1、 IEC 62435-2 Edition 1.0 2017-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronic components Long-term storage of electronic semiconductor devices Part 2: Deterioration mechanisms Composants lectroniques Stockage de longue dure des dispositifs lectroniques semiconducteurs Partie 2: Mcanismes d
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17、e premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 16 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Glossaire IEC - std.iec.c
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19、csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62435-2 Edition 1.0 2017-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronic components Long-term storage of electronic semiconductor devices Part 2: Deterioration
20、 mechanisms Composants lectroniques Stockage de longue dure des dispositifs lectroniques semiconducteurs Partie 2: Mcanismes de dtrioration INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.020 ISBN 978-2-8322-3836-3 Registered trademark of the International
21、 Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 62435-2:2017 IEC 201
22、7 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 7 2 Normative references 7 3 Terms, definitions and abbreviated terms 7 3.1 Terms and definitions 7 3.2 Abbreviated terms . 8 4 Principles of deterioration 8 4.1 General . 8 4.2 Solderability and oxidisation of lead finishes . 8 4.3 Popcorning . 8 4.4
23、 Delamination . 8 4.5 Corrosion and tarnishing . 8 4.6 Electrical effects . 9 4.7 High-energy ionizing radiation damage . 9 4.8 Storage temperature risks to semiconductor devices . 9 4.9 Noble metal finishes . 9 4.10 Matte tin and other finishes . 9 4.11 Solder ball and solder bump 9 4.12 Devices co
24、ntaining programmable memory flash, programmable logic and other devices containing non-volatile memory cells . 10 5 Technical validation of the components . 10 5.1 Purpose 10 5.2 Test selection criteria 10 5.3 Measurements and tests . 11 5.3.1 Assessment of the supplied batch reliability . 11 5.3.2
25、 List of test methods . 11 5.4 Periodic assessment . 12 Annex A (normative) Failure mechanisms Encapsulated and non-encapsulated active components 14 Bibliography 17 Table 1 List of tests . 11 Table A.1 Failure mechanisms: encapsulated and non-encapsulated active components 14 IEC 62435-2:2017 IEC 2
26、017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONIC COMPONENTS LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES Part 2: Deterioration mechanisms FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national elect
27、rotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specific
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37、 any or all such patent rights. International Standard IEC 62435-2 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47/2327/FDIS 47/2350/RVD Full information on the voting for the approval of
38、this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 IEC 62435-2:2017 IEC 2017 A list of all parts in the IEC 62435 series, published under the general title Electronic compo
39、nents Long-term storage of electronic semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific doc
40、ument. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IEC 62435-2:2017 IEC 2017 5 INTRODUCTION This document applies to the long-term storage of electronic components. This is a document for long-term storage (LTS) of electronic devices drawing
41、on the best long- term storage practices currently known. For the purposes of this document, LTS is defined as any device storage whose duration can be more than 12 months for product scheduled for long duration storage. While intended to address the storage of unpackaged semiconductors and packaged
42、 electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. Although it has always existed to some extent, obsolescence of electronic components and particularly of integrated circuits, has become increasingly intense over the last few
43、years. Indeed, with the existing technological boom, the commercial life of a component has become very short compared with the life of industrial equipment such as that encountered in the aeronautical field, the railway industry or the energy sector. The many solutions enabling obsolescence to be r
44、esolved are now identified. However, selecting one of these solutions should be preceded by a case-by-case technical and economic feasibility study, depending on whether storage is envisaged for field service or production, for example: remedial storage as soon as components are no longer marketed;
45、preventive storage anticipating declaration of obsolescence. Taking into account the expected life of some installations, sometimes covering several decades, the qualification times, and the unavailability costs, which can also be very high, the solution to be adopted to resolve obsolescence should
46、often be rapidly implemented. This is why the solution retained in most cases consists in systematically storing components which are in the process of becoming obsolescent. The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery of the implemented proces
47、s and especially of the storage environment, although this mastery becomes critical when it comes to long-term storage. All handling, protection, storage and test operations are recommended to be performed according to the state of the art. The application of the approach proposed in this standard i
48、n no way guarantees that the stored components are in perfect operating condition at the end of this storage. It only comprises a means of minimizing potential and probable degradation factors. Some electronic device users have the need to store electronic devices for long periods of time. Lifetime
49、buys are commonly made to support production runs of assemblies that well exceed the production timeframe of its individual parts. This puts the user in a situation requiring careful and adequate storage of such parts to maintain the as-received solderability and minimize any degradation effects to the part over time. Major degradation concerns are moisture, electrostatic fields, ultra-violet light, large variati
