1、 IEC 62047-8 Edition 1.0 2011-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 8: Mthode dessai de
2、la flexion de bandes en vue de la mesure des proprits de traction des couches minces IEC 62047-8:2011 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utiliz
3、ed in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional
4、 rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucu
5、n procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les
6、coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepa
7、res and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have bee
8、n published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.ch/online_
9、news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 te
10、rms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, ple
11、ase visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internationales pour tout ce qui a trait
12、llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue des publications de l
13、a CEI: www.iec.ch/searchpub/cur_fut-f.htm Le Catalogue en-ligne de la CEI vous permet deffectuer des recherches en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remplaces. Just Published CEI: www.i
14、ec.ch/online_news/justpub Restez inform sur les nouvelles publications de la CEI. Just Published dtaille deux fois par mois les nouvelles publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques e
15、t lectriques. Il contient plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsi
16、rez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62047-8 Edition 1.0 2011-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mi
17、cro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 8: Mthode dessai de la flexion de bandes en vue de la mesure des proprits de traction des couches minces INTERNATIONAL EL
18、ECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-88912-395-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colour inside 2 62047-8 IEC:2011 CONTEN
19、TS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Test apparatus . 5 4.1 General . 5 4.2 Actuator 6 4.3 Load tip . 6 4.4 Alignment mechanism . 6 4.5 Force and displacement sensors . 6 4.6 Test environment. 6 5 Test piece 6 5.1 General . 6 5.2 Shape of test piece .
20、7 5.3 Measurement of test piece dimension 7 6 Test procedure and analysis . 8 6.1 General . 8 6.2 Data analysis 8 7 Test report 9 Annex A (informative) Data analysis: Test results by using nanoindentation apparatus 10 Annex B (informative) Test piece fabrication: MEMS process . 13 Annex C (informati
21、ve) Effect of misalignment and geometry on property measurement 15 Bibliography 18 Figure 1 Thin film test piece . 7 Figure 2 Schematic of strip bending test 9 Figure A.1 Three successive indents for determining the reference location of a test piece 10 Figure A.2 A schematic view of nanoindentation
22、 apparatus 11 Figure A.3 Actuator force vs. deflection curves for strip bending test and for leaf spring test . 11 Figure A.4 Force vs. deflection curve of a test piece after compensating the stiffness of the leaf spring . 12 Figure B.1 Fabrication procedure for test piece 13 Figure C.1 Finite eleme
23、nt analysis of errors based on the constitutive data of Au thin film of 1 mm thick 16 Figure C.2 Translational (d) and angular (a, b, g) misalignments 17 Table 1 Symbols and designations of a test piece 7 62047-8 IEC:2011 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELEC
24、TROMECHANICAL DEVICES Part 8: Strip bending test method for tensile property measurement of thin films FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The ob
25、ject of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specificat
26、ions (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations lia
27、ising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters expre
28、ss, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committ
29、ees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National
30、 Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not
31、 provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have th
32、e latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever
33、, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications
34、 is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard I
35、EC 62047-8 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices The text of this standard is based on the following documents: FDIS Report on voting 47F/71/FDIS 47F/77/RVD Full information on the voting for the approval of this
36、 standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 62047, under the general title Semiconductor devices Micro- electromechanical devices can be found on the IEC w
37、ebsite. 4 62047-8 IEC:2011 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, wi
38、thdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour pri
39、nter. 62047-8 IEC:2011 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 8: Strip bending test method for tensile property measurement of thin films 1 Scope This international standard specifies the strip bending test method to measure tensile properties of thin films with high accuracy,
40、repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mm, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) betw
41、een two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS produc
42、tion since its testing throughput is very high compared to the conventional tensile test. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition
43、 of the referenced document (including any amendments) applies. NONE 3 Terms and definitions For the purposes of this document the following terms and definitions apply. 3.1 deflection w displacement of a test piece at the middle of the length, which is measured with respect to the straight line con
44、necting two fixed ends of the test piece 3.2 deflection angle b angle between the deformed test piece and the straight line connecting two fixed ends of the test piece NOTE Test piece in this document is often referred to as a strip bending specimen. 4 Test apparatus 4.1 General A test apparatus is
45、composed of an actuator, a load-sensor, a displacement sensor, and alignment mechanism as other mechanical testers such as micro-tensile tester and 6 62047-8 IEC:2011 nanoindentation apparatus. A test piece in a form of strip is very compliant and experiences large deflection under a small load when
46、 comparing it with a micro-tensile test piece with similar dimensions. In this respect, the load-sensor should have an excellent resolution and the displacement sensor should have a long measuring range. Details on each component of test apparatus are described as follows. 4.2 Actuator All actuating
47、 devices that are capable of linear movement can be used for the test, e.g. piezoelectric actuator, voice coil actuator, servo motor, etc. However, a device with fine displacement resolution is highly recommended due to small dimensions of the test piece. The resolution shall be better than 1/1 000
48、of maximum deflection of test piece. 4.3 Load tip The load tip which applies a line contact force to the test piece is shaped like a conventional wedge type indenter tip and can be made of diamond, sapphire or other hard materials. The radius of the tip shall be comparable to or larger than the thic
49、kness of the test piece, and less than L/50 (refer to Annex C.3). 4.4 Alignment mechanism The load tip shall be installed on the test apparatus aligned with the load and the displacement measuring axes, and the misalignment shall be less than 1 degree. The load tip shall be also aligned to the surface of the test piece with the deviation angles less than 1 degree (refer to Annex C for defin
