1、 IEC 61709 Edition 3.0 2017-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Electric components Reliability Reference conditions for failure rates and stress models for conversion Composants lectriques Fiabilit Conditions de rfrence pour les taux de dfaillance et modles de contraintes pour la convers
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19、h/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61709 Edition 3.0 2017-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Electric components Reliability Reference conditions for failure rates and stress models for conv
20、ersion Composants lectriques Fiabilit Conditions de rfrence pour les taux de dfaillance et modles de contraintes pour la conversion INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.020 ISBN 978-2-8322-3902-5 Registered trademark of the International Electro
21、technical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 61709:2017 IEC
22、 2017 CONTENTS FOREWORD . 9 INTRODUCTION . 11 1 Scope 12 2 Normative references 12 3 Terms, definitions and symbols . 12 3.1 Terms and definitions 12 3.2 Symbols 16 4 Context and conditions 17 4.1 Failure modes and mechanisms 17 4.2 Thermal modelling 18 4.3 Mission profile consideration . 18 4.3.1 G
23、eneral . 18 4.3.2 Operating and non-operating conditions 18 4.3.3 Dormancy 19 4.3.4 Storage . 19 4.4 Environmental conditions 19 4.5 Components choice 21 4.6 Reliability growth during the deployment phase of new equipment 22 4.7 How to use this document . 23 5 Generic reference conditions and stress
24、 models 24 5.1 Recommended generic reference conditions . 24 5.2 Generic stress models 25 5.2.1 General . 25 5.2.2 Stress factor for voltage dependence, U 26 5.2.3 Stress factor for current dependence, I 26 5.2.4 Stress factor for temperature dependence, T 26 5.2.5 Environmental application factor,
25、E . 28 5.2.6 Dependence on switching rate, S 28 5.2.7 Dependence on electrical stress, ES 29 5.2.8 Other factors of influence 29 6 Integrated semiconductor circuits 29 6.1 Specific reference conditions 29 6.2 Specific stress models 31 6.2.1 General . 31 6.2.2 Voltage dependence, factor U . 32 6.2.3
26、Temperature dependence, factor T . 32 7 Discrete semiconductors . 35 7.1 Specific reference conditions 35 7.2 Specific stress models 36 7.2.1 General . 36 7.2.2 Voltage dependence for transistors, factor U . 37 7.2.3 Temperature dependence, factor T . 37 8 Optoelectronic components . 39 IEC 61709:20
27、17 IEC 2017 3 8.1 Specific reference conditions 39 8.2 Specific stress models 41 8.2.1 General . 41 8.2.2 Voltage dependence, factor U . 41 8.2.3 Current dependence, factor I . 41 8.2.4 Temperature dependence, factor T . 42 9 Capacitors . 44 9.1 Specific reference conditions 44 9.2 Specific stress m
28、odel 44 9.2.1 General . 44 9.2.2 Voltage dependence, factor U . 44 9.2.3 Temperature dependence, factor T . 46 10 Resistors and resistor networks . 47 10.1 Specific reference conditions 47 10.2 Specific stress models 48 10.2.1 General . 48 10.2.2 Temperature dependence, factor T . 48 11 Inductors, t
29、ransformers and coils . 49 11.1 Reference conditions 49 11.2 Specific stress model 49 11.2.1 General . 49 11.2.2 Temperature dependence, factor T 49 12 Microwave devices 50 12.1 Specific reference conditions 50 12.2 Specific stress models 51 13 Other passive components 51 13.1 Specific reference con
30、ditions 51 13.2 Specific stress models 51 14 Electrical connections 51 14.1 Specific reference conditions 51 14.2 Specific stress models 52 15 Connectors and sockets 52 15.1 Reference conditions 52 15.2 Specific stress models 52 16 Relays . 52 16.1 Reference conditions 52 16.2 Specific stress models
31、 53 16.2.1 General . 53 16.2.2 Dependence on switching rate, factor S 53 16.2.3 Dependence on electrical stress, factor ES 54 16.2.4 Temperature dependence, factor T . 55 17 Switches and push-buttons 55 17.1 Specific reference conditions 55 17.2 Specific stress model 56 17.2.1 General . 56 4 IEC 617
32、09:2017 IEC 2017 17.2.2 Dependence on electrical stress, factor ES . 56 18 Signal and pilot lamps . 57 18.1 Specific reference conditions 57 18.2 Specific stress model 57 18.2.1 General . 57 18.2.2 Voltage dependence, factor U . 58 19 Printed circuit boards (PCB) 58 20 Hybrid circuits . 58 Annex A (
33、normative) Failure modes of components . 59 Annex B (informative) Thermal model for semiconductors 62 B.1 Thermal model 62 B.2 Junction temperature calculation . 63 B.3 Thermal resistance evaluation 64 B.4 Power dissipation of an integrated circuit P . 65 Annex C (informative) Failure rate predictio
34、n . 68 C.1 General . 68 C.2 Failure rate prediction for assemblies . 68 C.2.1 General . 68 C.2.2 Assumptions and limitations 69 C.2.3 Process for failure rate prediction 69 C.2.4 Prediction models 70 C.2.5 Other methods of reliability prediction 71 C.2.6 Validity considerations of reliability models
35、 and predictions . 72 C.3 Component considerations 73 C.3.1 Component model . 73 C.3.2 Components classification . 73 C.4 General consideration about failure rate . 73 C.4.1 General . 73 C.4.2 General behaviour of the failure rate of components 74 C.4.3 Expected values of failure rate. 75 C.4.4 Sour
36、ces of variation in failure rates . 75 Annex D (informative) Considerations on mission profile 77 D.1 General . 77 D.2 Dormancy . 77 D.3 Mission profile 78 D.4 Example of mission profile 79 Annex E (informative) Useful life models 80 E.1 General . 80 E.2 Power transistors 80 E.3 Optocouplers 80 E.3.
37、1 Useful life L . 80 E.3.2 Factor L 0. 81 E.3.3 Factor 0. 81 E.3.4 Factor 1. 82 E.3.5 Factor 2. 82 E.3.6 Factor 3. 82 E.4 LED and LED modules 83 IEC 61709:2017 IEC 2017 5 E.4.1 Useful life L . 83 E.4.2 Factor L 0. 83 E.4.3 Factor 0. 84 E.4.4 Factor 1. 84 E.4.5 Factor 2. 85 E.4.6 Factor 3. 85 E.5 Alu
38、minium, non-solid electrolyte capacitors . 85 E.6 Relays 86 E.7 Switches and keyboards . 86 E.8 Connectors . 86 Annex F (informative) Physics of failure . 87 F.1 General . 87 F.2 Failure mechanisms of integrated circuits . 88 Annex G (informative) Considerations for the design of a data base on fail
39、ure rates 89 G.1 General . 89 G.2 Data collection acquisition collection process . 89 G.3 Which data to collect and how to collect it . 89 G.4 Calculation and decision making . 90 G.5 Data descriptions 90 G.6 Identification of components . 90 G.6.1 General . 90 G.6.2 Component identification . 91 G.
40、6.3 Component technology 91 G.7 Specification of components . 91 G.7.1 General . 91 G.7.2 Electrical specification of components . 91 G.7.3 Environmental specification of components . 92 G.8 Field related issues data . 92 G.8.1 General . 92 G.8.2 Actual field conditions 92 G.8.3 Data on field failur
41、es 92 G.9 Test related issues data 93 G.9.1 General . 93 G.9.2 Actual test conditions 93 G.9.3 Data on test failures 93 G.10 Failure rate database attributes 94 Annex H (informative) Potential sources of failure rate data and methods of selection . 96 H.1 General . 96 H.2 Data source selection . 96
42、H.3 User data 97 H.4 Manufacturers data 97 H.5 Handbook reliability data . 98 H.5.1 General . 98 H.5.2 Using handbook data with this document . 98 H.5.3 List of available handbooks . 99 Annex I (informative) Overview of component classification . 102 I.1 General . 102 I.2 The IEC 61360 system 102 6
43、IEC 61709:2017 IEC 2017 I.3 Other systems. 110 I.3.1 General . 110 I.3.2 NATO stock numbers . 110 I.3.3 UNSPSC codes . 110 I.3.4 STEP/EXPRESS 110 I.3.5 IECQ . 110 I.3.6 ECALS 111 I.3.7 ISO 13584 . 111 I.3.8 MIL specifications 111 Annex J (informative) Presentation of component reliability data 112 J
44、1 General . 112 J.2 Identification of components . 112 J.2.1 General . 112 J.2.2 Component identification . 113 J.2.3 Component technology 113 J.3 Specification of components . 113 J.3.1 General . 113 J.3.2 Electrical specification of components . 113 J.3.3 Environmental specification of components
45、 . 113 J.4 Test related issues data 113 J.4.1 General . 113 J.4.2 Actual test conditions 114 J.5 Data on test failures 114 Annex K (informative) Examples 116 K.1 Integrated circuit . 116 K.2 Transistor . 116 K.3 Capacitor 116 K.4 Relay 117 Bibliography 118 Figure 1 Comparison of the temperature depe
46、ndence of T for CMOS IC 24 Figure 2 Selection of stress regions in accordance with current and voltage-operating conditions . 54 Figure 3 Selection of stress regions in accordance with current and voltage-operating conditions . 56 Figure B.1 Temperatures inside equipment 63 Figure B.2 Thermal resist
47、ance model . 64 Figure D.1 Mission profile 79 Table 1 Basic environments . 20 Table 2 Values of environmental parameters for basic environments . 21 Table 3 Recommended reference conditions for environmental and mechanical stresses 25 Table 4 Environmental application factor, E . 28 Table 5 Memory .
48、 30 Table 6 Microprocessors and peripherals, microcontrollers and signal processors . 30 Table 7 Digital logic families and bus interfaces, bus driver and receiver circuits . 30 IEC 61709:2017 IEC 2017 7 Table 8 Analog ICs 31 Table 9 Application-specific ICs (ASICs) 31 Table 10 Constants for voltage
49、 dependence 32 Table 11 Factor U for digital CMOS-family ICs . 32 Table 12 Factor U for bipolar analog ICs . 32 Table 13 Constants for temperature dependence . 32 Table 14 Factor T for ICs (without EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM) . 34 Table 15 Factor T for EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM. 34 Table 16 Tran
