1、 IEC 62878-1-1 Edition 1.0 2015-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Device embedded substrate Part 1-1: Generic specification Test methods Substrat avec appareil(s) intgr(s) Partie 1-1: Spcification gnrique Mthodes dessai IEC 62878-1-1:2015-05(en-fr) colour inside THIS PUBLICATION IS COPY
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19、r des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62878-1-1 Edition 1.0 2015-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Device embedded substrate Part 1-1: Generic specification Test methods Substrat avec appareil(s) intgr(s) Partie 1-1: Spcifi
20、cation gnrique Mthodes dessai INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.180; 31.190 ISBN 978-2-8322-2674-2 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Ma
21、ke sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62878-1-1:2015 IEC 2015 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references 7 3 Terms, definitions and ab
22、breviations . 7 3.1 Terms and definitions 7 3.2 Abbreviations 7 4 Test methods . 8 4.1 General . 8 4.2 Visual inspection and micro-sectioning 8 4.2.1 General . 8 4.2.2 Visual inspection . 8 4.2.3 Micro-sectioning 8 4.2.4 Lack of conductor and residue of conductor . 10 4.2.5 Land dimension and land w
23、idth (annular ring) 10 4.3 Electrical tests 13 4.3.1 Conductor resistance . 13 4.3.2 Through hole and build-up via . 14 4.3.3 Withstanding current of embedded device connection 15 4.3.4 Withstanding voltage in embedded boards . 17 4.3.5 Insulation resistance 19 4.3.6 Conduction and insulation of cir
24、cuit . 20 4.4 Mechanical tests . 20 4.4.1 Pulling strength of conductor . 20 4.4.2 Pulling strength of un-plated through hole 21 4.4.3 Pulling strength of plated through hole . 22 4.4.4 Pulling strength of pad of land pattern . 22 4.4.5 Adhesivity of plated foil 23 4.4.6 Adhesivity of solder resist
25、and symbol mark. 24 4.4.7 Hardness of painted film (solder resist and symbol mark) 28 4.5 Environmental tests 29 4.5.1 General . 29 4.5.2 Vapour phase thermal shock . 30 4.5.3 High temperature immersion tests . 30 4.5.4 Resistance to humidity . 31 4.6 Mechanical environmental test Resistance to migr
26、ation . 34 4.6.1 General . 34 4.6.2 Equipment . 34 4.6.3 Specimen 35 4.6.4 Test condition 35 5 Shipping inspection . 36 5.1 General . 36 5.2 Electrical test 37 5.2.1 General . 37 5.2.2 Test of conductor pattern not connected to an embedded component 38 5.2.3 Test on the pattern having a passive comp
27、onent and a conductor pattern . 40 IEC 62878-1-1:2015 IEC 2015 3 5.2.4 Test of a circuit having both active component(s) and a conductor pattern . 43 5.2.5 Test of a circuit having connections of both individual passive component(s) and conductor pattern 46 5.2.6 Test of a circuit having an embedded
28、 component which cannot be checked from the surface and a conductor pattern . 47 5.3 Internal transparent test 47 5.4 Visual test . 47 Annex A (informative) Related test methods 49 Bibliography 52 Figure 1 Measuring items of the micro-sectioned through hole structure 9 Figure 2 Measuring items of th
29、e micro-sectioned device embedded board with build- up structure 9 Figure 3 Measurement of land dimension . 11 Figure 4 Build-up land measurement 12 Figure 5 Conductor resistance measurement . 14 Figure 6 Relationship between current, conductor width and thickness and temperature rise . 17 Figure 7
30、Adhesivity of plated film . 24 Figure 8 Single cutting tool 25 Figure 9 Cutter knife 25 Figure 10 Multiple blade cutter . 26 Figure 11 Equal-distance spacer with guide . 26 Figure 12 Cutting using a single cutting tool or a cutting knife 27 Figure 13 Cross-cut test . 28 Figure 14 Coated film hardnes
31、s test . 29 Figure 15 Temperature and humidity cycles . 33 Figure 16 Device embedded board for shipping inspection . 36 Figure 17 Typical circuit construction of device embedded board . 37 Figure 18 Examples of evaluation levels of electrical test . 39 Figure 19 Circuit construction not connected to
32、 embedded component 39 Figure 20 Circuit construction which is capable of independent check 40 Figure 21 Circuit construction for parallel connection of passive components . 42 Figure 22 Circuit construction for series connection of passive components . 43 Figure 23 Circuit construction of embedded
33、diode 44 Figure 24 Circuit construction of transistor circuit . 44 Figure 25 Circuit construction of a conductor pattern with embedded IC and LSI . 45 Figure 26 Circuit construction composed of a passive component and an active component 46 Figure 27 Circuit construction of embedded components havin
34、g no connection terminal on the surface . 47 Table 1 Test items, characteristics and observations of micro-sectioned specimens . 9 Table 2 Test method for coplanarity around the land pattern 12 Table 3 Characteristics and test methods for conductor resistance 15 4 IEC 62878-1-1:2015 IEC 2015 Table 4
35、 Withstanding current and test methods 16 Table 5 Withstanding voltage and test methods . 18 Table 6 Criteria and test methods for insulation resistance 20 Table 7 Characteristics and test method of pulling strength of conductor . 21 Table 8 Dimensions of land, hole and conductor 22 Table 9 Characte
36、ristics and test methods of pulling strength of plated through hole . 22 Table 10 Specification and test method of pad pulling strength of land pattern . 23 Table 11 High and low temperature characteristics and tests . 30 Table 12 Thermal shock characteristics and test methods 30 Table 13 Thermal sh
37、ock (high temperature immersion test) . 31 Table 14 Measuring environment . 31 Table 15 Thermal shock (high temperature immersion tests) 31 Table 16 Resistance to humidity characteristics and test methods . 34 Table 17 Resistance to migration characteristics and test methods 35 Table 18 Applicable i
38、tems of shipping inspection . 37 Table A.1 Related test methods . 49 IEC 62878-1-1:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DEVICE EMBEDDED SUBSTRATE Part 1-1: Generic specification Test methods FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organiz
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48、8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent ri
49、ghts. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62878-1-1 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1248/FDIS 91/1260/RVD Full information on the voting
