1、 IEC/TR 62258-3 Edition 2.0 2010-08 TECHNICAL REPORT RAPPORT TECHNIQUE Semiconductor die products Part 3: Recommendations for good practice in handling, packing and storage Produits puces de semi-conducteurs Partie 3: Bonnes pratiques recommandes pour la manipulation, le conditionnement et le stocka
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16、 le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TR 62258-3 Edition 2.0 2010-08 TECHNICAL REPORT RAPPORT TECHNIQUE Semiconductor die products Part 3: Recommendations for good practice in handling, packing and storage Produits puces de sem
17、i-conducteurs Partie 3: Bonnes pratiques recommandes pour la manipulation, le conditionnement et le stockage INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XA ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-88912-138-0 Registered trademark of the International Ele
18、ctrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 TR 62258-3 IEC:2010 CONTENTS FOREWORD.5 INTRODUCTION.7 1 Scope.8 2 Normative references .8 3 Terms and definitions .8 4 Handling Good practice .9 4.1 General .9 4.2 Working environmental controls.9 4.3 General h
19、andling precautions9 4.4 Cleanroom good practice.9 4.4.1 General .9 4.4.2 Attire .10 4.4.3 Conduct.11 4.4.4 Tools .11 4.4.5 Protocol.12 4.4.6 ESD Guidelines .13 5 Process handling issues.13 5.1 Wafer thinning.13 5.2 Singulation or die separation.13 5.2.1 Wafer sawing.14 5.2.2 Wafer scribing .15 5.2.
20、3 Laser Cutting.15 5.2.4 Dice before grind (DBG) 15 5.2.5 Guidelines for mounting wafers16 5.2.6 Use of water for sawing or cutting16 5.2.7 Washing and drying.16 5.3 Die sorting.16 5.3.1 Guidelines for handling frames containing sawn wafers .17 5.3.2 Vacuum .17 5.3.3 Pick-up tools17 5.3.4 Die contac
21、t and removal 17 5.3.5 Removal from wafer film 17 5.3.6 Needle marks 17 5.3.7 Unpassivated die, MEMS, optical and microwave die.19 6 Die and wafer transport and storage media 19 6.1 Wafer carriers and cassettes.20 6.2 In-process carriers and transport systems .20 6.3 Packing for shipment of unsingul
22、ated wafers.21 6.3.1 Standard wafer tubs and jars.21 6.3.2 Specialised wafer tubs.22 6.4 Packing for shipment of singulated wafers.23 6.4.1 Film frames .23 6.4.2 Grip rings/expander rings 24 6.4.3 Holding fixture .25 6.4.4 Vacuum .25 6.4.5 Pick-up tools25 TR 62258-3 IEC:2010 3 6.4.6 Die contact and
23、removal 25 6.5 Packing for shipment of single wafers .26 6.5.1 Carriers .26 6.5.2 Vacuum bags.26 6.6 Packing for shipment of die using trays .26 6.6.1 Waffle packs26 6.6.2 Vacuum release (VR) trays for die products.28 6.6.3 Gel trays for die products 30 6.6.4 Recommendations for die orientation in t
24、rays 30 6.6.5 Corner proctection of sensitive die.30 6.7 Packing for shipment of die using tape-and-reel 30 6.7.1 Embossed tape with cover tape .31 6.7.2 Punched tape with top and bottom cover tape .31 6.7.3 Adhesive-backed punched carrier tape (without cover tape) 31 6.7.4 Cover tape recommendation
25、s 32 6.7.5 Orientation of die in tape-and-reel .32 6.7.6 Tape-and-reel packing structure 32 6.8 Secondary packing for shipment33 6.9 Handling and packing of thinned die or wafers.33 6.10 Packing materials and their reuse33 7 Storage good practice 34 7.1 Die and wafer storage .34 7.2 Short-term stora
26、ge environment and conditions.34 7.3 Storage time limitations.34 7.4 Singulated wafer on wafer frame or ring 35 7.5 Die products in the production area.35 7.6 Die in tape-and-reel.35 7.7 Dry-packed die products35 8 Traceability good practice.35 8.1 General .35 8.2 Wafer traceability 35 8.3 Die produ
27、cts traceability35 8.4 Wafer and die back side marking.36 9 Guidelines for long-term storage (die banking) of bare die and wafers36 9.1 General .36 9.2 Prerequisite for storage.36 9.3 Damage to die products during long-term storage .37 9.3.1 Long-term storage failure mechanisms 37 9.3.2 Mechanical s
28、torage conditions.37 9.4 Long-term storage environment.37 9.5 Recommended inert atmosphere purity .38 9.6 Chemical contamination 38 9.6.1 Vacuum packing 38 9.6.2 Positive pressure systems for packing.39 9.6.3 Use of packing material having sacrificial properties39 9.6.4 Use of bio-degradable materia
29、l39 9.7 Electrical effects39 9.8 Protection from radiation .39 9.9 Periodic qualification of stored die products 39 4 TR 62258-3 IEC:2010 10 Good practice for automated handling during assembly40 10.1 Removal of die from shipping media40 10.1.1 Die supplied on adhesive-backed carrier tape40 10.1.2 D
30、ie supplied in pocketed or punched tape .40 10.1.3 Die especially sensitive to damage and contamination.40 10.1.4 Die or wafer with back side marking 40 10.2 Equipment out of service.40 Annex A (informative) Planning checklist .41 Annex B (informative) Material specifications.49 Bibliography53 Figur
31、e 1 Bevel cut for bare die and flip-chip products.15 Figure 2 Process flow for dice before grind (DBG) .16 Figure 3 Die eject needle.18 Figure 4 Wafer jar structure .22 Figure 5 Specialised wafer tub.23 Figure 6 Film frame24 Figure 7 Grip ring.25 Figure 8 Single waffle pack27 Figure 9 Stacked waffle
32、 packs .28 Figure 10 Vacuum-release trays 29 Figure 11 Corner relief in the cavity of a chip tray 30 Figure 12 Tape-and-reel packing structure.32 Figure 13 Packaging material for shipment 33 Table 1 Example die eject marks .19 Table A.1 Planning checklist 41 TR 62258-3 IEC:2010 5 INTERNATIONAL ELECT
33、ROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 3: Recommendations for good practice in handling, packing and storage FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC Nati
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44、The main task of IEC technical committees is to prepare International Standards. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of t
45、he art“. IEC 62258-3, which is a technical report, has been prepared by IEC technical committee 47: Semiconductor devices. The text of this technical report is based on the following documents: Enquiry draft Report on voting 47/2024A/DTR 47/2058/RVC Full information on the voting for the approval of
46、 this technical report can be found in the report on voting indicated in the above table. 6 TR 62258-3 IEC:2010 This second edition cancels and replaces the first edition published in 2005. This edition constitutes a technical revision. This edition includes the following significant technical chang
47、es with respect to the previous edition. 1. Special requirements have been added throughout the document for optical die, where applicable. For example see 4.3 paragraph 4 and 10.1.3 paragraph 3. 2. The following new subclauses have been added: 4.4.6 ESD Guidelines 5.1 Wafer thinning 3. Subclause 5.
48、2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including: 5.2.2 Wafer scribing 5.2.3 Laser cutting 5.2.4 Dice before grind (DBG) 4. Subclause 5.3.7 (previous edition Subclause
49、 5.2.7) has been changed to include optical and microwave die. 5. In Subclause 6.3, the Subclause 6.3.2 (Specialised wafer tubs) has been added to include wafer tubs specially handle and ship wafers that have not been singulated. 6. Two new subclauses have been to Clause 6: 6.9 Handling and packing of thinned die or wafers 6.10 Packing materials and their reuse 7. A new subclause has been added
