1、 IEC 62047-21 Edition 1.0 2014-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 21: Test method for Poissons ratio of thin film MEMS materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 21: Mthode dessai relative au co
2、efficient de Poisson des matriaux MEMS en couche mince IEC 62047-21:2014-06(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or b
3、y any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this pub
4、lication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectroniqu
5、e ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou con
6、tactez le Comit national de lIEC de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that p
7、repares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have
8、 been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC public
9、ations search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to
10、 date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in E
11、nglish and French, with equivalent terms in 14 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary More than 55 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions claus
12、e of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Servi
13、ce Centre: csciec.ch. A propos de lIEC La Commission Electrotechnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications IEC Le contenu t
14、echnique des publications IEC est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographiques sur les Normes in
15、ternationales, Spcifications techniques, Rapports techniques et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents critres (numro de rf
16、rence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne
17、 et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 14 langues additionnelles. Egalement appel
18、Vocabulaire Electrotechnique International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary Plus de 55 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extra
19、ites des publications des CE 37, 77, 86 et CISPR de lIEC. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62047-21 Edition 1.0 2014-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semi
20、conductor devices Micro-electromechanical devices Part 21: Test method for Poissons ratio of thin film MEMS materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 21: Mthode dessai relative au coefficient de Poisson des matriaux MEMS en couche mince INTERNATIONAL ELECTROTECHNI
21、CAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE M ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-8322-1650-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publicat
22、ion from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62047-21:2014 IEC 2014 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms, definitions, symbols and designations 5 3.1 Terms and defi
23、nitions 5 3.2 Symbols and designations 5 4 Test piece . 6 4.1 General . 6 4.2 Shape of the test piece . 7 4.3 Measurement of dimensions . 7 5 Testing method and test apparatus 7 5.1 Test principle 7 5.2 Test machine 7 5.3 Test procedure 7 5.3.1 Test procedure for type 1 test piece . 7 5.3.2 Test pro
24、cedure for type 2 test piece . 8 5.4 Test environment 8 6 Test report . 8 Annex A (informative) Measurement example of Poissons ratio using type 1 test piece . 9 A.1 Fabrication of the test piece 9 A.2 Dimensions of the test piece . 9 A.3 Test procedures 9 A.4 Test results . 10 Annex B (informative)
25、 Analysis of test results obtained from a type 2 test piece . 11 B.1 General . 11 B.2 Evaluation of stress and strain in circular and rectangular membranes . 11 B.3 Evaluation of Poissons ratio . 12 Bibliography 13 Figure 1 Two types of test pieces for the measurement of Poissons ratio 6 Figure A.1
26、Optical images of markers for strain measurement by DIC 9 Figure A.2 Graphs of load and strain in the longitudinal and transverse directions . 10 Table 1 Symbols and designations of a test piece 6 IEC 62047-21:2014 IEC 2014 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-EL
27、ECTROMECHANICAL DEVICES Part 21: Test method for Poissons ratio of thin film MEMS materials FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC
28、 is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS)
29、and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with
30、the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as near
31、ly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that
32、 sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees
33、 undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide an
34、y attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest ed
35、ition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether d
36、irect or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispe
37、nsable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-21
38、 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/185/FDIS 47F/189/RVD Full information on the voting for the approval of this standa
39、rd can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 IEC 62047-21:2014 IEC 2014 A list of all parts in the IEC 62047 series, published under the general title Semiconductor devices Micro-electrome
40、chanical devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication
41、 will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this doc
42、ument using a colour printer. IEC 62047-21:2014 IEC 2014 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 21: Test method for Poissons ratio of thin film MEMS materials 1 Scope This part of IEC 62047 specifies the determination of Poissons ratio from the test results obtained by the appl
43、ication of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 m. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispe
44、nsable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-8:2011, Semiconductor devices Micro-electromechanical devices Part 8: Strip bending test method for te
45、nsile property measurement of thin films ASTM E 132-04:2010, Standard test method for Poissons ratio at room temperature 3 Terms, definitions, symbols and designations 3.1 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1.1 Poissons ratio ratio o
46、f transverse strain multiplied by (-1) to the corresponding longitudinal strain resulting from uniformly distributed longitudinal stress below the proportional limit of the material, expressed as - t / l , where tis transverse strain, and lis longitudinal strain 3.2 Symbols and designations Symbols
47、and designations of two types of test pieces are presented in Figure 1 and Table 1, respectively. 6 IEC 62047-21:2014 IEC 2014 a) Type 1 test piece for uniaxial tensile machine b) Type 2 test piece for membrane bulging machine Figure 1 Two types of test pieces for the measurement of Poissons ratio T
48、able 1 Symbols and designations of a test piece Symbol Unit Designation l 1m Gauge length for longitudinal strain measurement l 2m Gauge length for transverse strain measurement b m Width of test piece L m Overall length R m Filet radius of test piece m 1m Length of a rectangular membrane m 2m Width
49、 of a rectangular membrane m 3m Diameter of a circular membrane h m Thickness of membrane 4 Test piece 4.1 General The test piece should be prepared using a fabrication process similar to the actual fabrication of devices. It should have dimensions on the same order as those of the mother device to minimise the effect of size-dependent properties. An example of the fab