, precision and resolution 7 3.1 General . 7 3.2 Accuracy . 8 3.3 Precision . 8 3.4 Resolution 9 3.5 Report. 9 3.6 Students t distribution 9 3.7 Suggested uncertainty limits . 10 4 C: Chem
25、ical test methods 11 4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated and/or flux-cored solder 11 Object 11 4.1.1Test specimen . 11 4.1.2Apparatus 11 4.1.3Test procedure 11 4.1.4 4.2 Test 5-4CXX . 12 5 X: Miscellaneous test methods 12 5.1 Test 5-4X01: Spread test, extracted
26、 cored wires or preforms 12 Object 12 5.1.1Method A . 12 5.1.2Method B . 13 5.1.3Additional information 15 5.1.4 5.2 Test 5-4X02: Spitting test of flux-cored wire solder . 15 Object 15 5.2.1Method A . 15 5.2.2Method B . 16 5.2.3Additional information 19 5.2.4 5.3 Test 5-4X03: Solder pool test 20 Obj
27、ect 20 5.3.1Test specimen . 20 5.3.2Apparatus and reagents . 20 5.3.3Test procedure 20 5.3.4Evaluation . 21 5.3.5Additional information 21 5.3.6 Bibliography 22 Figure 1 Test apparatus for spitting test . 16 Figure 2 Test apparatus for spitting test, method B 18 Figure 3 Collecting paper with printe
28、d concentric circles with 1 cm pitch 19 IEC 61189-5-4:2015 IEC 2015 3 Table 1 Students t distribution . 10 Table 2 Typical spread areas defined in mm 213 Table 3 Example of a test report Spitting of flux-cored wire . 19 4 IEC 61189-5-4:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST M
29、ETHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 5-4: General test methods for materials and assemblies Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (I
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39、y other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may b
40、e the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-5-4 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS
41、Report on voting 91/1212/FDIS 91/1225/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. IEC 61189-5-4:2015 IEC 2015 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. This Intern
42、ational Standard is used in conjunction with IEC 61189-1:1997, IEC 61189-2:2006, IEC 61189-3:2007. A list of all parts in the IEC 61189 series, published under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on
43、 the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, r
44、eplaced by a revised edition, or amended. 6 IEC 61189-5-4:2015 IEC 2015 INTRODUCTION IEC 61189 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture. The standard is divided into separate parts, covering information fo
45、r the designer and the test methodology engineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (for example, TC 104) have been repro
46、duced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of
47、IEC 61189 contains test methods for evaluating robustness of materials or component for printed board assemblies. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this s
48、tandard are grouped according to the following principles: P: preparation/conditioning methods V: visual test methods D: dimensional test methods C: chemical test methods M: mechanical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate r
49、eference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to a possible test sequence; that responsibility rests with the relevant specificat
