1、 IEC TR 61189-3-914 Edition 1.0 2017-03 TECHNICAL REPORT Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs Guidelines IEC TR 61189-3-914:2017-03
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11、on 1.0 2017-03 TECHNICAL REPORT Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs Guidelines INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.18
12、0 ISBN 978-2-8322-4110-3 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 IEC TR 61189-3-914:2017 IEC 2017 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative reference
13、s 7 3 Terms and definitions 7 4 Test condition 7 4.1 Standard condition 7 4.2 Specified condition 8 5 Pre-condition . 8 6 Heat dissipation characteristics . 8 6.1 General . 8 6.2 Measurement of thermal resistance on the plane 9 6.3 Thermal resistance across the thickness . 12 6.4 Thermal resistance
14、measurement procedures and precautions . 14 6.4.1 General . 14 6.4.2 Die attach 14 6.4.3 Wire bonding . 14 6.4.4 Temperature measuring sensor (calibration) 14 6.4.5 Measurement of thermal resistance on the plane . 14 6.4.6 Thermal resistance across the thickness using cold plate 16 Annex A (informat
15、ive) Classification and class of the PCB . 19 Annex B (informative) Measurement comparison between companies (plane) 22 Figure 1 Example of PCB with large thermal conductivity . 9 Figure 2 Examples of PCBs with large heat transfer coefficients 9 Figure 3 Illustration of thermal resistance test (for
16、information) 10 Figure 4 Layout of the specimen surface for the thermal resistance test 11 Figure 5 Test equipment for thermal resistance across the thickness 12 Figure 6 Example of attachment of the specimen . 15 Figure 7 Example of measurement of the thermal resistance on the plane . 16 Figure 8 U
17、se of the silicone grease 17 Figure 9 Test equipment for thermal resistance across the thickness (running water tank specification) . 17 Figure 10 Test equipment for thermal resistance across the thickness (cold plate) 17 Figure A.1 Example of classification and their application by base materials,
18、PCBs and final products . 20 Figure A.2 The relation between thermal conductive parameter (W/(mK) and heat transfer coefficient parameter (mapping by substrate) . 21 Table 1 Load heat (W) corresponding to range of thermal resistance on the plane (K/W) 12 Table 2 Load heat (W) corresponding to range
19、of thermal resistance to the direction of the thickness (K/W) . 13 IEC TR 61189-3-914:2017 IEC 2017 3 Table A.1 Application and classification . 19 Table A.2 The relation between thermal conductive parameter (W/(mK) and heat transfer coefficient parameter (mapping by zone) 21 4 IEC TR 61189-3-914:20
20、17 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs Guidelines FOREWORD 1) The Internation
21、al Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic
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30、 upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the eleme
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32、 report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC TR 61189-3-914, which is a technical report, has been prepared by IEC technical committee 91: Electronics assembly technology. IEC TR 61189-3
33、-914:2017 IEC 2017 5 The text of this technical report is based on the following documents: Enquiry draft Report on voting 91/1378/DTR 91/1403/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table. This document
34、 has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61189 series, published under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on the IEC website. The committe
35、e has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amende
36、d. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this docum
37、ent using a colour printer. 6 IEC TR 61189-3-914:2017 IEC 2017 INTRODUCTION Development of this technical report has been discussed at TC 91 Plenary meeting in Dongguan, China, October 30, 2015 as per 91/1343A/RM dated on January 22, 2016. This document was developed as a supplementary document to t
38、he IEC 61189-3-913. Therefore, this document has been developed as technical report. This document is given for information only. IEC TR 61189-3-914:2017 IEC 2017 7 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3-914: Test method for t
39、hermal conductivity of printed circuit boards for high-brightness LEDs Guidelines 1 Scope This document specifies the detailed procedures and precautions for IEC 61189-3-913. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content co
40、nstitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 60068-1:2013, E
41、nvironmental testing Part 1: General and guidance IEC 61189-3-913, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs EIA/JEDEC STD 51-2, Inte
42、grated circuits thermal test method Environmental conditions Natural convection (still air) 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 apply, unless otherwise specified. ISO and IEC maintain terminological databases for use in standardizat
43、ion at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 4 Test condition 4.1 Standard condition Unless otherwise specified, tests should all be operated under the following standardized conditions in
44、accordance with the IEC 60068-1:2013, Clause 4: temperature: 15 C to 35 C; relative humidity: 25 % to 75 %; atmospheric pressure: 86 kPa to 106 kPa. 8 IEC TR 61189-3-914:2017 IEC 2017 If there is any doubt concerning the testing results under standardized condition, or upon a request to check the at
45、mospheric condition, the re-examination should be operated under atmosphere in accordance with IEC 60068-1:2013. If the standardized atmosphere is difficult to provide, testing under non-standardized atmosphere is acceptable as long as the atmospheric condition does not affect the testing results. 4
46、.2 Specified condition The specified condition should be in accordance with the condition specified in IEC 60068- 1:2013, Clause 4: temperature: 20 C 2 C; relative humidity: 60 % to 70 %; atmospheric pressure: 86 kPa to 106 kPa. 5 Pre-condition Pre-conditioning should be in accordance with a) or b)
47、below: a) leave the specimen for 24 h in the standard condition; b) leave the specimen for 60 min in a thermostat chamber at 85 C 2 C and then leave the specimen for 24 h 4 h in the standard atmospheric condition. NOTE This test element group (hereafter, referred to as TEG) chip includes a heater wi
48、th a temperature measuring sensor. In this document, the TEG chip indicates a chip with a temperature measuring sensor. 6 Heat dissipation characteristics 6.1 General For the test method for thermal conductivity of a printed circuit board (hereafter referred to as PCB) for high-brightness LEDs, the
49、following factors are considered. The test method is applied to evaluate the relativity of both heat transfer and thermal conductivity of PCBs consist of heterogeneous materials as shown in Figure A.2 in Annex A which describes the heat transfer coefficient parameter as X-axis and thermal conductivity parameter as Y-axis. The IEC 61189-3-913 employs a TEG chip as the heat source to replicate the heat generated by LED chips.
