1、 IEC 61249-4-18 Edition 1.0 2013-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Materials for printed boards and other interconnecting structures Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) High performance epoxide woven E-glass pre
2、preg of defined flammability (vertical burning test) for lead-free assembly Matriaux pour circuits imprims et autres structures dinterconnexion Partie 4-18: Srie de spcifications intermdiaires pour matriaux primprgns, non plaqus (pour la fabrication des cartes multicouches) Tissu de verre poxyde pri
3、mprgn de type E haute performance, dinflammabilit dfinie (essai de combustion verticale), pour les assemblages sans plomb IEC61249-4-18:2013 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication ma
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17、aires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61249-4-18 Edition 1.0 2013-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Materials for printed boards and other interconnecting structures Part 4-18: Sectional specification set for prepreg materials, unclad (
18、for the manufacture of multilayer boards) High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly Matriaux pour circuits imprims et autres structures dinterconnexion Partie 4-18: Srie de spcifications intermdiaires pour matriaux primprgns
19、, non plaqus (pour la fabrication des cartes multicouches) Tissu de verre poxyde primprgn de type E haute performance, dinflammabilit dfinie (essai de combustion verticale), pour les assemblages sans plomb INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE N ICS 31.
20、180 PRICE CODE CODE PRIX ISBN 978-2-8322-1168-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer q
21、ue vous avez obtenu cette publication via un distributeur agr. 2 61249-4-18 IEC:2013 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Materials and construction . 6 3.1 General 6 3.2 Reinforcement . 7 3.3 Resin system . 7 4 Properties 7 4.1 Properties related to the appearance of the prepr
22、eg. 7 4.1.1 General 7 4.1.2 Dewetted areas (fish eyes) . 7 4.1.3 Broken filaments . 7 4.1.4 Distortion 7 4.1.5 Creases 7 4.1.6 Edge conditions 8 4.2 Properties related to B-stage prepreg 8 4.2.1 General 8 4.2.2 Resin content . 8 4.2.3 Treated weight 8 4.2.4 Resin flow . 8 4.2.5 Scaled flow thickness
23、 . 9 4.2.6 Melting viscosity . 9 4.2.7 Gel time 9 4.2.8 Volatile content . 9 4.3 Properties related to prepreg after curing . 9 4.3.1 Electric strength 9 4.3.2 Flammability . 9 4.3.3 Relative permittivity and dissipation factor 10 4.3.4 Cured thickness 10 4.3.5 Glass transition temperature (Tg) 10 4
24、.3.6 Decomposition temperature (Td) . 10 4.3.7 Time to delamination 10 4.3.8 Z-axis expansion . 11 5 Delivery form . 11 5.1 General 11 5.2 Rolls 11 5.3 Sheets . 11 5.4 Cut panels . 11 6 Quality assurance 11 6.1 Quality system . 11 6.2 Responsibility for inspection. 12 6.3 Qualification inspection 12
25、 6.4 Quality conformance inspection . 12 6.5 Certificate of conformance . 12 6.6 Safety data sheet . 12 61249-4-18 IEC:2013 3 7 Packaging and marking . 12 8 Shelf life 13 9 Ordering information 13 Bibliography 14 Table 1 Flammability, vertical burning test . 10 Table 2 Decomposition temperature requ
26、irements . 10 Table 3 Time to delamination requirements 11 Table 4 Z-axis expansion requirements 11 4 61249-4-18 IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 4-18: Sectional specification set for prepreg materials, unclad
27、 (for the manufacture of multilayer boards) High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national el
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37、ed in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifyi
38、ng any or all such patent rights. International Standard IEC 61249-4-18 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1125/FDIS 91/1147/RVD Full information on the voting for t
39、he approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 61249-4-18 IEC:2013 5 A list of all parts of the IEC 61249 series, under the general title Materials for printed boards
40、 and other interconnecting structures, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this
41、date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 61249-4-18 IEC:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Hig
42、h performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly 1 Scope This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39
43、 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burni
44、ng test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the suppliers instructions, the glass transition temperature is defined to be 170 C mi
45、nimum. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including an
46、y amendments) applies. IEC 61189-2:2006, Test methods for electrical materials, interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures IEC 61249-2-39:2012, Materials for printed boards and other interconnecting structures Part 2-39: Reinforced bas
47、e materials clad and unclad High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly IEC/PAS 61249-6-3:2011, Specification for finished fabric woven from “E“ glass for printed boards ISO 9000:2005, Qua
48、lity management systems Fundamentals and vocabulary ISO 11014:2009, Safety data sheet for chemical products Content and order of sections ISO 14001:2004, Environmental management systems Requirements with guidance for use 3 Materials and construction 3.1 General The prepreg consists of a reinforcing
49、 E-glass fabric which is impregnated with high performance epoxide resin, partially cured to the B-stage. The flammability rating is achieved 61249-4-18 IEC:2013 7 through the use of brominated flame retardants reacted into the polymer. Inorganic fillers may be used. Contrast agents may be added to enhance processing such as automated optical inspection (AOI). Its flame resistance
